EVENTS
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SEMICON Taiwan 2011 |
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* Presentaions are now open for download!
● LED
● MEMS
● Semiconductor Process Technologies & Solutions
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Sep. 7 (Wed) |
10:30~11:00 Topic:Real-Time Monitoring of Hazardous Air Pollutants in the Semiconductor Manufacturing Environment using a SIFT-MS Solution SYFT Technologies LTD
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11:30~12:00 Topic:TBC CSK Inc.(CSK Taiwan)
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| Sep. 7 (Wed) |
12:00~12:30
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| Sep. 8(Thurs) |
10:30~11:00 Topic:New Scribing Solution for Electronic Component Mitsuboshi Diamond Industrial Co., Ltd.
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11:30~12:00 Topic:Material and Equipment Technologies for High Brightness LED Manufacturing Brewer Science, Inc.
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12:00~12:30 Topic:The Stealth Dicing Technology for White LED Hamamatsu Photonics K.K.
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13:00~13:30 Topic:High Throughput Lithography and Bonding Technology for LED Manufacturing EV Group Europe & Asia / Pacific GmbH
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13:30~14:00 Topic:For CoO-Saved、For High-Throughput、For Future Innovation ～UX-4 LEDs、Laser Lift-Off System Ushio Taiwan, Inc.
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14:00~14:30 Topic:Cutting Edge Motion Solutions For Microelectronics Applications Newport Corp.
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14:30~15:00 Topic:LED Analysis at EAG Evans Analytical Group
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15:30~16:00 Topic:The Inspection of Patterned Sapphire Substrate Force Precision Instrument Co., Ltd.
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16:00~16:30 Topic:Optical 3D Surface Metrology and Analysis Euflex Technology Corp.
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16:30~17:00 Topic:1. Via Technology; 2. Wafer Backside Temperature Control Evermagic Technology Co., Ltd
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Sep 9 (Fri) |
10:00~10:30 Topic:Parylene Coatings for Enhanced Reliability of Electronics Specialty Coating Systems, Inc.
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Sep7(Wed) |
13:00~13:30 Topic:Advanced Lithography and Inspection Solutions for 3D TSV Packaging of MEMS Devices EVG-JOINTECH CORP.
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13:30~14:00 Topic:Methods for Isotropic and Anisotropic Etching of MEMS Devices WESi Technology Limited
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14:30~15:00 Topic:The Art of MEMS+IC Simulation: Coventor MEMS+, Enabling System-Level Design with Matlab, Simulink and Cadence Virtuoso Alpha Precision Instrument Corp.
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15:00~15:30 Topic:TBC DELTA DESIGN & RASCO TAIWAN
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15:30~16:00 Topic:Strategic Approaches for MEMS Test Multitest Electronic Systems (Taiwan)
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Sep 9 (Fri) |
10:30~11:00 Topic:TBC EQUVO Pte Ltd.
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11:00~11:30 Topic:SEM Used Equipment Development Semiconductor Equipment Manufacturing, Inc.
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12:00~12:30 Topic:CMP Redefined Entrepix, Inc.
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13:30~14:00 Topic:Forecast of Secondary Equipment Market Surplus GLOBAL Inc.
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Semiconductor Process Technologies & Solutions
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Sep. 7 (Wed) |
11:00~11:30 Topic:Brand-new Flip Chip Package without Wafer Bumping & Organic Substrate Connectec Japan Corp.
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12:00~12:30 Topic:Achieve ALL-IN-ONE Measurement with Same Machine JC’s Chunson Limited
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14:00~14:30 Topic : 1. Innovative Technology for TSV Thin Wafer or TSV Glass Wafer Handling. 2. Electrostatic Chunk Arcing Monitorign System (Prevent ESC from Arcing) 3. High Temperature - Controllable Multi-Zone Heater ESC. Creative Technology
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16:00~16:30 Topic:FLAT Technology Is The FUTURE
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| Sep. 8(Thurs) |
10:00~10:30 Topic:On-Stie F2 Supply: Safe , Sustainable and Cost Efficent Solution BOC Lienhwa Industrial Gases Co., Ltd.
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11:00~11:30 Topic:At Your Doorstep : Disruptive Technologies for the Future Generation of Multifunctional Smart Devices IMEC Taiwan
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12:30~13:00 Topic:The Present Conditions and the Future Prospects of the Compression Holding Machine Schimidt Scientific Taiwan Ltd
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15:00~15:30 Topic:
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Sep 9 (Fri) |
11:30~12:00 Topic:Fine Pitch Bumping Formation Application- PPS & Micro Ball Senju Metal Industry Co., Ltd. Taiwan Branch
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For more show information or registration problem, please contact SEMI
Ms. Emily Huang
Tel: 886.3.573.3399 ext. 230
E-mail: ehuang@semi.org