SESSIONS

SEMICON Taiwan 2011
Sessions & Events

 

 

SEMICON Taiwan 2011 will launch more than 80 sessions of SEMI Business & Technology Symposium and FREE technical presentations at the Innovation Technology Center on the show floor. Check out the updated speaker and session information below and register now!

 

Concurrent Events At-a-glance (by day)

 

 

 

 

● Sessions by Topics 

 

Featured/Special Events

Keynotes/Executive Events

3D IC & Advance Packaging/Testing

MEMS

 

CMP

 

 

LED

 

Green Management

Secondary Market

Semiconductor Process Technologies & Solutions

 

 

 

 

Featured/Special Events

 

↑TOP 

 

Topic

Date

Time

Place

Register Info.

 

Press Conference

Sep. 6

14:00~15:30

2F, Grand Hyatt Taipei

By Invitation Only

 

Opening Ceremony

Sep. 7

09:00~09:50

R201DEF,  TICC

 

 

Daily Lucky Draw

Sep. 7-9

11:00 / 15:00

To Be Announced

 

 

2011 Leadership Gala Dinner

Sep. 7

18:30~21:00

Grand Hyatt Taipei

By Invitation Only

 

SEMICON Taiwan Golf Tournament

Sep. 10

06:00~14:00

Sunrise Gold & Country Club

 

 

 

Keynotes/Executive Events

↑TOP 

Topic

Date

Time

Place

Register Info.

(Click "Register Now" to register online)

CEO Forum

Breakthrough the Present - Secure the Future

Sep. 7

10:00~12:10

R201DEF,  TICC

 

Market Trend Forum

Semiconductor Market Outlook

Sep.7

13:30~17:00

R201DEF, TICC

 

 

3D IC & Advance Packaging/Testing

↑TOP

Topic

Date

Time

Place

Register Info.

(Click "Register Now" to register online)

 

3D IC Test Forum

Test Challenges and Solution in the New Era of Heterogeneous Integration

 

Sep.7

13:00~17:20

Room 201ABC, TICC

 

3D IC Technology Forum

Embracing the Era of 2.5D & 3D ICs

 

Sep. 8

08:00~17:30

Room 201 ABC, TICC

 

Embedded Substrate Forum

Bridging the Last Mile of Heterogeneous Integration



Sep. 9

08:30~12:25

 

Room 201 BC, TICC

 

 

MEMS

↑TOP

Topic

Date

Time

Place

Register Info.

(Click "Register Now" to register online)

MEMS Forum

MEMS Devices, Foundry, Packaging and Testing

 

Sep. 8

08:30~17:10

Room 201 ABC, TICC議室

 

University MEMS Reseatch

Sep. 7–9


 

 

EVG-JOINTECH CORP.

Advanced Lithography and Inspection Solutions for 3D TSV Packaging of MEMS Devices

 

Sep. 7

13:00~13:30

 

 

 

 

Booth #3025  

WESi Technology Limited

Methods for Isotropic and Anisotropic Etching of MEMS Devices  

   

Sep. 7

13:30~14:00

 

 

 

 

Booth #3025

 

Alpha Precision Instrument Corp.

The Art of MEMS+IC Simulation: Coventor MEMS+, Enabling System-Level Design with Matlab, 

Simulink and Cadence Virtuoso

 

  

Sep. 7

14:30~15:00

 

 

 

 

 

 

Booth #3025

 

DELTA DESIGN & RASCO TAIWAN

 


Sep. 7

15:00~15:30

 

 

Booth #3025

 

Multitest Electronic Systems (Taiwan)

Strategic Approaches for MEMS Test  

 

Sep. 7

15:30~16:00

 

 

Booth #3025

 

CMP

↑TOP 

Topic

Date

Time

Place

Register Info.

(Click "Register Now" to register online)

CMP Forum  

Sep.9

08:30~12:00

 

Room 105, 1F, TICC

 

 

 

LED

↑TOP

Topic

Date

Time

Place

Register Info.

(Click "Register Now" to register online)

LED Forum

 

 

 

Sep. 9

 

 

08:30~12:00

 

 

Room 201 DEF, TICC

 

 

University LED Research

  

  

Sep. 7–9

 

 

 

C SUN MFG. LTD.

PSS Turn Key Solution

 

Sep. 7

12:00~12:30

 

 

Booth #3025

 

Mitsuboshi Diamond Industrial Co., Ltd.

New Scribing Solution for Electronic Component

 

Sep. 8

10:30~11:00

 

 

 

 

Booth #3025

Brewer Science, Inc.

Material and Equipment Technologies for High Brightness LED Manufacturing

   

Sep. 8

11:30~12:00

 

 

 

 

Booth #3025

 

Hamamatsu Photonics K.K.

The Stealth Dicing Technology for White LED

 

Sep. 8

 

 

 

12:00~12:30

 

 

 

Booth #3025

EV Group Europe & Asia/Pacific GmbH

High Throughput Lithography and Bonding Technology for LED manufacturing

  

Sep. 8

 

 

 

 

 

13:00~13:30

 

 

 

 

 

Booth #3025

 

Ushio Taiwan, Inc.

For CoO-Saved、For High-Throughput、For Future Innovation ~UX-4 LEDs、Laser Lift-Off System

   

Sep. 8

13:30~14:00

 

 

 

 

Booth #3025

 

Newport Corp.

Cutting Edge Motion Solutions For Microelectronics Applications

   

Sep. 8

14:00~14:30

 

 

Booth #3025

 

Evans Analytical Group

LED Analysis at EAG

  

Sep. 8

14:30~15:00

 

 

Booth #3025

 

Force Precision Instrument Co., Ltd.

The Inspection of Patterned Sapphire Substrate


Sep. 8

15:30~16:00

 

 

 

Booth #3025

 

Euflex Technology Corp.

Optical 3D Surface Metrology and Analysis

  

Sep. 8

16:00~16:30

 

 

 

Booth #3025

 

Evermagic Technology  Co., Ltd

1. Via Technology

2. Wafer Backside Temperature Control

   

Sep. 8

16:30~17:00

 

 

 

 

Booth #3025

 

Specialty Coating Systems, Inc.

Parylene Coatings for Enhanced Reliability of Electronics

 

Sep. 9

10:00~10:30

 

 

 

Booth #3025

 

Green Management

↑TOP 

Topic

Date

Time

Place

Register Info.

(Click "Register Now" to register online)

Green Manufacturing Forum

Energy Conservation and Chemical Management

  

Sep. 9

 

 

08:30~12:00

 

 

Room 102, TICC

 

SYFT Technologies LTD

Real-Time Monitoring of Hazardous Air Pollutants in the Semiconductor Manufacturing Environment Using a SIFT-MS Solution

 

Sep. 7

 

 

 

 

 

10:30~11:00

 

 

 

 

 

Booth #3025

 

CSK Inc.(CSK Taiwan)

 

 

Sep. 7

 

 

11:30~12:00

 

 

  Booth #3025

 

 

Secondary Market 

↑TOP 

Topic

Date

Time

Place

Register Info.

(Click "Register Now" to register online)

 

EQUVO Pte Ltd.


 

Sep. 9

 

 

10:30~11:00

 

 

Booth #3025

Semiconductor Equipment Manufacturing, Inc.

SEM Used Equipment Development

  

Sep. 9

 

 

11:00~11:30

 

 

Booth #3025

 

Entrepix, Inc.

CMP Redefined

  

Sep. 9

 

 

12:00~12:30

 

 

Booth #3025

 

 

Surplus GLOBAL Inc.

 

 

 

Forecast of Secondary Equipment Market

 

 

  

Sep. 9

 

 

13:30~14:00

 

 

Booth #3025

 

 

Semiconductor Process Technologies & Solutions

↑TOP

Topic

Date

Time

Place

Register Info.

(Click "Register Now" to register online)

e-Manufaturing & Design Collaboration Symposium 2011

 

A Joint Symposium with ISSM 2011 

 

 

Sep.5~6

 

 

 

08:00~17:15

 

 

 

The Ambassador Hotel Hsinchu, Taiwan  

Connectec Japan Corp.

Brand-new Flip Chip Package without Wafer Bumping & Organic Substrate

  


Sep. 7

 

 

 

 

11:00~11:30

 

 

 

 

Booth #3025

 

JC’s Chunson Limited

Achieve ALL-IN-ONE Measurement with Same Machine

 

Sep. 7

 

 

 

12:30~13:00

 

 

 

Booth #3025

Creative Technology

1. Innovative Technology for TSV Thin Wafer or TSV Glass Wafer Handling.

2. Electrostatic Chunk Arcing Monitorign System (Prevent ESC from Arcing)

3. High Temperature - Controllable Multi-Zone Heater ESC.

 

Sep. 7

 

 

 

 

 

 

 

14:00~14:30

 

 

 

 

 

 

 

Booth #3025

Everett Charles Technologies

FLAT Technology Is The FUTURE

 

 

Sep. 7

 

 

 

16:00~16:30

 

 

 

Booth #3025

BOC Lienhwa Industrial Gases Co., Ltd.

On-Stie F2 Supply: Safe , Sustainable and Cost Efficient Solution

 

Sep. 8

 

 

 

10:00~10:30

 

 

 

Booth #3025

IMEC Taiwan

At your doorstep : Disruptive technologies for the future generation of multifunctional smart devices

 

Sep. 8

 

 

 

 

11:00~11:30

 

 

 

 

Booth #3025

 

Schimidt Scientific Taiwan Ltd

The Present Conditions and the Future Prospects of the Compression Holding Machine

  

Sep. 8

 

 

 

 

12:30~13:00

 

 

 

 

Booth #3025

 

TOHO-KASEI CO., LTD

High Stroke Robot System for TSV, Wet and Exposure Systems.

 

Sep. 8

 

 

 

15:00~15:30

 

 

 

Booth #3025

Senju Metal Industry Co., Ltd. Taiwan Branch

Fine Pitch Bumping Formation Application- PPS & Micro Ball

 

Sep 9

 

 

 

 

11:30~12:00

 

 

 

 

Booth #3025

 

 
 

 

  

For more information, please contact SEMI :
Programs enquires:                                   Technical Presentation (ITC):
Ms. Kylie Yeh                                           Ms. Emily Huang
Tel: 886.3.579.3399 ext. 239                         Tel: 886.3.579.3399 ext. 230        
E-mail: kyeh@semi.org                               E-mail: ehuang@semi.org