Date: |
Wednesday, September 13th, 2017 |
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Time: |
09:00 - 16:50 (09:00 – 09:30 for registration) |
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Venue: |
Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan |
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Theme: |
Package Innovation in Automotive |
Forum Chairman: |
Forum Chairman Dr. Mike Ma, President, Amkor Technology Taiwan/ Vice Chairman, SEMI Taiwan PKG&TEST Committee Forum Vice Chairman Mr. Min Yoo, Vice President, Amkor Technology Taiwan/ SEMI Taiwan PKG&TEST Commitee Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES / SEMI Taiwan PKG&TEST Commitee |
Forum Moderator: |
Mr. Min Yoo, Vice President, Amkor Technology Taiwan/ SEMI Taiwan PKG&TEST Commitee Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES / SEMI Taiwan PKG&TEST Commitee |
Forum Outline: |
Proliferation of electronics in automobiles is becoming one of the most critical aspects to enable advanced functions, in which packaging technologies play an important role to the success of control modules used for various applications, including electric vehicles, assisted driving, communication and entertainment, powertrain and body control, emission control, securities and safety managements, etc. Innovations in automobile electronics now drive key differentiation in a competitive market. Unlike that of many consumer mobile and wearable devices having short production ramps and product cycle, automotive electronics need to meet more stringent reliability requirements while employee longer production cycle. Key selection criteria, such as safety and quality, of suitable electronic systems for use in intelligent and reliable vehicles also vastly differ from those dominated by cost and complexity in advanced packages for the mobile products . Three major trends for automotive electronics innovation can be categorized into vehicle connection, power management and driving automation, which includes ADAS and self-driving vehicles. Semiconductor manufacturers are now encountering key issues how to apply new technologies to meet demand in automotive market. This year, our Advanced Packaging Forum scope includes topics and solutions concerning what key value in automotive for semiconductor can contribute, Topics related to mobile products such as 5G, VR and AR will be reviewed together with key packaging solutions and market research.
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Organizer: |
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Agenda |
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Time |
Topic/Speaker |
09:00 - 09:30 |
Registration |
09:30 - 09:40 |
Welcome Remarks by SEMI Executives Mr. Peter Gillespie, Chief Marketing Officer, SEMI Opening Remarks & Moderator Dr. Mike Ma, President, Amkor Technology Taiwan Mr. Min Yoo, Vice President, Amkor Technology Taiwan |
09:40 - 10:10 |
Topic 1: Application-Driven Challenges & Innovations in Automotive Packaging Speaker: Dr. Veer Dhandapani, Head of Automotive Packaging, NXP Semiconductors |
10:10 - 10:40 |
Topic 2: IC Testing – Emerging changes driven by Auto IC & Self-Driving Requirements Speaker: Dr. Phil Nigh, Distinguished Member of Technical Staff, GLOBALFOUNDRIES |
10:40 - 11:00 |
Break |
11:00 - 11:30 |
Topic 3: Delivering Innovative Technology & Trusted Productivity Solutions for Advanced Packaging Speaker: Mr. Lee Chee Ping, Regional Technologist and Technical Marketing Manager, Lam Research |
11:30 - 12:00 |
Topic 4: Automotive Market Trend & IC package offering Speaker: Ms. Doris Hu, Product Management Director, Amkor |
12:00 - 13:30 |
Lunch Break |
13:30 - 13:35 |
Opening Remarks & Moderator Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES |
13:35 - 14:00 |
Topic 5: New Wave Technology for Automotive Application Speaker: Dr. Chinghan Huang, Department Manager, ASECL |
14:00 - 14:25 |
Topic 6: Innovation Packaging Solutions for Automotive Speaker: Mr. Mark Liao, Deputy Director, SPIL |
14:25 - 14:50 |
Topic 7: SUSS High Throughput UV Projection Scanner with optimized Performance for FOWLP Application Speaker: Dr. Markus Arendt, President, SUSS |
14:50 - 15:15 |
Topic 8: Wirebond Package Technologies for Automotive Speaker: Mr. Shigeki Sako, Automotive & Power discrete strategy officer, J-Device |
15:15 - 15:35 |
Break |
15:35 - 16:00 |
Topic 9: Overall solution for chipping free on automotive WLCSP Speaker: Mr. Otto Cheung, Product Marketing Manager, ASM |
16:00 - 16:25 |
Topic 10: Underfill Design for Recent High Reliability Package Speaker: Mr. Yohei Hosono, Senior team leader, Technical R&D Division, Namics |
16:25 - 16:50 |
Topic 11: Development Status of Bonding Wire for Automotive Speaker: Dr. Dong-Choul Cho, Senior researcher, Heesung Metal |
16:50 |
Adjournment |
■ Programs are subject to change without prior notice.
■ All presentations will be conducted in English.
■ No recording/photography during the seminar.
Price |
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Early Bird / SEMI Member |
Original Price (Aug 16 - Onsite) |
3200 |
4000 |
(Currency: NTD)
Group Registration (July 15 - Aug 15) |
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3-5 people |
6 people above |
2800 |
2400 |
(Currency: NTD)
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Contact
SEMI Taiwan
Ms PonPon Lo
TEL: 886.3.560.1777 EXT. 511
Email: semiprogramtw@gmail.com