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Advanced Packaging Technology Symposium

 Date:

Wednesday, September 13th, 2017

 Time: 

08:30 - 17:00 (08:30 - 09:00 for registration)

 Venue:

 Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan

 Theme:

 Package Innovation in Automotive

 

 Forum Chairman:TBD 

 

 Forum Moderator: TBD

 

 Forum Outline: 

   

    Proliferation of electronics in automobiles is becoming one of the most critical aspects to enable advanced functions, in which packaging technologies play an important role to  the success of control modules used for  various applications, including electric vehicles, assisted driving, communication and entertainment, powertrain and body control, emission control, securities and safety managements, etc. Innovations in automobile electronics now drive key differentiation in a competitive market.

    Unlike that of many consumer mobile and wearable devices having short production ramps and product cycle, automotive electronics need to meet more stringent reliability requirements while employee longer production cycle.  Key selection criteria, such as safety and quality, of suitable electronic systems for use in intelligent and reliable vehicles also vastly differ from those dominated by cost and complexity in advanced packages for the mobile products . Three major trends for automotive electronics innovation can be categorized into vehicle connection, power management and driving automation, which includes ADAS and self-driving vehicles. Semiconductor manufacturers are now encountering key issues how to apply new technologies to meet demand in automotive market. This year, our Advanced Packaging Forum scope includes  topics and solutions concerning what key value in automotive for semiconductor can contribute, Topics related to mobile products such as 5G, VR and AR will be reviewed together with key packaging solutions and market research.  

 

 

 

Organizer:

 

 

Sponsor:      

 

 

       
 

     
           

 

Agenda (will be updated shortly)

Time

Topic/Speaker

08:30 - 09:00

 Registration

09:00 - 09:03

 Welcome Remarks by SEMI Executives

09:03 - 09:10

 Opening Remarks & Moderator

09:10 - 09:35

 Market Trend : Connected Car : The ultimate Mobile Device
 Speaker: Inviting 

09:35 - 10:00

 Topic 1: RF SOI for 5G
 Speaker: Mr. David MacCann, Vice President, Worldwide Post Fab Operations & Development, Globalfoundries 

10:00 - 10:25

 Topic 2: Overview of electronic system requirements for electric cars
 Speaker: Inviting

10:25 - 10:40

 Break

10:40 - 11:05

 Topic 3: Driving Innovation – NXP Automotive

 Speaker: NXP (Inviting)

11:05 - 11:30

 Topic 4: TBD

 Speaker: Lam Research

11:30 - 11:55

 Topic 5: OSAT perspective for automotive semiconductor

 Speaker: Mr. Akio Katsumata, PLP Business Promotion Officer, J-Device

11:55 - 13:30

 Lunch Break

13:30 - 13:35

 Opening Remarks & Moderator

13:35 - 14:00

 Topic 6: MEMs Package for automotive packaging

 Speaker: ASECL  

14:00  - 14:25

 Topic 7: Overall solution for chipping free on automotive WLCSP

 Speaker: Mr. Otto Cheung, Product Marketing Manager, ASM 

14:25 - 14:50

 Topic 8: SUSS High Throughput UV Projection Scanner with optimized Performance for FOWLP Application

 Speaker: Dr. Markus Arendt, President, SUSS

14:50 - 15:10

 Break

15:10 - 15:35

 Topic 9: Advanced packaging material solution (PI, EMC, UF) for automotive

 Speaker: Hitachi

15:35 - 16:00

 Topic 10: Innovation Packaging Solutions for Automotive
 Speaker: SPIL

16:00 - 16:25

 Topic 11: TBD

 Speaker: TBD

 

 Adjournment

■ Programs are subject to change without prior notice. 

■ All presentations will be conducted in English. 

■ No recording/photography during the seminar.

 

Price

Early Bird / SEMI Member

Original Price (Aug 16 - Onsite)

3200

4000

(Currency: NTD)

 

Group Registration (July 15 - Aug 15)

3-5 people

6 people above

  2800

2400

(Currency: NTD)

       
               
           
               

Contact

SEMI Taiwan

Ms Lily Lee

TEL: 886.3.560.1777 EXT. 509

Email: llee@semi.org

 

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