Imagine your Digital and Energy Transition with Leti - Day3


 Friday, September 15th, 2017


 11:00 - 14:30


 Room 449, Taipei Nangang Exhibition Center, Hall 1, Taipei, Taiwan


  Imagine your Digital and Energy Transition with Leti​



 Forum Outline: 


Leti is a technology research institute localized in Grenoble (France) and recognized as a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions. Committed to innovation, its teams create differentiating solutions for Leti’s industrial partners. By pioneering new technologies, Leti enables innovative applicative solutions that ensure competitiveness in a wide range of markets. Leti tackles critical, current global issues such as the future of industry, clean and safe energies, health and wellness, safety & security…

Leti's multidisciplinary teams deliver solid micro and nano technologies expertise, leveraging world-class pre-industrialization facilities. For 50 years, the institute has been building long-term relationships with its industrial partners providing tailor-made solutions and a clear intellectual property policy.

A team of experts will be present during SEMICON Taiwan 2017 in order to present Leti's activities and discuss potential collaborations:

-       Silicon Platform for micro and nano technologies including advanced lithography innovations such as multi-ebeam lithography and  Nanoinprint

-       Digital, RF and advanced 3D technologies to sustain 5G and IoT systems roadmaps

-       Imaging and Photonics technologies including MicroLed displays and sensors





















Topic & Speaker

11:00 - 12:00

 Photolithography activities at CEA-Leti

 Technologies portfolio & roadmaps

 1- Multi-Beam

 2- Nano-Imprint

 3- DSA

 Resources & Platforms

 Laurent Pain, Lithography Program Manager, Silicon Technologies Division

 Fabrice Geiger, Head of Silicon Technologies Division

 Sothachett Van, S/C Equipment & Materials Business Developper, Silicon technologies Division


In the lithography development landscape, optical lithography is the standard battle horse of the semiconductor industry. Nevertheless, it should not be identified as the St Graal of the patterning technique. Indeed, alternative lithography such massively parallel electron beam technology (ML2) or stamp and repeat advanced imprint (NIL) and even Directed Self Assembly by block copolymer (DSA) have a high-level of competitive advantages, as they offer challenging and credible industrial compromises for the development of advanced lithography processes.

With its key partners MAPPER Lithography BV, EV Group and ARKEMA, CEA-Leti built collaborative industrial programs focused on the development of these alternative and low cost lithography technologies for CMOS and other manufacturing segments. This presentation will draw an overview of these 3 industrial programs. A technological and business statement of each technology will be detailed including the work and ecosystem environment inside CEA-Leti.


 CEA-Leti General Presentation

 Hughes Metras, Director of Nanoelec IRT 3D Technologies



■ Programs are subject to change without prior notice. 

■ All presentations will be conducted in English. 

■ No recording/photography during the seminar.



Early Bird / SEMI Member

Original Price (Aug 16 - Onsite)



(Currency: NTD)



Mr. Louis Didier

Email: didier.louis@cea.fr 



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