SEMICON Taiwan 2013

Litho/Mask Technology Symposium

 

  

Friday, September 6, 2013

08:30 – 15:45

Room 402 AB, 
4F, TWTC Nangang Exhibition Hall, Taipei

 

 

 

Theme : Enabling Single Digit Nanometer Nodes 

 

Forum Chair:  

Dr. Burn Lin / 林本堅, VP of R&D, TSMC / Chairman, SEMI Taiwan IC Committee
                 
Forum Co-Chair(s):

Mr. Tony Chao / 趙中榛, Vice Chairman of SEMI Taiwan IC Committee/Director, ASML Center of Excellence, ASML

 

Mr. CY Shu / 許金榮, Vice Chairman of SEMI Taiwan IC Committee/President &COO, Hermes-Epitek

 

Forum Moderator:

Morning Session: Dr. Burn Lin / 林本堅, VP of R&D, TSMC / Chairman, SEMI Taiwan IC Committee

 

Afternoon Session: Mr. Tony Chao / 趙中榛, Vice Chairman of SEMI Taiwan IC Committee/Director, ASML Center of Excellence, ASML


 

 

 
Brought to you by SEMI Taiwan IC Committee
                         Litho Program Organizing Committee
     
Organized by

 

      

 

 
Co - Organized by

 

        
Sponsored by 

 

 

      
 

 

 

Agenda 

Time

Topic& Speaker

08:30– 09:00

Registration

09:00 – 09:05

Welcome / Opening Remarks

Dr. Burn Lin / 林本堅, VP of R&D, TSMC / Chairman, SEMI Taiwan IC Committee

09:05 – 09:35

Morning Keynote : Trends shaping future photomask technology

Dr. Christopher J. Progler, CTO, Photronics Inc.

09:35 – 10:00

Mask Technology Development in EUV Lithography 

Dr. Anthony Yen / 嚴濤南, Director of NTID, TSMC

10:00 – 10:25

EUV Lithography for cost effective extension of Moore’s law

Dr. Kars Troost, Senior Product Manager, Product Group EUV, ASML

10:25 - 10:45

Break Time

10:45 - 11:10

Extending Lithography with Advanced Materials 

Dr. Douglas Guerrero, Senior Technologiest, Brewer Science, Inc. 

11:10-11:35

Advanced Mask Inspection Technologies for 22-nm and Beyond 

Mr. David Wu, Regional Product manager, RAPID, KLA-Tencor

11:35-12:00

E-beam Defect Inspection of EUV Masks and Wafers 

Mr. Fei Wang, Application Development  Manager, WWTS, Hermes-Microvision Inc.

12:00 – 13:00

Lunch Break

13:00 – 13:20

Registration

13:20 – 13:25

Welcome Remarks

Mr. Tony Chao / 趙中榛, Vice Chairman of SEMI Taiwan IC Committee/Director, ASML Center of Excellence, ASML

13:25 – 13:55

Afternoon Keynote : Extending Patterning Capability Using Directed Self-Assembly

Dr. Joy Cheng, Research Staff Member, IBM Almaden Research Center & IBM Taiwan

13:55 – 14:20

Towards 7-nm Node and Below Technologies by MEBDW

Mr. Shy-Jay Lin / 林世杰, Manager, Multiple E-beam Program, TSMC

14:20 – 14:45

Electron Beam Lithography – Roadmap to the Future of HVM Lithography with REBL

Mr. Paul Petric, Senior Director, REBL Systems Group, KLA-Tencor Corporation, USA

14:45 – 15:10

Multiple Patterning for Immersion Extension and EUV Insertion

Mr. Chris BencherDistinguished Technical Staff, Office of the CTO, Applied Materials, Inc.

15:10 - 15:35

Extending ArF Immersion Lithography for Multiple Patterning

Mr. Remi Pieternella, Senior Product Manager, ASML

15:35 - 15:45

Closing Remarks

Dr. Burn Lin / 林本堅, VP of R&D, TSMC / Chairman, SEMI Taiwan IC Committee

● Programs are subject to change without prior notice. 

● All presentations will be conducted in English.

● No recording/ photography during seminar.


Event Fee:

Price & Member Types 

Original & On-site price

 

Non-Member

USD$ 125

NTD$ 3,200 

SEMI Member

USD$ 100

NTD$ 2,500


● Price is not included with 5% tax