Advanced Packaging Technology Symposium


Wednesday, September 13th, 2017


09:00 - 16:50 (09:00 – 09:30 for registration)


 Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan


 Package Innovation in Automotive


 Forum Chairman:

Forum Chairman

Dr. Mike Ma, President, Amkor Technology Taiwan/ Vice Chairman, SEMI Taiwan PKG&TEST Committee

Forum Vice Chairman

Mr. Min Yoo, Vice President, Amkor Technology Taiwan/ SEMI Taiwan PKG&TEST Commitee

Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES / SEMI Taiwan PKG&TEST Commitee

 Forum Moderator: 

Mr. Min Yoo, Vice President, Amkor Technology Taiwan/ SEMI Taiwan PKG&TEST Commitee

Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES / SEMI Taiwan PKG&TEST Commitee

 Forum Outline: 


    Proliferation of electronics in automobiles is becoming one of the most critical aspects to enable advanced functions, in which packaging technologies play an important role to  the success of control modules used for  various applications, including electric vehicles, assisted driving, communication and entertainment, powertrain and body control, emission control, securities and safety managements, etc. Innovations in automobile electronics now drive key differentiation in a competitive market.

    Unlike that of many consumer mobile and wearable devices having short production ramps and product cycle, automotive electronics need to meet more stringent reliability requirements while employee longer production cycle.  Key selection criteria, such as safety and quality, of suitable electronic systems for use in intelligent and reliable vehicles also vastly differ from those dominated by cost and complexity in advanced packages for the mobile products . Three major trends for automotive electronics innovation can be categorized into vehicle connection, power management and driving automation, which includes ADAS and self-driving vehicles. Semiconductor manufacturers are now encountering key issues how to apply new technologies to meet demand in automotive market. This year, our Advanced Packaging Forum scope includes  topics and solutions concerning what key value in automotive for semiconductor can contribute, Topics related to mobile products such as 5G, VR and AR will be reviewed together with key packaging solutions and market research.  












09:00 - 09:30


09:30 - 09:40

 Welcome Remarks by SEMI Executives

 Mr. Peter Gillespie, Chief Marketing Officer, SEMI

 Opening Remarks & Moderator

 Dr. Mike Ma, President, Amkor Technology Taiwan

 Mr. Min Yoo, Vice President, Amkor Technology Taiwan

09:40 - 10:10

 Topic 1: Application-Driven Challenges & Innovations in Automotive Packaging

 Speaker: Dr. Veer Dhandapani, Head of Automotive Packaging, NXP Semiconductors

10:10 - 10:40

 Topic 2: IC Testing – Emerging changes driven by Auto IC & Self-Driving Requirements

 Speaker: Dr. Phil Nigh, Distinguished Member of Technical Staff, GLOBALFOUNDRIES

10:40 - 11:00


11:00 - 11:30

 Topic 3: Delivering Innovative Technology & Trusted Productivity Solutions for Advanced Packaging

 Speaker: Mr. Lee Chee Ping, Regional Technologist and Technical Marketing Manager, Lam Research

11:30 - 12:00

 Topic 4: Automotive Market Trend & IC package offering

 Speaker: Ms. Doris Hu, Product Management Director, Amkor

12:00 - 13:30

 Lunch Break

13:30 - 13:35

 Opening Remarks & Moderator

 Dr. David W. Wang, Vice President, ChipMOS TECHNOLOGIES

13:35 - 14:00

 Topic 5: New Wave Technology for Automotive Application

 Speaker: Dr. Chinghan Huang, Department Manager, ASECL

14:00  - 14:25

 Topic 6: Innovation Packaging Solutions for Automotive

 Speaker: Mr. Mark Liao, Deputy Director, SPIL

14:25 - 14:50

 Topic 7: SUSS High Throughput UV Projection Scanner with optimized Performance for FOWLP Application

 Speaker: Dr. Markus Arendt, President, SUSS

14:50  - 15:15

 Topic 8: Wirebond Package Technologies for Automotive

 Speaker: Mr. Shigeki Sako, Automotive & Power discrete strategy officer, J-Device

15:15 - 15:35


15:35 - 16:00

 Topic 9: Overall solution for chipping free on automotive WLCSP

 Speaker: Mr. Otto Cheung, Product Marketing Manager, ASM

16:00 - 16:25

 Topic 10: Underfill Design for Recent High Reliability Package

 Speaker: Mr. Yohei Hosono, Senior team leader, Technical R&D Division, Namics

16:25 - 16:50

 Topic 11: Development Status of Bonding Wire for Automotive

Speaker: Dr. Dong-Choul Cho, Senior researcher, Heesung Metal



■ Programs are subject to change without prior notice. 

■ All presentations will be conducted in English. 

■ No recording/photography during the seminar.



Early Bird / SEMI Member

Original Price (Aug 16 - Onsite)



(Currency: NTD)


Group Registration (July 15 - Aug 15)

3-5 people

6 people above



(Currency: NTD)



SEMI Taiwan

Ms PonPon Lo

TEL: 886.3.560.1777 EXT. 511

Email: semiprogramtw@gmail.com


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