SESSIONS

Spurred by the insatiable appetite of consumers, the industry has witnessed an explosion of devices that incorporate an ever-larger array of system-on-chip (SoC) and system-in-a-package (SiP) to provide the performance required to enable new user experiences. Going forward, accelerated integration of functionalities will take place through heterogeneous integration in the form of SiP for handhelds and other applications.

"Advanced packaging and testing" is used to being the most popular topic among the SEMICON Taiwan forums. Last year, the session attracted around 600 industry professionals to participate. As packaging and testing is becoming more and more crucial in performing unmatchable user experience in portable devices, we proudly launch the “SiP Global Summit 2011” which is brought to you by the SEMI Taiwan Packaging & Testing Committee and supported by ASE, IMEC, ITRI, KYEC, SPIL and other global leading companies. It will be the largest and dedicated international forum for the industry experts in the semiconductor packaging and testing field.

This 3-day SiP Global Summit 2011 consists of 3 forums: 3D IC Technology, 3D IC Test and Embedded Substrate. In this Summit, 25 plus CTOs and industry leaders from around the world will share their experiences and perspectives on 3D IC with through silicon via, 2.5D IC with silicon interposer and embedded substrate.

Polish your industry knowledge through the systematic session arrangement and the most inspiring speeches from the CTOs from global leading companies! Save your seats today!