Advanced Packaging Technology Symposium

Date:	Wednesday, September 13^th, 2017
Time:	09:00 - 16:50 (09:00 – 09:30 for registration)
Venue:	Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan
Theme:	Package Innovation in Automotive

Forum Chairman:

Forum Chairman

Dr. Mike Ma, President, Amkor Technology Taiwan/ Vice Chairman, SEMI Taiwan PKG&TEST Committee

Forum Vice Chairman

Mr. Min Yoo, Vice President, Amkor Technology Taiwan/ SEMI Taiwan PKG&TEST Commitee

Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES / SEMI Taiwan PKG&TEST Commitee

Forum Moderator:

Mr. Min Yoo, Vice President, Amkor Technology Taiwan/ SEMI Taiwan PKG&TEST Commitee

Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES / SEMI Taiwan PKG&TEST Commitee

Forum Outline:

Proliferation of electronics in automobiles is becoming one of the most critical aspects to enable advanced functions, in which packaging technologies play an important role to the success of control modules used for various applications, including electric vehicles, assisted driving, communication and entertainment, powertrain and body control, emission control, securities and safety managements, etc. Innovations in automobile electronics now drive key differentiation in a competitive market.

Unlike that of many consumer mobile and wearable devices having short production ramps and product cycle, automotive electronics need to meet more stringent reliability requirements while employee longer production cycle. Key selection criteria, such as safety and quality, of suitable electronic systems for use in intelligent and reliable vehicles also vastly differ from those dominated by cost and complexity in advanced packages for the mobile products . Three major trends for automotive electronics innovation can be categorized into vehicle connection, power management and driving automation, which includes ADAS and self-driving vehicles. Semiconductor manufacturers are now encountering key issues how to apply new technologies to meet demand in automotive market. This year, our Advanced Packaging Forum scope includes topics and solutions concerning what key value in automotive for semiconductor can contribute, Topics related to mobile products such as 5G, VR and AR will be reviewed together with key packaging solutions and market research.

Organizer:

Sponsor:

Agenda
Time	Topic/Speaker
09:00 - 09:30	Registration
09:30 - 09:40	Welcome Remarks by SEMI Executives Mr. Peter Gillespie, Chief Marketing Officer, SEMI Opening Remarks & Moderator Dr. Mike Ma, President, Amkor Technology Taiwan Mr. Min Yoo, Vice President, Amkor Technology Taiwan
09:40 - 10:10	Topic 1: Application-Driven Challenges & Innovations in Automotive Packaging Speaker: Dr. Veer Dhandapani, Head of Automotive Packaging, NXP Semiconductors
10:10 - 10:40	Topic 2: IC Testing – Emerging changes driven by Auto IC & Self-Driving Requirements Speaker: Dr. Phil Nigh, Distinguished Member of Technical Staff, GLOBALFOUNDRIES
10:40 - 11:00	Break
11:00 - 11:30	Topic 3: Delivering Innovative Technology & Trusted Productivity Solutions for Advanced Packaging Speaker: Mr. Lee Chee Ping, Regional Technologist and Technical Marketing Manager, Lam Research
11:30 - 12:00	Topic 4: Automotive Market Trend & IC package offering Speaker: Ms. Doris Hu, Product Management Director, Amkor
12:00 - 13:30	Lunch Break
13:30 - 13:35	Opening Remarks & Moderator Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES
13:35 - 14:00	Topic 5: New Wave Technology for Automotive Application Speaker: Dr. Chinghan Huang, Department Manager, ASECL
14:00 - 14:25	Topic 6: Innovation Packaging Solutions for Automotive Speaker: Mr. Mark Liao, Deputy Director, SPIL
14:25 - 14:50	Topic 7: SUSS High Throughput UV Projection Scanner with optimized Performance for FOWLP Application Speaker: Dr. Markus Arendt, President, SUSS
14:50 - 15:15	Topic 8: Wirebond Package Technologies for Automotive Speaker: Mr. Shigeki Sako, Automotive & Power discrete strategy officer, J-Device
15:15 - 15:35	Break
15:35 - 16:00	Topic 9: Overall solution for chipping free on automotive WLCSP Speaker: Mr. Otto Cheung, Product Marketing Manager, ASM
16:00 - 16:25	Topic 10: Underfill Design for Recent High Reliability Package Speaker: Mr. Yohei Hosono, Senior team leader, Technical R&D Division, Namics
16:25 - 16:50	Topic 11: Development Status of Bonding Wire for Automotive Speaker: Dr. Dong-Choul Cho, Senior researcher, Heesung Metal
16:50	Adjournment