SEMICON Taiwan 2011

Market Trend Forum 

 

For online registeration, please click "Register Now" icon !  

Wednesday, September 7th, 2011
13:30 – 17:00
201 DEF, TICC
Event Fee : Free (Pre-registration is required) 

 

Theme: Semiconductor Market Outlook

Chair : Dr. Burn Lin, Chairman, SEMI Taiwan IC Committee, R&D Vice President, TSMC

Co-chairs :
Mr. Tony Chao, Vice Chairman, SEMI Taiwan IC Committee, Managing  Director,  ASML Center of Excellence, ASML Taiwan Ltd.
Mr. CY Shu, Vice Chairman, SEMI Taiwan IC Committee, President, Hermes-Epitek Corp.

 

Moderator : 

Dr. Daniel P. Tracy, Sr. Director, Industry Research, SEMI

Outline:
If you're looking to learn about the latest analysis and forecasts of semiconductor market outlook for semiconductor capital equipment spending and materials market growth, explore how semiconductor industry value chain is going to change, discover DRAM market in the near future or simply connect with the semiconductor industry leading experts, executives, and top analysts, you just can’t miss this great opportunity to attending Market Trend Forum in SEMICON Taiwan 2011.

 

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Agenda :

13:30 - 14:00

Registration

14:00 - 14:10 

Welcome Remarks

Dr. Daniel P. Tracy, Sr. Director, Industry Research, SEMI

14:10 - 14:40

A Stagnant Growth

Mr. Andrew Lu, Head of Asia Pac ex-Japan Semiconductor and TFT Research, Barclays Capital Securities Taiwan Limited

14:40 - 15:10

TBD

Mr. Nicolas Gaudois, Managing Director, UBS Investment Bank

15:10 - 15:30

Break Time

15:30 - 16:00

Semiconductor Markets and Manufacturing -  Adapting to the New Normal

Mr. Jim Walker, Research VP, Gartner Inc.

16:00 - 16:30

Evolution of Advanced Packaging: 3DIC trends and mid-end foundries growth are changing the rules of IC packaging

Mr. Jean-Christophe Eloy, President and CEO, Yole Développement 

16:30 - 17:00

Semiconductor Equipment and Materials Outlook 

Dr. Daniel P. Tracy, Sr. Director, Industry Research, SEMI 

17:00

Adjornment 

 

˙Programs are subject to change without prior notice.
˙All presentations will be conducted in English.

 

Chair Introduction:


 

Dr. Burn Lin, Chairman, SEMI Taiwan IC Committee, R&D Vice President, TSMC
● 1970 Ohio State University  Ph. D. Elec. Eng.
● 1963 National Taiwan University B.S. Elec. Eng.
● 2000~present Senior Director, R&D, Nanopatterning Technology Division, TSMC
● 1992~2000 President, Linnovation, Inc
● 1970~1992  Department Manager, Research Staff Manager, Research Staff Member, IBM

 

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Co-Chairs Introduction: 

 

Mr. Tony Chao, Vice Chairman of SEMI Taiwan IC Committee, Managing Director, ASML Center of Excellence, ASML Taiwan Ltd.

ACE is ASML’s newly formed corporate initiative, building on talent incubation for the future.  This center will have a number of activities such as development & engineering, sourcing, applications services, training, customer equipment support, logistics, system repair and refurbishment.  Tony joined ASML in June of 2005 as the Customer Support Director for China.

Prior to joining ASML, Tony was the General Manager of BOC Edwards in Taiwan, a British based semiconductor chemical and gas solution provider in systems and materials.

Before BOC Edwards, Tony was the Vice President of Sales and Marketing of Ashland Union Electronic Chemical Corporation, a joint venture between Ashland Chemical in the USA and Union Petrochemical Corp. in Taiwan, serving the semiconductor materials industry.

Tony has a Bachelor of Science degree in aeronautics and astronautics from University of Washington in Seattle.  Tony also attended the Executive Development Program at the Northwestern University, Kellogg School of Management.

 

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Mr. CY Shu, Vice Chairman of SEMI Taiwan IC Committee, President,
Hermes-Epitek Corp.

Mr. CY Shu has devoted himself to FPD and Semiconductor realm for more than 30 years, achieving the development of IC industry in Taiwan originated in transferring technology from RCA Company, USA.   In his long career path, Mr. CY Shu contributed to the IC industry through executive management position at ITRI, TSMC and UMC.  He joined Hermes-Epitek in 2001, and since then has served as president & COO. 

Mr. Shu has earned a Master degree of Optoelectronics from NCTU in 1985. He was honored by placement on the list of "1994 The Executive Who's Who, Taiwan" and received an Outstanding Alumnus Award from NCTU in 1999.

 

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Moderator Introduction:

 

 

Dr. Daniel P. Tracy, Sr. Director, Industry Research, SEMI

SEMI Senior Director, Industry Research & Statistics
Research Associate with Rose Associates
Packaging Engineer at National Semiconductor
Ph.D. in Materials Engineering from Renssellaer Polytechnic Institute
M.S. in Materials Science & Engineering from Rochester Institute of Technology
B.S. in Chemistry from SUNY College of Environmental Science & Forestry

 

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Speaker Introduction:

 

Mr. Andrew Lu, Head of Asia Pac ex-Japan Semiconductor and TFT Research, Barclays Capital Securities Taiwan Limited

 

• Led Asia Pacific semiconductor and TFT-LCD research team of Citi Investment Research for 10 years
• No.1 ranking in Institutional Investor’s Asia Research survey during 2007 to 2010
• No.1 ranking in the Asiamoney survey during 2006 to 2010
• MBA in Finance from San Diego State University

 

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Mr. Jim Walker, Research VP, Gartner Inc.

 

VP of U.S. Sales/Marketing -Hana Semiconductor. IC Subcontract Packaging

Surface Mount Packaging Marketing Manager – National Semiconductor

Director of Q.A. – E.I. DuPont

Co-founder  and President Emeritus - Surface Mount Technology Association (SMTA)

Past Advisory Board Member – Surfect Technologies and Bridgewave Communications

●  Past Advisory Board Member – Advanced Packaging Magazine

Board of Advisors– Micro Electronic Packaging/Test Engineering Council (MEPTEC)

●  Guest Lecturer – University of California, Berkeley

 

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Mr. Jean-Christophe Eloy, President and CEO, Yole Développement

Main competencies:
▪ Competencies in consulting and marketing
▪ Strategy analysis and management consulting
▪ Market analysis and action plans
▪ Business development and contract negotiation
Experience At Yole Developpement:
JC Eloy has created and is managing Yole Développement in term of international development and strategic orientations of the company. He has performed more than 100 actions or analysis for the different customers of Yole Développement (from materials and equipment to devices and modules)
JC Eloy is also managing within Yole Développement the services for the financial investors (M&A, evaluation of business plan...)
Previous Experience:
JC Eloy has been 6 years manager of the marketing department of LETI (France), applied R&D organization involved in the semiconductor, Mems and instrumentation fields (1000 researchers). He then created the semiconductor practice at Ernst & Young in Europe. Jean-Christophe Eloy is involved since 1991 in the Mems and compound semiconductor areas.
Education:
JC Eloy is Engineer and has a MBA from EM Lyon.

 

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Presentation Abstract:

 

A Stagnant Growth

 

 

1) Net die capacity growth of 30% yoy and packaging/test capacity growth of 20% yoy vs. 15% or less for demand growth
2) What could drive us to change our 3-Negative view?

3) Area for growth in the next 3~5 years

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Mr. Andrew Lu, Head of Asia Pac ex-Japan Semiconductor and TFT Research, Barclays Capital Securities Taiwan Limited

Semiconductor Markets and Manufacturing -  Adapting to the New Normal

Mr. Jim Walker, Research VP, Gartner Inc.



After a booming 2010, the semiconductor industry has taken a growth break in 2011 as the economy slows.  Following the biggest global financial crisis in over 75 years, semiconductor manufacturing markets returned with renewed optimism last year.  Now, as the first half of 2011 ended, utilization rates and production levels may have hit a plateau. The summer months generally see increased orders and improved conditions as the semiconductor food chain prepares for the holiday buying season.


However, our industry faces several obstacles for growth: Will consumer demand improve in next several months? Can the semiconductor industry maintain growth and profitability in the “new normal” for the economy? Can we continue to give away value? 

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Evolution of Advanced Packaging: 3DIC trends and mid-end foundries growth are changing the rules of IC packaging

Mr. Jean-Christophe Eloy, President and CEO, Yole Développement 

 

The 3D integration of ICs is poised to revolutionize both the front and back ends of the semiconductor industry—ushering in sweeping changes across supply and value chains.

Smaller form factor, improved performance, and cost down are the key drivers behind the rush to 3DICs. Add the 3DIC market’s potential to surpass the $4.5B mark by 2016, and that’s more than enough to attract a wide range of attention and inspire creativity and competition in the semiconductor industry.

 

One of the first 3DIC trends to emerge is the use of silicon or glass interposers. As the interconnect gap between the IC and substrate widens, it’s necessary to build a “bridge” between the I/O of the IC and substrate. The interposer market, being led by Hoya at the moment with glass substrates, is among the first signs of the growth of the “mid-end” foundry business and the potential of using front-end processes to deliver back-end services.

The semiconductor industry’s front-end and back-end structure has remained essentially the same for many years, with back-end services representing 10% of the business on average—it’s split 50/50 by IDMs such as Intel, TI, and ST, and by outsourced semiconductor assembly and test (OSAT) suppliers like ASE, Amkor, and STATS ChipPAC.

 

A strong value flow, however, is now shifting from the packaging houses to the front-end players since the emergence of wafer-level packaging (WLP) and 3DICs using through-silicon vias (TSVs). WLP and 3D TSVs were already an $800M business by 2009(Figure 3), and the market is now expected to continue to expand rapidly, thanks to flip chip, WLP, 3DICs with TSVs, and silicon and glass interposers.

 

The potential of a $4.5B 3DIC market by 2016 is a tempting business opportunity and many industry players are actively pursuing it. A key question remains: Who is best suited to build 3DICs ?

The presentation will highlight such changes and try to present the business potential and the changes that will happen in the supply chain.

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Semiconductor Equipment and Materials Outlook
Dr. Daniel P. Tracy, Sr. Director, Industry Research, SEMI

 

The presentation will highlight the latest year-to-date industry figures for semiconductor equipment and materials, along with the current SEMI forecast in these segments. Included in the update will be an brief overview of semiconductor and LED fab investment activity.

 



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