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CTO Forum
Wednesday, September 10th, 2008
08:30 –17:35
Room 201ABC, 2F, Taipei International Convention Center, Taipei
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Theme: Emerging Technology of SiP - TSV (Thru Silicon Via) Enabling Next Generation ICs
Forum Chairmen:
Morning Session: Mr. Karl Stuber, Senior Director, Test, Assembly & Packaging, SEMI
Afternoon Session: Mr. Rutgers Chow, Member of SEMI Taiwan IC Committee / Managing Director& VP, Asia Operations, AVIZA
Moderator: Dr. William T. Chen, IEEE Fellow President, IEEE CPMT Society
Program Co-Chairmen:
1. Dr. Shen-Li Fu, Vice Chairman of SEMI Taiwan PKG&TEST Committee / President, I-Shou University
2. Mr. Robbins Yeh, Member of SEMI Taiwan IC Committee / Managing Director, Greater China Region, Synopsys
Agenda:
08:30 – 09:00
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Registration
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09:00 – 09:40
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Opening Speech - TSV Overview
Dr. Ho-Ming Tong, Chairman of SEMI Taiwan PKG&TEST Committee / SiP Subcommittee Co-Chairman of GSA / GM & Chief R&D Officer, ASE Group
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09:40 –10:20
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3D Packaging: A View from ITRS
Dr. William T. Chen, IEEE Fellow President, IEEE CPMT Society
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10:20 –10:40
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Break Time
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10:40 –11:20
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TSV Market Overview
Mr. Jim Walker, Research Vice President, Gartner
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11:20 –12:00
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TSV Technology Overview
Dr. Eric Beyne, Programs Director, IMEC
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12:00 –13:30
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Break Time
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13:30 –13:35
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Welcome Remarks
Mr. An-Yeu Wu, General Director, Semiconductor Industry Promotion Office, IDB, MOEA
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13:35 –14:15
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3D IC Technologies: Business Option or Market Requirement?
Mr. Tom Gregorich, Vice President, Qualcomm
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14:15 –14:55
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Equipment and Integration Challenges
Mr. Kevin Crofton, VP & GM, PVD, CVD & Etch Product Groups, AVIZA
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14:55 –15:15
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Break Time
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15:15 –15:55
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TSV - EDA Challenges and Solutions
Dr. Charles Chiang, SNPS Scientist, Synopsys
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15:55 –16:35
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Test of TSV-Based 3D-IC
Mr. Wilhelm Radermacher, Senior Director, Mixed Signal & RF Solutions, Semiconductor Test, Verigy
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16:35 –17:35
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Panel Discussion - Supply Chain, Collaboration & Standardization
Moderator: Dr. William T. Chen, IEEE Fellow President, IEEE CPMT Society
Panelists: 1. Mr. Jim Walker, Research Vice President, Gartner
2. Dr. Eric Beyne, Programs Director, IMEC
3. Mr. Tom Gregorich, Vice President, Qualcomm
4. Mr. Kevin Crofton, VP & GM, PVD, CVD & Etch Product Groups, AVIZA
5. Dr. Charles Chiang, SNPS Scientist, Synopsys
6. Mr. Wilhelm Radermacher, Senior Director, Verigy
7. Mr. David Chen, Engineering Group Director, ICD R&D, Cadence Design Systems
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17:35
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Adjournment
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