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Power and Compound Semiconductors Technology Forum

 Date:

 Thursday, September 14th, 2017

 Time: 

 08:30 - 17:05 (08:30 - 08:55 for registration)

 Venue:

 Room 401, Taipei Nangang Exhibition Center, Hall 1, Taipei, Taiwan

 Theme:

 Emerging opportunities: “Compound semiconductors for wide band gap power electronics, next generation communications and beyond”

 

 Forum Chairman & Vice Chairman:

Forum Chairman
Dr.  Herman Chang, CTO, Power System BG, Delta Electronics, Inc./ Co-Chairman, SEMI Taiwan Power & Compound Semiconductors Committee

Mr. Brian Lee, CSO, Win Semiconductors Corp./ Co-Chairman, SEMI Taiwan Power & Compound Semiconductors Committee
Forum Vice Chairman

Dr. Yi-Cheng Cheng, General Director, Materials & Electro-Optics Research Division / Vcie Chairman, SEMI Taiwan Power & Compound Semiconductors Committee

Mr. Andy Chuang, President, Episil Technologies Inc./ Vcie Chairman, SEMI Taiwan Power & Compound Semiconductors Committee

Dr. Barry Lin, CTP & Vice President, Wavetek Microelectronics Corporation / Vcie Chairman, SEMI Taiwan Power & Compound Semiconductors Committee

 Forum Moderator: 

Morning Session Moderator:

Dr.  Herman Chang, CTO, Power System BG, Delta Electronics, Inc./ Co-Chairman, SEMI Taiwan Power & Compound Semiconductors Committee

Mr. Andy Chuang, President, Episil Technologies Inc./ Vcie Chairman, SEMI Taiwan Power & Compound Semiconductors Committee

Afternooon Session Moderator:

Mr. Brian Lee, CSO, Win Semiconductors Corp./ Co-Chairman, SEMI Taiwan Power & Compound Semiconductors Committee

Dr. Barry Lin, CTP & Vice President, Wavetek Microelectronics Corporation / Vcie Chairman, SEMI Taiwan Power & Compound Semiconductors Committee

 Forum Outline: 

 

Beyond the boom in silicon semiconductor market, growing demand for more efficient energy management from solar inverters, high speed train, to electric vehicles is also spurring innovation and opportunities in SiC and GaN compound semiconductor processes for high voltage power electronics.

Increasing needs for high data transmission rates, low latency, and low power consumption in the upcoming 5G communication era represent big growth opportunities for high-speed, high-efficiency compound semiconductor devices.

 

 

 

Organizer:

 

 

 

 

 

 

 

 

Sponsor:

           
       

 

 

 

Agenda

Time

Topic

08:30 - 08:55

 Registration

08:55 - 09:00

 Welcome Remarks by SEMI Executives:

 Mr. Peter Gillespie, Chief Marketing Officer, SEMI

 Opening Remarks

09:00 - 09:30

 Keynote1:  WBG Device Application for Electric Vehicle Charging System

 Speaker: Dr. Yungtaek Jang, Senior Member of R&D Staff, Delta Products Corporation; Fellow of IEEE

09:30 - 10:00

 Keynote 2: SiC and GaN in Automotive Power Electronics

 Speaker: Mr. Thomas Heckel, Project manager and Senior Engineer, Fraunhofer Institute for Integrated Systems and Device Technology IISB

10:00 - 10:30

 Topic 3: Accelerating Adoption: of SiC power with Practical, Ready-to-Use SiC Devices and Circuit Solutions that Enable Better, More Efficient Power Systems

 Speaker: Mr. Guy Moxey, Sr. Director, Wolfspeed RTP

10:30 - 10:50

 Break

10:50-11:20

 Topic 4: 200mm/8-inch GaN-on-Si CMOS compatible manufacturing technology

 Speaker: Dr. Denis Marcon, Business Development Manager, imec

11:20 - 11:50

 Topic 5: Defect Inspection and Process Control Solutions for Compound Semiconductor Materials

 Speaker: Mr. Thomas Pierson, Director of Marketing and Applications Engineering, KLA-Tencor

12:00 - 13:30

 Compound Semiconductor Industry Networking Luncheon

13:35-14:05

 Keynote 1: IOT Path to 5G 

 Speaker: Mr. Dave Hoelscher, VP Marketing Director of IoT Solutions, HUAWEI

14:05 - 14:35

 Keynote 2: 5G & New Technology Trends

 Speaker: Dr. Jerry Lin, CTO, Airoha

14:35 - 15:05

 Topic 3:  GaAs capability for 5G

 Speaker: Dr. Wen-Kai Wang, Technical Director, WIN Semiconductors

15:05 - 15:25

Break

15:25 - 15:55

 Topic 4: 5G Technology

 Speaker: : Dr. Allen Hanson, Director of Process Development, MACOM

15:55 - 16:25

 Topic 5: Enabling Power and 5G RF-GaN Electronics through Innovative MOCVD Technologies

 Speaker: Mr. Somit Joshi, Sr. Director of Marketing, Veeco

16:25 - 17:05

 Topic 6: From Technology to Market, how will Compound Semiconductor reshape RF and Power Electronics applications?

 Speaker: Dr. Pierric Gueguen, Business Unit Manager - Power Electronics, Compound Semiconductor, Energy & Battery Management, Yole Développement

■ All presentations will be conducted in English. 

■ Programs are subject to change without prior notice. 

■ No recording/photography during the seminar.

 

Price

Early Bird / SEMI Member

Original Price (Aug 16 - Onsite)

3200

4000

(Currency: NTD)

 

Group Registration (July 15 - Aug 15)

3-5 people

6 people above

  2800

2800

(Currency: NTD)

         

 

 

           
               

Contact

SEMI Taiwan

Ms PonPon Lo

TEL: 886.3.560.1777 EXT. 511

Email: semiprogramtw@gmail.com

 

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