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時間
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公司名稱
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主題
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費用
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2008年9月09日 星期二
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15:30-16:00
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Rohm and Haas Electronic Material Taiwan Ltd.
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InterviaTM Photodielectric A Low Temperature Curable, High Performance Alternative, For RDL Bump, FoP, Wafer Bonding and TSV Isolation Fill Applications
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Free
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2008年9月10日 星期三
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10:30-11:00
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ATMI
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Free
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11:10-11:40
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Fujikin
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Fluctuation Free Technology
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Free
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13:30-14:00
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Niching Industrial Corp. /利機企業股份有限公司
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Waste SF6 recycling technology
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Free
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14:30-15:00
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Linde Electronics (BOC LH)
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Introducing Flex-F : on-site F2 for Sustainable Chamber Cleaning
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Free
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15:00-15:30
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Tanaka Kikinzoku International K.K
Cookson Electronics
Ltd-Enthone
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A Novel High Speed Cu Pillar Plating Process.
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Free
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16:00-16:30
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Solvay Taiwan Co., Ltd. /台灣蘇威(股)公司
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The Green Materials of Fluoro-polymer for Solutions in Semiconductor
- HFPE fluids in HT & Vapors application.
- Perfluoroelastomer
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Free
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2008年9月11日 星期四
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11:10-11:40
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ATMI
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Free
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14:30-15:00
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Sunway Scientific Corporation
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Airborne Molecular Contamination Real Time Monitoring
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Free
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