3D IC & Advance Packaging & Testing
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DATE
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TIME
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THEME
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COMPANY
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PLACE
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Sep. 8
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14:00-14:30
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Power IC trends & ATE to Power IC Solution Trends
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CHROMA ATE INC.
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ITC A #2236
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15:00-15:30
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1. Advanced Package Technology
2. Low Cost Package Solution
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Siliconware Precision Industries Co., Ltd. (SPIL)
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Sep. 9
|
11:00-11:30
|
Revolutional Nano-Coating Technology for Probe Card and pogo pin
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Siliconware Precision Industries Co., Ltd. (SPIL)
|
ITC A #2236
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14:00-14:30
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Revolutional Nano-Coating Technology for probe card and pogo pin
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ABON-TECH INTERNATIONAL CORP.
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ITC B #110
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Sep. 10
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10:30-11:00
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Glass Wafer Technology for Integrated Circuit Manufacturing
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Corning Incorporated
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ITC A #2236
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14:00-14:30
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3D IC Process and Second Hand Equipment with New Technology
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Stepper Technology Ltd.
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AOI
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DATE
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TIME
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THEME
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COMPANY
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PLACE
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Sep. 9
|
14:30-15:00
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Application of Mechatronics Design Principles Enables Nanometer Level Precision
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AEROTECH INC
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ITC B #110
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15:30-16:00
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Interfaces & USB3.0
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APO Star Co., LTD.
|
ITC B #110
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CMP
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DATE
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TIME
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THEME
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COMPANY
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PLACE
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Sep. 8
|
11:30-12:00
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CMP: Traditional and Non-traditional Applications
|
Strasbaugh
|
ITC B #110
|
Sep. 10
|
10:30-11:00
|
Integrated Consumable Solutions for Advanced Back-End-of-Line CMP Processes
|
Cabot Microelectronics Corp.
|
ITC B #110
|
11:00-11:30
|
3D Arranging Diamond CMP Pad Conditioners: A key Element for Low Cost CMP
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SUN SHIN PRECISION TECHNOLOGY CORP.
|
14:00-14:30
|
Diamond Pad Conditioners and Its Impact on CMP Processes
|
Entegris
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↑TOP
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Compound Semiconductor
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DATE
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TIME
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THEME
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COMPANY
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PLACE
|
Sep. 8
|
14:00-14:30
|
The Role of GaAs Foundry and Market Analysis
|
Win Semiconductor Corp.
|
ITC B #110
|
15:30-16:00
|
SOKUDO Improves Process Yield with Various Coat, Develop and Cleaning Technologies for Many Substrate Types
|
SUKUDO CO., LTD.
|
ITC A #2236
|
Sep. 9
|
15:00-15:30
|
GaAs Application in High Frequency Communication Market
|
WIN Semiconductor Corp.
|
ITC B #110
|
16:00-16:30
|
Etch and CVD Process Technologies for GaAs Applications
|
SPP Process Technology System Ltd.
|
ITC A #2236
|
Sep. 10
|
14:30-15:00
|
BiHEMT Epi Wafer: The Approach of Increasing Intergration Level for Compound Semiconductor
|
Visual Photonics Epitaxy Co., Ltd.
|
ITC A #2236
|
↑TOP
|
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|
Green Management
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DATE
|
TIME
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THEME
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COMPANY
|
PLACE
|
Sep. 8
|
11:00-11:30
|
S23 Application for Facilities and Equipments
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Safety and Health Technology Center
|
ITC B #110
|
13:00-13:30
|
Green Factory at UMC
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United Microelectronics Corporation (UMC)
|
13:30-14:00
|
Friendly Green Environmental Technology
|
Green Energy and Resource Technique Co., Ltd.
|
15:00-15:30
|
Regenerative Treatment Technology for Simultaneous Removal of Submicron Aerosol and Acid Gas
|
JG Environmental Technology Co., Ltd
|
Sep. 9
|
11:00-11:30
|
DAS Abatement Solution and Product Technology
|
DAS Asia Limited Taiwan Branch
|
ITC B #110
|
Sep. 10
|
13:00-13:30
|
The Practice and Future Trend of Semiconductor Equipments in Energy Saving and Carbon Reduction
|
MACRONIX INTERNATIONAL Co., Ltd.
|
ITC B #110
|
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LED
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DATE
|
TIME
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THEME
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COMPANY
|
PLACE
|
Sep. 8
|
11:30-12:00
|
Optical Profiler for Patterned Sapphire Substrate (PSS) Metrology
|
VEECO TAIWAN INC.
|
ITC A #2236
|
16:00-16:30
|
How HBLED Test Can Reduce Manufacturing Costs
|
OP-TEST
|
ITC B #110
|
Sep. 9
|
13:30-14:00
|
Alternative Processes to Improve Manufacturing Efficiency and LED Light Extraction
|
Brewer Science Inc.
|
ITC A #2236
|
16:00-16:30
|
Advanced Automation for LED equipment
|
BROOKS AUTOMATION, INC.
|
ITC B #110
|
Sep. 10
|
11:30-12:00
|
PSS Turn Key Solution
|
C SUN MFG. LTD
|
ITC A #2236
|
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MEMS
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DATE
|
TIME
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THEME
|
COMPANY
|
PLACE
|
Sep. 8
|
10:30-11:00
|
MEMS Design Flow and MEMS-ASIC Integration Schemes in IntelliSuite
|
Avant Technology Inc.
|
ITC A #2236
|
13:30-14:00
|
Non-Destructive CD, Depth and Profile, Measurement in 2D or 3D Structures for Power Device and MEMS Applications
|
Howteh Technology Co., Ltd.
|
14:30-15:00
|
Advanced Vapour Phase Processing - Maximising Yield in MEMS Manufacturing
|
WESi Technology Ltd.
|
Sep. 9
|
10:30-11:00
|
MEMS Motion Sensor Firing Up Application Revolution
|
Domintech. Co., Ltd.
|
ITC A #2236
|
11:30-12:00
|
Liquid Mold Compound (LMC) Development for e-WLB & TSV Process
|
Nagase (Taiwan) Co., Ltd.
|
ITC A #2236
|
14:00-14:30
|
Latest Developments in 3DIC Manufacturing Including Temporary Bonding, Debonding and Advanced Chip to Wafer (AC2W) Stacking Processes.
|
EVG-JOINTECH CORP.
|
ITC B #110
|
14:30-15:00
|
Ultra Thin Molecular Vapor Deposited (MVD) Coatings for Semiconductor and MEMS Application
|
Applied Microstructures, Inc.
|
ITC A #2236
|
15:00-15:30
|
True 3D Microstructuring by Direct Laser Writing
|
Nano Precision Corp.
|
ITC A #2236
|
Sep. 10
|
13:30-14:00
|
Brining MEMS to the Mainstream: Linking MEMS and IC Design Flows
|
Alpha Precision Instrumentation Corp.
|
ITC A #2236
|
↑TOP
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|
Secondary Market
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DATE
|
TIME
|
THEME
|
COMPANY
|
PLACE
|
Sep. 8
|
14:30-15:00
|
Leveraging Available Cores To Bring Value in the Marketplace
|
NOVELLUS
|
ITC B #110
|
Sep. 9
|
10:30-11:00
|
SEM Used Equipment Deal
|
Semiconductor Equipment Manufacturing, Inc.
|
ITC B #110
|
12:00-13:30
|
Added Value of Equipment Refurbishment by the OEM/Minimizing Etch Equipment Life Cycle Cost by Designing for Upgradeability/Bring Value to the Mature Markets
|
ASML/Lam Research Corporation/KLA Tencor
|
13:30-14:00
|
Semiconductor Equipment Financing and Leasing Options; When to Buy, Lease, Rent or Outsource?
|
Equvo Pte Ltd. Taiwan Branch
|
Sep. 10
|
14:30-15:00
|
The Trends of Secondary Equipment Prices
|
SurplusGLOBAL, Inc.
|
ITC B #110
|
↑TOP
|
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|
Others
|
DATE
|
TIME
|
THEME
|
COMPANY
|
PLACE
|
Sep. 8
|
11:00-11:30
|
Optical Metrology Application in Sapphire Wafer
|
JC‘S CHUNSON LIMITED
|
ITC A #2236
|
15:30-16:00
|
Innovative Technology for Overlaying Semiconductor Images
|
Mirero Inc.
|
ITC B #110
|
16:00-16:30
|
Considerations of X-ray Inspection When Introducing Cu Materials Within Semiconductor Manufacture
|
NIKON CORPORATION
|
ITC A #2236
|
Sep. 9
|
12:00-13:00
|
Development and Application of High Precision
|
Zhengzhou Research Institute for Abrasives & Grinding
|
ITC A #2236
|
12:00-13:00
|
Introduction of Dicing Saw Machine
|
SHENYANG ACADEMY OF INSTRUMENTATION SCIENCE
|
12:00-13:00
|
|
GRIKIN Advanced Materials Co., Ltd.
|
Sep. 10
|
11:00-11:30
|
Electrostatic Chucks, Heater and Alternative Clamping Methods Compatible for TSV (Thorough Silicon Via) and Next-generationprocesses and Related Technology in Achieving Low Particle, High Temperature Uniformity and Clamping Substrates of 450mm
|
Creative Technology
|
ITC A #2236
|
↑TOP
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