SEMICON Taiwan 2013

SEMI 450mm Technology Trend Workshop 


Wednesday, September 4th, 2013


Room 402 c, 4F, TWTC Nangang Exhibition Hall, Taipei                


Theme: Silicon Wafers – Future Standardization to Enable the Transition about 450mm                                                  


Outline :
Since 2008, SEMI has published over fifteen 450 mm wafer Standards, guided by customer requirements and supplier feedback. These Specifications, covering wafers, carriers, and loadports, have enabled the industry to continue the development of equipment, materials, interfaces, and processes, but further standardization will be necessary for a successful transition to manufacturing on 450 mm wafers. Speakers from Intel, G450C, and others will introduce some of these new concepts during this seminar.
Proposals discussed during this workshop will be considered for standardization by the SEMI Standards Advanced Wafer Geometry Task Force under the Silicon Wafer Committee.






Topic & Speaker

08:30 – 09:00


09:00 – 09:10

Welcome Remarks

James Amano, SEMI

09:10 – 09:40
Wafer Geometry Control for Advanced Lithography and SEMI Standards
Jaydeep Sinha, KLA Tencor

09:40 – 10:10

Notchless Wafer

Pinyen Lin, G450C

10:10 – 10:40  

Development and Current Status of 450 mm Wafer Manufacturing

K. Takaishi, SUMCO

10:40 – 11:10

New Edge Exclusion Proposal

Kwangwook Lee, G450C

11:10 – 11:40

Towards 450 mm Silicon Wafers

Mike Goldstein, Intel

11:40 – 12:00

Q & A




Programs are subject to change without prior notice. 

● All presentations will be conducted in English.

● No recording/ photography during seminar



Registration  Fee:

Price & Member Types

 Original & On-site Price 


NTD$ 2,000

SEMI Member

NTD$ 1,500






For further inquiries, please contact:

Ms. Cher Wu / SEMI

Tel: 886.3.560.1777 ext. 802