IC Forum


 Friday, September 15th, 2017


 09:00 - 16:25 (09:00 - 09:30 for registration)


 Room 401, Taipei Nangang Exhibition Center, Hall 1, Taipei, Taiwan


 Key Technologies for the Next Decade ─ Critical Scaling Factors & Enablers for a Smart World


 Forum Chairman & Forum Vice Chairman: 

Forum Chairman
Dr. Tri-Rung Yew, Professor, NTHU / Chairman, SEMI Taiwan IC Committee

Forum Vice Chairman

Mr. Rutgers Chow, President of SPTS Asia, SPTS Technologies/ Vice Chairman, SEMI Taiwan IC Committee

Dr. John Lin, Director, TSMC/ Vice Chairman, SEMI Taiwan IC Committee

 Forum Moderator: 

Mr. Rutgers Chow, President of SPTS Asia, SPTS Technologies/ Vice Chairman, SEMI Taiwan IC Committee

 Forum Outline: 


Semiconductor Technologies served an integral enabling role in the 80’s & 90’s to facilitate industry innovations and revolutions in the areas of computing and consumer electronics.

Entering the Millennium, semiconductor devices and their many applications in the communication segments served as the growth engine for the semiconductor industry.   IC designers and producers explored applications and use scenarios in computing, consumer, and communications, to drive and bring them into the mobile era.   Leading components such as application processors (APUs), memory, image sensors, and wireless communication chips, all came together to enable the functionality of the smart phone. 

Gaining momentum in the tailwind of the mobile era, we’ve been witnessing the rise of the internet of things (IoT), virtual reality (VR) and augmented reality (AR), and most recently artificial intelligence (AI).  To enable these new applications, new generations of devices are being developed, including CPUs to GPUs, APUs to HPUs, NAND Flash and Memories, displays and wireless chips.  The VR and AR industries, including hardware & commerce, are expected to bring $80 billion of business opportunities by 2020 and reach over $2 trillion by 2035.  

In the era of IoT, cost, connectivity and speed are the drivers, while for VR and AR, application designers are looking to deliver “total immersive experiences” for users which requires a vast amount of graphic & computing capabilities as well as large storage memory chips.    These new requirements pose various technological challenges for scientists to overcome but also offer many new opportunities for the industry.

At the upcoming SEMICON Taiwan, the IC Forum will feature exciting topics around the market outlook for the IoT and VR/AR applications, with scaling factors and key enabling technology challenges discussed.  Specific topics will include; patterning with the EUV and EUV assisted materials/technologies, materials innovations to break the barrier of device speed degraded by RC delay, and so on.  Solutions to address these challenges will also be presented.

Renowned experts in the industry are invited to share their perspectives and discuss the vast commercial opportunities for the electronics industries and semiconductor supply chain in this new and exciting era.























Topic & Speaker

09:00 - 09:30


09:30 - 09:40

 Opening Remarks & Moderator

 Mr. Peter Gillespie, Chief Marketing Officer, SEMI

 Opening Remarks: 

 Dr. Tri-Rung Yew, Professor, NTHU / Chairman, SEMI Taiwan IC Committee

 Moderated by:

 Mr. Rutgers Chow, President of SPTS Asia, SPTS Technologies/ Vice Chairman, SEMI Taiwan IC Committee

09:40 - 10:10

 Keynote: Opportunities and Progresses in Semiconductor Innovation  

 Speaker: Dr. Jack Sun, Vice President and CTO, TSMC

10:10 - 10:35

 Topic 2: Innovations Wanted

 Speaker: Dr. Burn Lin, Professor, NTHU

10:35 - 11:00

 Topic 3: High-Volume Manufacturing Introduction of Dielectric Atomic Layer Etching

 Speaker: Mr. Barrett Finch, Director of Etch Product Marketing, Lam Research

11:00 - 11:15


11:15 - 11:40

 Topic 4: Extending Lithography with Advanced Materials and Manufacturing Excellence

 Speaker: Mr. Jim Lamb, Deputy CTO, Advanced Semiconductor Manufacturing Corporate Technical Fellow, Brewer Science

11:40 - 12:05

 Topic 5: Key Technologies for Next Generation EUV Lithography

 Speaker: Mr. Toshihiko Nishigaki, VP & General Manager, Corporate, TEL

12:05 - 12:30

 Topic 6: New Frontiers in Interconnect Scaling – Pathways to Address RC Delay & Reliability

 Speaker : Dr. Kevin Moraes, Managing Director, Applied Materials

12:30 - 13:30

 Lunch Break

13:30 - 13:35

 Welcome Remarks by SEMI Executive

 Mr. Peter Gillespie, Chief Marketing Officer, SEMI

 Opening Remarks & Moderator

 Mr. Rutgers Chow, President of SPTS Asia, SPTS Technologies/ Vice Chairman, SEMI Taiwan IC Committee

13:35 - 14:05

 Keynote: Terabit Memories - the Most Key Enabler for the Smart World : 3D Nonvolatile Memories

 Speaker: Dr. C.Y. Lu, President, Macronix

14:05 - 14:30

 Topic 8: Specialty Technology Opportunities from IoT

 Speaker: Dr. Wenchi Ting, Associate VP, UMC

14:30 - 14:55

 Topic 9: Fault Localization by Finding Schematic of Devices Connecting All Emission Sites in Photon Emission Microscope Image

 Speaker: Mr. Ankush Oberai, Group Director,Yield management R&D, Synopsys

14:55 - 15:10


15:10 - 15:35

 Topic 10: EUV lithography industrialization progress towards sub-10 nm production

 Speaker: Mr. Roderik van Es, Senior Director, Service and Product Marketing EUV, ASML

15:35 - 16:00

 Topic 11: Compound Semiconductors: Enabling Wireless Communications

 Speaker: Mr. David Danzilio, Senior Vice President of Technology, Win Semiconductors

16:00 - 16:25

 Topic 12: Semiconductor Manufacturing BKM’s For The Automotive Supply Chain

 Speaker: Dr. Douglas Sutherland, Principal Scientist, KLA Tencor

16:25 - 16:50

Topic 13: New Approach for Lithography Equipment

Speaker: Mr. Rone Chiu, Sales Vice President, Jasper Display Corp



■ Programs are subject to change without prior notice. 

■ All presentations will be conducted in English. 

■ No recording/photography during the seminar.



Early Bird / SEMI Taiwan

Original Price (Aug 16 - Onsite)



(Currency: NTD)


Group Registration (July 15 - Aug 15)

3-5 people

6 people above



(Currency: NTD)








SEMI Taiwan

Ms PonPon Lo

TEL: 886.3.560.1777 EXT. 511

Email: semiprogramtw@gmail.com


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