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We will feature more than 50 programs. 5 sessions of SEMI Business & Technology Symposium and FREE technical presentations at the Innovation Technology Center on the show floor.

Schedule and events subject to change

Special Events

Green Management

Keynotes/Executive Events

LED

3D IC & Advance Packaging & Testing

MEMS

AOI

Secondary Market

CMP

Other Advanced Technology

Compound Semiconductor

 
   

Special Events

Press Conference

Sep.6

14:00-15:30

The Residence, 2F,
Grand Hyatt Taipei

Opening Ceremony

Sep.8

09:00-09:50

Room 201, 2F,
Taipei International Convention Center

2010 Leadership Gala Dinner

Sep.8

18:30-21:00

Ballroom I,
Grand Hyatt Taipei

SEMICON Taiwan 2010 Golf Tournament

Sep.11

06:00-14:00

Sunrise Golf & Country Club
at Taoyuan

TOP↑

 

Keynotes/Executive Events

Market Briefing

Semiconductor
Market Outlook

Sep.8

08:30-12:10

R201DEF, 2F,
TICC

 

IC Executive Forum

Technology Advancement
through Innovative Collaboration

Sep.8

13:00-17:00

R201DEF, 2F,
TICC

TOP↑

             

3D IC & Advance Packaging & Testing

3D IC Technology Forum

The Coming-of-age of 2.5D & 3D ICs

Sep.9

08:30-17:00

R201ABC, 2F,
TICC

CHROMA ATE INC.

Power IC trends & ATE to Power IC Solution Trends

Sep.8

14:00-14:30

Booth
#2236

Siliconware Precision Industries Co., Ltd. (SPIL)

1. Advanced Package Technology
2. Low Cost Package Solution

Sep.8

15:00-15:30

Booth
#2236

ABON-TECH INTERNATIONAL CORP.

Revolutional Nano-Coating Technology for Probe Card and pogo pin

Sep.9

14:00-14:30

Booth
#2236

Corning Incorporated

Glass Wafer Technology for Integrated Circuit Manufacturing

Sep.10

10:30-11:00

Booth
#2236

Stepper Technology Ltd.

3D IC Process and Second Hand Equipment with New Technology

Sep.10

14:00-14:30

Booth
#2236

TOP↑

 

 

       

AOI

AEROTECH INC

Application of Mechatronics Design Principles Enables Nanometer Level Precision

Sep.9

14:30-15:00

Booth
#110

APO Star Co., LTD.

Interfaces & USB3.0

Sep.9

15:30-16:00

Booth
#110

TOP↑

           

CMP

CMP Forum 2010 Taiwan

To Explore Customized Frontier CMP through tight link with end-users

Sep.10

08:20-12:00

Room 105, 1F,
TICC

Strasbaugh

CMP: Traditional and Non-traditional Applications

Sep.8

11:30-12:00

Booth
#110

Cabot Microelectronics Corp.

Integrated Consumable Solutions for Advanced Back-End-of-Line CMP Processes

Sep.10

10:30-11:00

Booth
#110

SUN SHIN PRECISION TECHNOLOGY CORP.

3D Arranging Diamond CMP Pad Conditioners: A key Element for Low Cost CMP

Sep.10

11:00-11:30

Booth
#110

Entegris

Diamond Pad Conditioners and Its Impact on CMP Processes

Sep.10

14:00-14:30

Booth
#110

TOP↑

           

Compound Semiconductor

Win Semiconductor Corp.

The Role of GaAs Foundry and Market Analysis

Sep.8

14:00-14:30

Booth
#110

SUKUDO CO., LTD.

SOKUDO Improves Process Yield with Various Coat, Develop and Cleaning Technologies for Many Substrate Types

Sep.8

15:30-16:00

Booth
#2236

WIN Semiconductor Corp.

GaAs Application in High Frequency Communication Market

Sep.9

15:00-15:30

Booth
#110

SPP Process Technology System Ltd.

Etch and CVD Process Technologies for GaAs Applications

Sep.9

16:00-16:30

Booth
#2236

Visual Photonics Epitaxy Co., Ltd.

BiHEMT Epi Wafer: The Approach of Increasing Intergration Level for Compound Semiconductor

Sep.10

14:30-15:00

Booth
#2236

TOP↑

 

Green Management

Safety and Health Technology Center

S23 Application for Facilities and Equipments

Sep.8

11:00-11:30

Booth
#110

United Microelectronics Corporation (UMC)

Green Factory at UMC

Sep.8

13:00-13:30

Booth
#110

Green Energy and Resource Technique Co., Ltd.

Friendly Green Environmental Technology

Sep.8

13:30-14:00

Booth
#110

JG Environmental Technology Co., Ltd

Regenerative Treatment Technology for Simultaneous Removal of Submicron Aerosol and Acid Gas

Sep.8

15:00-15:30

Booth
#110

DAS Asia Limited Taiwan Branch

DAS Abatement Solution and Product Technology

Sep.9

11:00-11:30

Booth
#110

MACRONIX INTERNATIONAL Co., Ltd.

The Practice and Future Trend of Semiconductor Equipments in Energy Saving and Carbon Reduction

Sep.10

13:00-13:30

Booth
#110

TOP↑

           

LED

VEECO TAIWAN INC.

Optical Profiler for Patterned Sapphire Substrate (PSS) Metrology

Sep.8

11:30-12:00

Booth
#2236

OP-TEST

How HBLED Test Can Reduce Manufacturing Costs

Sep.8

16:00-16:30

Booth
#110

Brewer Science Inc.

Alternative Processes to Improve Manufacturing Efficiency and LED Light Extraction

Sep.9

13:30-14:00

Booth
#2236

BROOKS AUTOMATION, INC.

Advanced Automation for LED equipment

Sep.9

16:00-16:30

Booth
#110

C SUN MFG. LTD

PSS Turn Key Solution

Sep.10

11:30-12:00

Booth
#2236

TOP↑

           

MEMS

MEMS Forum

How to Enhance MEMS
Eco-system’s Global
Competitiveness

Sep.9

08:30-17:00

R201DEF, 2F,
TICC

University MEMS Research

Bio MEMS
CMOS MEMS
Optical MEMS
Process/Packaging/Testing
Physical Transducers

Sep.8-10

08:30-17:00

Booth
#3002

Avant Technology Inc.

MEMS Design Flow and MEMS-ASIC Integration Schemes in IntelliSuite

Sep.8

10:30-11:00

Booth
#2236

Howteh Technology Co., Ltd.

Non-Destructive CD, Depth and Profile, Measurement in 2D or 3D Structures for Power Device and MEMS Applications

Sep.8

13:30-14:00

Booth
#2236

WESi Technology Ltd.

Advanced Vapour Phase Processing - Maximising Yield in MEMS Manufacturing

Sep.8

14:30-15:00

Booth
#2236

Domintech. Co., Ltd.

MEMS Motion Sensor Firing Up Application Revolution

Sep.9

10:30-11:00

Booth
#2236

Nagase (Taiwan) Co., Ltd.

Liquid Mold Compound (LMC) Development for e-WLB & TSV Process

Sep.9

11:30-12:00

Booth
#2236

EVG-JOINTECH CORP.

Latest Developments in 3DIC Manufacturing Including Temporary Bonding, Debonding and Advanced Chip to Wafer (AC2W) Stacking Processes.

Sep.9

14:00-14:30

Booth
#110

Applied Microstructures, Inc.

Ultra Thin Molecular Vapor Deposited (MVD) Coatings for Semiconductor and MEMS Application

Sep.9

14:30-15:00

Booth
#2236

Nano Precision Corp.

True 3D Microstructuring by Direct Laser Writing

Sep.9

15:00-15:30

Booth
#2236

Alpha Precision Instrumentation Corp.

Bringing MEMS to the Mainstream: Linking MEMS and IC Design Flows with Coventor

Sep.10

13:30-14:00

Booth
#2236

TOP↑

           

Secondary Market

NOVELLUS

Leveraging Available Cores To Bring Value in the Marketplace

Sep.8

14:30-15:00

Booth
#110

Semiconductor Equipment Manufacturing, Inc.

SEM Used Equipment Deal

Sep.9

10:30-11:00

Booth
#110

ASML/Lam Research Corporation/KLA Tencor

Added Value of Equipment Refurbishment by the OEM/Minimizing Etch Equipment Life Cycle Cost by Designing for Upgradeability/Bring Value to the Mature Markets

Sep.9

12:00-13:30

Booth
#110

Equvo Pte Ltd. Taiwan Branch

Semiconductor Equipment Financing and Leasing Options; When to Buy, Lease, Rent or Outsource?

Sep.9

13:30-14:00

Booth
#110

SurplusGLOBAL, Inc.

The Trends of Secondary Equipment Prices

Sep.10

14:30-15:00

Booth
#110

TOP↑

           

Other Advanced Technology

ATMI

High Productivity Development ~ Driving Process Efficiency

Sep.8

10:30-11:00

Booth
#110

JC‘S CHUNSON LIMITED

Optical Metrology Application in Sapphire Wafer

Sep.8

11:00-11:30

Booth
#2236

Mirero Inc.

Innovative Technology for Overlaying Semiconductor Images

Sep.8

15:30-16:00

Booth
#110

NIKON CORPORATION

Considerations of X-ray Inspection When Introducing Cu Materials Within Semiconductor Manufacture

Sep.8

16:00-16:30

Booth
#2236

Zhengzhou Research Institute for Abrasives & Grinding

Development and Application of High Precision Superabrasive Tools for Semiconductor Industry

Sep.9

12:00-13:00

Booth
#2236

SHENYANG ACADEMY OF INSTRUMENTATION SCIENCE

Introduction of Dicing Saw Machine

Sep.9

12:00-13:00

Booth
#2236

GRIKIN Advanced Materials Co., Ltd.

Sputtering Targets for Semiconductor Application

Sep.9

12:00-13:00

Booth
#2236

Creative Technology

Electrostatic Chucks, Heater and Alternative Clamping Methods Compatible for TSV (Thorough Silicon Via) and Next-generationprocesses and Related Technology in Achieving Low Particle, High Temperature Uniformity and Clamping Substrates of 450mm

Sep.10

11:00-11:30

Booth
#2236

TOP↑

 
    

 
 
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