PAVILIONS
3D IC is expected to be a critical technology of high integration, size decreasing and low power consumption. The shipment of 3D IC wafer will approach 10 million units in by 2012 and the strong market demand will drive innovations in packaging & testing filed. (Source: Yole Développment)
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Features
● Theme Pavilion
Global major companies from around the world will feature product display and programs on the latest 3D IC & SiP developments.
● SiP Global Summit 2011
This 3-day SiP Global Summit 2011 will consist of 3 major forums: 3D IC Technology, 3D IC Test and Embedded Substrate with representatives from 25 of the world’s top-notch IT firms slated to share insights into the 3D IC, TSV, silicon interposer and embedded substrate technologies. Participants in the summit will include ASE, Elpida, Formfactor, KYEC, Nokia, Qualcomm, Powertech Technology, Sony, SPIL, TSMC, Verigy; and R&D and market research organizations including Gartner, Fraunhofer IZM, IMEC, Yole Development and Industrial Technology Research Institute (ITRI).
Polish your industry knowledge through the systematic session arrangement and the most inspiring speeches from the CTOs from above global leading companies! Free registration is now open. Save your seats today! >> Agenda
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Sponsored by
For more information, please contact SEMI :
Ms. Kylie Yeh
SEMI Taiwan office
Tel: +886.3.573.3399 ext. 239
E-mail: kyeh@semi.org
Ms. Emily Huang
SEMI Taiwan office
Tel: +886.3.573.3399 ext. 230
E-mail: ehuang@semi.org