Advanced Packaging Technology Symposium

Date:	Wednesday, September 13^th, 2017
Time:	08:30 - 17:00 (08:30 - 09:00 for registration)
Venue:	Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan
Theme:	Package Innovation in Automotive

Forum Chairman:TBD

Forum Moderator: TBD

Forum Outline:

Proliferation of electronics in automobiles is becoming one of the most critical aspects to enable advanced functions, in which packaging technologies play an important role to the success of control modules used for various applications, including electric vehicles, assisted driving, communication and entertainment, powertrain and body control, emission control, securities and safety managements, etc. Innovations in automobile electronics now drive key differentiation in a competitive market.

Unlike that of many consumer mobile and wearable devices having short production ramps and product cycle, automotive electronics need to meet more stringent reliability requirements while employee longer production cycle. Key selection criteria, such as safety and quality, of suitable electronic systems for use in intelligent and reliable vehicles also vastly differ from those dominated by cost and complexity in advanced packages for the mobile products . Three major trends for automotive electronics innovation can be categorized into vehicle connection, power management and driving automation, which includes ADAS and self-driving vehicles. Semiconductor manufacturers are now encountering key issues how to apply new technologies to meet demand in automotive market. This year, our Advanced Packaging Forum scope includes topics and solutions concerning what key value in automotive for semiconductor can contribute, Topics related to mobile products such as 5G, VR and AR will be reviewed together with key packaging solutions and market research.

Organizer:

Sponsor:

Agenda (will be updated shortly)
Time	Topic/Speaker
08:30 - 09:00	Registration
09:00 - 09:03	Welcome Remarks by SEMI Executives
09:03 - 09:10	Opening Remarks & Moderator
09:10 - 09:35	Market Trend : Connected Car : The ultimate Mobile Device Speaker: Inviting
09:35 - 10:00	Topic 1: RF SOI for 5G Speaker: Mr. David MacCann, Vice President, Worldwide Post Fab Operations & Development, Globalfoundries
10:00 - 10:25	Topic 2: Overview of electronic system requirements for electric cars Speaker: Inviting
10:25 - 10:40	Break
10:40 - 11:05	Topic 3: Driving Innovation – NXP Automotive Speaker: NXP (Inviting)
11:05 - 11:30	Topic 4: TBD Speaker: Lam Research
11:30 - 11:55	Topic 5: OSAT perspective for automotive semiconductor Speaker: Mr. Akio Katsumata, PLP Business Promotion Officer, J-Device
11:55 - 13:30	Lunch Break
13:30 - 13:35	Opening Remarks & Moderator
13:35 - 14:00	Topic 6: MEMs Package for automotive packaging Speaker: ASECL
14:00 - 14:25	Topic 7: Overall solution for chipping free on automotive WLCSP Speaker: Mr. Otto Cheung, Product Marketing Manager, ASM
14:25 - 14:50	Topic 8: SUSS High Throughput UV Projection Scanner with optimized Performance for FOWLP Application Speaker: Dr. Markus Arendt, President, SUSS
14:50 - 15:10	Break
15:10 - 15:35	Topic 9: Advanced packaging material solution (PI, EMC, UF) for automotive Speaker: Hitachi
15:35 - 16:00	Topic 10: Innovation Packaging Solutions for Automotive Speaker: SPIL
16:00 - 16:25	Topic 11: TBD Speaker: TBD
	Adjournment