We will feature more than 50 programs. 5 sessions of SEMI Business & Technology Symposium and FREE technical presentations at the Innovation Technology Center on the show floor.

Schedule and events subject to change

● Special Events	● Green Management
● Keynotes/Executive Events	● LED
● 3D IC & Advance Packaging & Testing	● MEMS
● AOI	● Secondary Market
● CMP	● Other Advanced Technology
● Compound Semiconductor

Special Events

Press Conference	Sep.6	14:00-15:30	The Residence, 2F, Grand Hyatt Taipei
Opening Ceremony	Sep.8	09:00-09:50	Room 201, 2F, Taipei International Convention Center
2010 Leadership Gala Dinner	Sep.8	18:30-21:00	Ballroom I, Grand Hyatt Taipei
SEMICON Taiwan 2010 Golf Tournament	Sep.11	06:00-14:00	Sunrise Golf & Country Club at Taoyuan
TOP↑

Keynotes/Executive Events

Market Briefing	Semiconductor Market Outlook	Sep.8	08:30-12:10	R201DEF, 2F, TICC
IC Executive Forum	Technology Advancement through Innovative Collaboration	Sep.8	13:00-17:00	R201DEF, 2F, TICC
TOP↑

3D IC & Advance Packaging & Testing

3D IC Technology Forum	The Coming-of-age of 2.5D & 3D ICs	Sep.9	08:30-17:00	R201ABC, 2F, TICC
CHROMA ATE INC.	Power IC trends & ATE to Power IC Solution Trends	Sep.8	14:00-14:30	Booth #2236
Siliconware Precision Industries Co., Ltd. (SPIL)	1. Advanced Package Technology 2. Low Cost Package Solution	Sep.8	15:00-15:30	Booth #2236
ABON-TECH INTERNATIONAL CORP.	Revolutional Nano-Coating Technology for Probe Card and pogo pin	Sep.9	14:00-14:30	Booth #2236
Corning Incorporated	Glass Wafer Technology for Integrated Circuit Manufacturing	Sep.10	10:30-11:00	Booth #2236
Stepper Technology Ltd.	3D IC Process and Second Hand Equipment with New Technology	Sep.10	14:00-14:30	Booth #2236
TOP↑

AOI

AEROTECH INC	Application of Mechatronics Design Principles Enables Nanometer Level Precision	Sep.9	14:30-15:00	Booth #110
APO Star Co., LTD.	Interfaces & USB3.0	Sep.9	15:30-16:00	Booth #110
TOP↑

CMP

CMP Forum 2010 Taiwan	To Explore Customized Frontier CMP through tight link with end-users	Sep.10	08:20-12:00	Room 105, 1F, TICC
Strasbaugh	CMP: Traditional and Non-traditional Applications	Sep.8	11:30-12:00	Booth #110
Cabot Microelectronics Corp.	Integrated Consumable Solutions for Advanced Back-End-of-Line CMP Processes	Sep.10	10:30-11:00	Booth #110
SUN SHIN PRECISION TECHNOLOGY CORP.	3D Arranging Diamond CMP Pad Conditioners: A key Element for Low Cost CMP	Sep.10	11:00-11:30	Booth #110
Entegris	Diamond Pad Conditioners and Its Impact on CMP Processes	Sep.10	14:00-14:30	Booth #110
TOP↑

Compound Semiconductor

Win Semiconductor Corp.	The Role of GaAs Foundry and Market Analysis	Sep.8	14:00-14:30	Booth #110
SUKUDO CO., LTD.	SOKUDO Improves Process Yield with Various Coat, Develop and Cleaning Technologies for Many Substrate Types	Sep.8	15:30-16:00	Booth #2236
WIN Semiconductor Corp.	GaAs Application in High Frequency Communication Market	Sep.9	15:00-15:30	Booth #110
SPP Process Technology System Ltd.	Etch and CVD Process Technologies for GaAs Applications	Sep.9	16:00-16:30	Booth #2236
Visual Photonics Epitaxy Co., Ltd.	BiHEMT Epi Wafer: The Approach of Increasing Intergration Level for Compound Semiconductor	Sep.10	14:30-15:00	Booth #2236
TOP↑

Green Management

Safety and Health Technology Center	S23 Application for Facilities and Equipments	Sep.8	11:00-11:30	Booth #110
United Microelectronics Corporation (UMC)	Green Factory at UMC	Sep.8	13:00-13:30	Booth #110
Green Energy and Resource Technique Co., Ltd.	Friendly Green Environmental Technology	Sep.8	13:30-14:00	Booth #110
JG Environmental Technology Co., Ltd	Regenerative Treatment Technology for Simultaneous Removal of Submicron Aerosol and Acid Gas	Sep.8	15:00-15:30	Booth #110
DAS Asia Limited Taiwan Branch	DAS Abatement Solution and Product Technology	Sep.9	11:00-11:30	Booth #110
MACRONIX INTERNATIONAL Co., Ltd.	The Practice and Future Trend of Semiconductor Equipments in Energy Saving and Carbon Reduction	Sep.10	13:00-13:30	Booth #110
TOP↑

LED

VEECO TAIWAN INC.	Optical Profiler for Patterned Sapphire Substrate (PSS) Metrology	Sep.8	11:30-12:00	Booth #2236
OP-TEST	How HBLED Test Can Reduce Manufacturing Costs	Sep.8	16:00-16:30	Booth #110
Brewer Science Inc.	Alternative Processes to Improve Manufacturing Efficiency and LED Light Extraction	Sep.9	13:30-14:00	Booth #2236
BROOKS AUTOMATION, INC.	Advanced Automation for LED equipment	Sep.9	16:00-16:30	Booth #110
C SUN MFG. LTD	PSS Turn Key Solution	Sep.10	11:30-12:00	Booth #2236
TOP↑

MEMS

MEMS Forum		How to Enhance MEMS Eco-system’s Global Competitiveness	Sep.9	08:30-17:00	R201DEF, 2F, TICC
University MEMS Research	● Bio MEMS ● CMOS MEMS ● Optical MEMS ● Process/Packaging/Testing ● Physical Transducers		Sep.8-10	08:30-17:00	Booth #3002
Avant Technology Inc.		MEMS Design Flow and MEMS-ASIC Integration Schemes in IntelliSuite	Sep.8	10:30-11:00	Booth #2236
Howteh Technology Co., Ltd.		Non-Destructive CD, Depth and Profile, Measurement in 2D or 3D Structures for Power Device and MEMS Applications	Sep.8	13:30-14:00	Booth #2236
WESi Technology Ltd.		Advanced Vapour Phase Processing - Maximising Yield in MEMS Manufacturing	Sep.8	14:30-15:00	Booth #2236
Domintech. Co., Ltd.		MEMS Motion Sensor Firing Up Application Revolution	Sep.9	10:30-11:00	Booth #2236
Nagase (Taiwan) Co., Ltd.		Liquid Mold Compound (LMC) Development for e-WLB & TSV Process	Sep.9	11:30-12:00	Booth #2236
EVG-JOINTECH CORP.		Latest Developments in 3DIC Manufacturing Including Temporary Bonding, Debonding and Advanced Chip to Wafer (AC2W) Stacking Processes.	Sep.9	14:00-14:30	Booth #110
Applied Microstructures, Inc.		Ultra Thin Molecular Vapor Deposited (MVD) Coatings for Semiconductor and MEMS Application	Sep.9	14:30-15:00	Booth #2236
Nano Precision Corp.		True 3D Microstructuring by Direct Laser Writing	Sep.9	15:00-15:30	Booth #2236
Alpha Precision Instrumentation Corp.		Bringing MEMS to the Mainstream: Linking MEMS and IC Design Flows with Coventor	Sep.10	13:30-14:00	Booth #2236
TOP↑

Secondary Market

NOVELLUS	Leveraging Available Cores To Bring Value in the Marketplace	Sep.8	14:30-15:00	Booth #110
Semiconductor Equipment Manufacturing, Inc.	SEM Used Equipment Deal	Sep.9	10:30-11:00	Booth #110
ASML/Lam Research Corporation/KLA Tencor	Added Value of Equipment Refurbishment by the OEM/Minimizing Etch Equipment Life Cycle Cost by Designing for Upgradeability/Bring Value to the Mature Markets	Sep.9	12:00-13:30	Booth #110
Equvo Pte Ltd. Taiwan Branch	Semiconductor Equipment Financing and Leasing Options; When to Buy, Lease, Rent or Outsource?	Sep.9	13:30-14:00	Booth #110
SurplusGLOBAL, Inc.	The Trends of Secondary Equipment Prices	Sep.10	14:30-15:00	Booth #110
TOP↑

Other Advanced Technology

ATMI	High Productivity Development ~ Driving Process Efficiency	Sep.8	10:30-11:00	Booth #110
JC‘S CHUNSON LIMITED	Optical Metrology Application in Sapphire Wafer	Sep.8	11:00-11:30	Booth #2236
Mirero Inc.	Innovative Technology for Overlaying Semiconductor Images	Sep.8	15:30-16:00	Booth #110
NIKON CORPORATION	Considerations of X-ray Inspection When Introducing Cu Materials Within Semiconductor Manufacture	Sep.8	16:00-16:30	Booth #2236
Zhengzhou Research Institute for Abrasives & Grinding	Development and Application of High Precision Superabrasive Tools for Semiconductor Industry	Sep.9	12:00-13:00	Booth #2236
SHENYANG ACADEMY OF INSTRUMENTATION SCIENCE	Introduction of Dicing Saw Machine	Sep.9	12:00-13:00	Booth #2236
GRIKIN Advanced Materials Co., Ltd.	Sputtering Targets for Semiconductor Application	Sep.9	12:00-13:00	Booth #2236
Creative Technology	Electrostatic Chucks, Heater and Alternative Clamping Methods Compatible for TSV (Thorough Silicon Via) and Next-generationprocesses and Related Technology in Achieving Low Particle, High Temperature Uniformity and Clamping Substrates of 450mm	Sep.10	11:00-11:30	Booth #2236
TOP↑