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Laser Technologies in Advanced Packaging Process

 Date:

Thursday, September 14th, 2017

 Time: 

13:00 - 16:15 (13:00 - 13:30 for registration)

 Venue:

 Room 402c, Taipei Nangang Exhibition Center, Hall 1, Taipei, Taiwan

 Theme:

 Laser technologies in advance packaging process

 

 

 Forum Outline:TBD 

 

 

Organizer:

 

 

Co-organizer:

   

 

Sponsor:

     

 

Agenda

Time

Topic & Speaker

13:00 - 13:30

 Registration

13:30 - 14:00

 Topic 1: Laser Technologies in Packaging/SiP Process

 Speaker: Mr. YE Yeh, VP of Advanced Packaging, ASE

14:00 - 14:30

 Topic 2: TBD

 Speaker: Mr. Michael Lang, Semicon Industry Manager, TRUMPF

14:30 - 14:45

 Break Time

14:45 - 15:15

 Topic 3: DISCO Laser Solutions

 Speaker: Mr. Eddie Liu, Manager of Sales Dept. / Sales Unit, DISCO

15:15 - 15:45

 Topic 4: Laser Via Formation for Advanced Packaging

 Speaker: Mr. Nimrod Bar-Yaakov, Director, Laser Drilling Product Line, Orbotech Ltd

15:45 - 16:15

 Networking

■ Programs are subject to change without prior notice. 

■ All presentations materials will be conducted in English, presentation language is Chinese. 

■ No recording/photography during the seminar.

 

Price

Early Bird / SEMI Member

Original Price (Aug 16 - Onsite)

Free

Free

(Currency: NTD)

 


Contact

SEMI Taiwan

Ms. PonPon Lo

TEL: 886.3.560.1777 EXT. 511

Email: semiprogramtw@gmail.com

 

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