PAVILIONS
SEMICON Taiwan 2011
3D IC & Advanced Packaging/Testing Pavilion
3D IC is expected to be a critical technology of high integration, size decreasing and low power consumption. The shipment of 3D IC wafer will approach 10 million units in by 2012 and the strong market demand will drive innovations in packaging & testing filed. (Source: Yole Développment)
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Features for 3D IC & Advanced Packaging/Testing Pavilion
● Innovative Technology Center
Exhibitors will present the latest 3D IC applications and technology solutions
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SEMICON Taiwan 2011 Exhibitors
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Booth No. |
Company |
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166 |
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SEMICON Taiwan 2011 Exhibit Information
● Apply to exhibit
● Advertising & Sponsor opportunities
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For more exhibit question, please contact SEMI
Ms. Ana Li
Tel: +886.3.573.3399 ext. 224
Fax: +886.3.573.3355
Email: ali@semi.org
