As the semiconductor manufacturing keeps shrinking, the advanced packaging technology moves towards heterogeneous integration and 3D system-in-package, and the innovation and development of materials play the more important role in the progress of semiconductor processing technology.

This year, Taiwan is the global wafer manufacturing and advanced packaging base and continuing to be the world’s largest buyer of semiconductor materials for the 8th consecutive year.

The Materials pavilion has run blooming event campaigns at SEMICON Taiwan, includes Materials Forum, TechXPOT Speech Opportunities and Materials Get Together, and provides a platform for semiconductor materials companies of the industry supply chain to connect with buyers from all over the world.

SEMICON Taiwan 2018 Materials Pavilion Exhibitors 

 J2238  AI Technology, Inc.
 I2327  Arkema (China) Investment Co., Ltd.
 J2340  Atotech Taiwan Ltd
 J2335  BCnC CO., LTD
 I2316  CohPros International Co., Ltd
 I2323  CR GEMS Superabrasives Co., Ltd.
 I2228  Dongjin Semichem Co., Ltd.
 J2240  Indium Corporation of America
 J2339  Jiangsu Junhua High Performance Specialty Engineering Plastics (PeeK) Products Co., LTD.
 J2234  Kyzen Corporation
 I2322  Luoyang Liming Daesung Fluorine Chemical  Co., Ltd
 I2216  Namics Corporation
 I2423  Neuto Products Corporation
 I2222  Pibond Oy
 I2425  SEKISUI Chemical (Taiwan ) Co., Ltd
 I2330  Shenmao Technology Inc.
 J2334  Yuhon Enterprise Corporation
Share page with AddThis