Semiconductor Equipment and Materials International (SEMI®), representing more than 2,000 member companies, is the industry association serving the global semiconductor equipment and materials, flat panel display and other related industries. SEMI-Taiwan Office is soliciting papers from authors around the world for the SEMICON® Taiwan 2008 technical symposium in conjunction with the largest exhibition for the semiconductor industry in Taiwan.

The SEMICON Taiwan 2008 technical symposium will provide a forum for the presentation and discussion on important technical work for both the manufactures and suppliers.

Prospective authors are requested to submit an abstract of 250-500 words and up to 100-word biography by April 24, 2008. The abstract must clearly describe the nature, scope, content, organization, key points and signification of the proposed paper. Submission of an abstract represents a commitment to submit a cleared manuscript to SEMI by July 21, 2008.

Indicate for which category the paper is being submitted. All abstracts must appear on company letterhead, which should include complete address, telephone, and fax number and e-mail address.

Presentations are to be original, non-commercial in that they focus on the technical merits of a process rather than on the individual company’s product benefits. Selected speakers will be notified no later than June 15, 2008.

Electronic manuscripts are expected to be three to ten pages including diagrams, figures, and photographs. Materials are to be submitted via e-mail in the technical proceedings required by the deadline of July 21, 2008. English Oral Presentation materials are required by August 11, 2008.

Accepted papers are subject to co-copywriter with SEMI, who reserves the right to republish, re-sell, and display submitted material in whole or in part. Authors will be required to sign an agreement promising to meet the publication deadline and give the presentation.

Please submit abstracts and biographies to SEMI Taiwan office using the following file names:

(e-mail submission and communication is preferred.)

File name format example:
(Replace “YourName” with your name; replace “DateOfSubmission” with date of submission in the form of mm/dd/yy)
Abs_ST04_SessionNumber_YourName_DateOfSubmission.doc
Bio_ST04_SessionNumber_DateOfSubmission.doc

Please complete and attach this cover sheet (PDF) to your abstract and biography. Indicate the contact person. Only one confirmation letter will be sent. Submit by April 24, 2008 to the SEMI Taiwan contact listed above.

Submit the above to:

Josefina Chung (鍾于秋)
SEMI Taiwan
3F, 49-2, Lane 2
Kuang-Fu Road, Sec. 2, Hsiuchu 300, Taiwan
Tel. 886.3.573.3399 Ext. 210
Fax: 886.3.573.3355
E-mail: jchung@semi.org

Industry Challenges 1. 32nm and below Production Manufacturing 2. Advanced Packaging & testing technology 3. Productivities & Industry Standards 4. New Process & Roadmap 5. Advanced lithography technologies 6. Sub-Nanometer Metrology & Defect Detection 7. Yield enhancement 8. Advanced process control

New Devices & New Applications 9. New Memory Devices & Technologies 10. Manufacturing Challenges of New Device Structures Current Hot Topics 11. Photovoltaic, MEMS, Nano-scale Precision Machining, Biochemical Sensor, and Image Sensor, 12. Environmental, Health & Safety New and Misc.

Session I: Device Manufacturing Technology Memory Devices (DRAM, SRAM, Flash) Sub-100mm Logic integration Advanced transistor Design Embedded SOC Technology Device Reliability Session II: Process Technology II-A: Photolithography Immersion Lithography EUV (technology & resist development) Phase Shift Mask Techniques E-beam/X-ray Advanced Photomask Technology Optical Proximity Effect Correction Resolution Enhance Technologies (RET) II-B: Etching High Density Plasma Etching Etch/Ash Damage Studies High Selectivity & High Aspect Ratio Etching Techniques Equipment Process Technology II-C: Diffusion / Ion Implantation Well Engineering Strain engineering Ultra Shallow Junction Thin Gate Dielectric Metal Gate/Hi-K RTP/Flash /Laser Technologies II-D: Cleaning Wet Cleaning Technology Dry Cleaning Technology Novel Technology Post CMP Cleaning II-E: Interconnection Technology Planarization Technology & Equipment (CMP) Low-K Deposition Contact/Via Fill Technology & ECMP Damascene Etch High-K Materials

II-E: Interconnection Technology (cont’d) Cu Plating Technology Barrier/Seed Technology (PVD/ALD) Advanced Damascene Scheme Adv. Integration Technology – ALD & CVD II-F: Process Integration & Yield Enhancement Process Integration effects on Yields Material Characterization & Yield Analysis Techniques Particle and Defect Control Session III: 300mm Manufacturing Technology Computer Integrated Manufacturing Wafer Start and WIP Management Strategies Process Integration 300mm Wafer Equipment & Materials Fab Design and Cost Analysis Factory Automation for 300mm APC/AEC technology and implementation Session IV: Packaging & Testing Market Trends & Forecast Economics and Cost Analysis Technology Roadmaps Volume Manufacturing Issues Production Cycle-Time Management Process Automation and Control Equipment Materials Fine Line Substrates Chip Scale Packaging Flip Chip LOC L/F Taping Technology Multi-Chip Module Direct Chip Attachment Chip-On-Board/Flex/Glass Thin Film Passive Component Known-Good-Die Bumping Technology Thermal Management Reliability Repair and Rework Wafer Level Packaging

Other Topics: Compound Semiconductor / Automatic Optical Inspection (AOI) / Nano-technology & MEMS

Please complete and attach this cover sheet (PDF) to your abstract and biography. Indicate the contact person. Only one confirmation letter will be sent. Submit by April 24, 2008 to the SEMI Taiwan contact listed above.