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2.5D / 3D IC Technology Forum

 Date:

Thursday, September 8th, 2016

 Time: 

8:30 - 17:00 (08:30 - 09:00 for registration)

 Venue:

Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan

 Theme:

3D IC with Optical Interconnect

 

 Forum Chairman: 

 

 Dr. C.P. Hung, Chairman of SEMI Taiwan PKG&TEST Committee & Vice President, ASE Group 

 

 Forum Moderator: 

 

 Dr. C.P. Hung, Vice President, ASE Group/ Chairman, SEMI Taiwan PKG&TEST Committee

 Mr. Walter Jau, Sr. Technical Director, ASE

 Dr. Spike Narayan, Director, Science & Technology, IBM Research –Almaden

 

 Forum Outline: 

 

To pave the way for “Cognitive Computing” in a Smarter & Better life, the industry needs to advance developments of high bandwidth and low power packaging solution with advanced wafer technology. 

As flagship of 2.5D/3D IC successfully made its way to market in 2015 through GPU engine w/ 3D memory cube on Si interposer, shaping the new platform of high performance package-level integration for numerous applications from network computing to smart client proliferations.

In 2016, 2.5D/3DIC forum will further explore the opportunity toward synergized Silicon Photonics with higher bandwidth optical interconnect to extend new economic scale.

 

 

Organizer:

 

 

 

 

 

 

 

 

Sponsor:

 

 

 

   

 

Agenda

Time

Topic / Speaker

08:30 - 09:00

 Registration

09:00 - 09:05

 Welcome Remarks by SEMI Executives

  Mr. Thomas Salmon, Vice President, Collaborative Technology Platforms, SEMI

09:05 - 09:15

 Opening Remarks & Moderator

 Dr. C.P. Hung , Vice President, ASE Group/ Chairman, SEMI Taiwan PKG&TEST Committee

09:15 - 09:45

 Opening Speech: Advancing the Frontiers of Information Technology through Hardware Innovation (Presentation Slides Download)

 Dr. Spike Narayan, Director, Science & Technology, IBM Research -Almaden

09:45 - 10:15

 Industry Session: Large Die Assembly Technology in TSV Package – Overcome the  Die Warpage (Presentation Slides Download)

 Dr. Jin Young Kim , Vice President of Corporate R&D, Amkor

10:15 - 10:45

 Industry Session: TSV in IC Packaging: Now and Future (Presentation Slides Download)

 Dr. Mike Ma, Vice President, SPIL

10:45 - 11:00

 Break

11:00 - 11:30

 Keynote Speech: Interposer Technology: Past, Now and Future (Presentation Slides Download)

 Dr. Shang  Y. Hou, Deputy Director, TSMC

11:30 - 12:00

 Market Perspective: Semiconductor Trend of 2.5D / 3D IC with Optical Interface (Presentation Slides Download)

 Dr. Philippe Absil, Director of the 3D and Optical I/O Technologies, imec

12:00 - 13:30

 Lunch Break

13:30 - 14:00

 Industry Session: Managing the Complexities of Advanced 3D Packaging through Multiphysics  Simulations (Presentation Slides Download)

 Mr. Aveek Sarkar, Vice President, Sales and Support, Semiconductor BU, ANSYS

14:00 - 14:30

 Technology Session: 2.5D/3DIC with Si Photonics (Presentation Slides Download)

 Dr. Tolga Tekin, Group Manager Photonic & Plasmonic Systems, Fraunhofer IZM

14:30 - 14:45

 Break

14:45 - 16:10

 Panel Session-1 (25 min for each presentation):

 Moderator: Mr. Walter Jau , Sr. Technical Director, ASE

  Rethinking Chip Stacking in High Volume from Chip to Wafer, Via Last to Wafer Level Hybrid Bonding (Presentation Slides Download)

 Mr. Markus Wimplinger , Corporate Technology Development & IP Director, EVG

  Development of PVD Technology for Next Wave IC Packaging Interconnection (Presentation Slides Unauthorized)

 Dr. Pei Jun Ding , Vice President, Beijing NMC

  Material Based Challenge and Study of 2.1, 2.5 and 3D Integration (Presentation Slides Download)

 Dr. Toshihisa Nonaka , Technical Director, Hitachi Chemical

  Group Q&A -10 mins

16:10 - 17:00

 Panel Session-2: 3D Integration for  Both Clouds & Clients

 Moderator : Dr. Spike Narayan, Director, Science & Technology, IBM Research – Almaden

 Amkor, ANSYS, ASE, IZM, IBM, SPIL, TSMC 

17:00

 Adjournment

 

■ Programs are subject to change without prior notice. 

■ All presentations will be conducted in English. 

■ No recording/photography during seminar.

Price

SEMI Member

Original Price (Aug 6 - Onsite)

US$125/ per person

NT$4,000/ per person

US$156/ per person

NT$5,000/ per person

 

 

Group Registration (Jun 22-Aug5)

3-5 people

6 people above

US$ 109/ per person
NT$3,500/ per person

US$ 94/ per person
NT$3,000/ per person

 

                

 


Contact

SEMI Taiwan

Ms Grace Wang

TEL: 886.3.560.1777 EXT. 503

Email: gwang@semi.org 

 

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