+886.3.560.1777

English


Programs Catalog

Programs Catalog

CMP Room 504b Friday, September 07
9:00am to 12:00pm

Date:Friday, Sept. 07, 2018
Time:9:00 - 12:00 
Venue:Room 504b, 5F, TWTC Nangang Exhibition Center Hall 1

Organizer:

Registration Link: http://www.cmpug.org.tw/signon_detail.php?id_c2=21&act=ok&date_index=c20180625100627

View Full Agenda
Advanced Packaging Grande Luxe Banquet Tuesday, September 04
8:00am to 5:40pm

Date:Tuesday, September. 04, 2018
Time:8:30 - 18:30 (08:30 - 09:00 for registration)
Venue:Grand Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei 
Theme:Innovative Leadership for 3D-SiP Advanced Packaging Technology
Forum Chairman: Mr. Albert Lan/ 藍章益, Global Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee
Forum Moderator:
• Mr. Albert Lan/ 藍章益, Global Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee
• Ms. Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science

Outline:

    New application markets, such as Networking, AI, Autonomous Car, 5G, and IOT/Wearable are enabling a new vision era of advanced packaging technologies, including SiP, Fan Out, 3DIC, and 2.5DIC, and also initializing some  innovative Equipment  & Material, and CtW/WtW Hybrid Bonding solution developments.

    To address equipment & material solutions for advanced packaging technology, the forum have invited lots of experts from Fabless design house, IDM, Foundry, Packaging, Equipment and Materials suppliers to share their treasure experiences on future technology development roadmap, challenges, and packaging solutions.

■ Forum focal points:

● Addressing on advanced packaging technologies, including SiP, Fan Out, 3DIC and 2.5DIC
● Addressing innovative Equipment, Materials, and CtW/WtW Hybrid Bonding technology solutions.
 

■ Forum will deep dive:

I.   Research and market trends of latest new applications

II. System and product applications

III. Innovative packaging technology challenges and solutions

IV. Novel material & equipment solution readiness

Early-Bird Regular
NTD 4,800  NTD 6,000

* Tax Included

 
 
 
                               
 
 

* Forum agenda is subject to change

 
 
 

Sponsored by:

                                                        

 

 

View Full Agenda
Test Friday, September 07
8:30am to 5:00pm

Date:Friday, September 07, 2018
Time:08:30 - 16:15 (08:30 - 09:00 for registration)
Venue:Room 504a, 5F, TWTC Nangang Exhibition Center Hall 1

Organized by       

 

Early-Bird Original
Free Free

 

 

View Full Agenda
Speaker : JC Hsu
Corporate Vice President
MEDIATEK
Wednesday, September 05
2:25pm to 2:50pm
Wednesday, September 05
10:00am to 4:00am

Forum

Time

Venue

 

IC 60 Years – Master Forum

 

September 5, 2018

Taipei-Nangang Exhibition Hall 4F Master Forum Stage (#M1156)

 

Market Trends Forum

 

September 5, 2018 Taipei-Nangang Exhibition Hall  4F

 

View Full Agenda
Career Development Forum Booth I3016, Meet the Expert Theater, 1F, Hall 1, Taipei Nangang Exhibition Center Friday, September 07
1:00pm to 3:25pm

Date:Friday, September. 07, 2018

Time:13:00 - 15:25  (13:00 - 13:30 for registration)

Venue:Booth I3016, Meet the Expert Theater, 1F, Hall 1,Taipei Nangang Exhibition Center

*This forum will be conducted in Mandarin.

 

Sponsors :

 

Partner :

   
ASML SUSS MicroTec

TEL

 

104獵才顧問                          

 

 

 

Please download the “group registration” excel and fill in. Then kindly email to semi.workforce.@gmail.com to complete the registration. 

 

View Full Agenda
Career Trend in Semiconductor Industry Booth I3016, Meet the Expert Theater, 1F, Hall 1, Taipei Nangang Exhibition Center Thursday, September 06
10:20am to 11:00am

Date:Thursday, September. 06, 2018

Time:10:20 - 11:00  

Venue:Booth I3016, Meet the Expert Theater, 1F, Hall 1,Taipei Nangang Exhibition Center

*This forum will be conducted in Mandarin.

 

Sponsors :

 

Partner :

   
ASML SUSS MicroTec

TEL

 

104獵才顧問                          

 

 

 

Please download the “group registration” excel and fill in. Then kindly email to semi.workforce.@gmail.com to complete the registration. 

 

View Full Agenda
Circular Economy Room 504c Friday, September 07
9:30am to 4:30pm

Date:Friday, September 07, 2018
Time:09:30 - 16:30 (09:30 - 09:50 for registration)
Venue:Room 504c, 5F, TWTC Nangang Exhibition Center Hall 1

Early-Bird Regular
Free Free
 
 

Co-Organized by

                        

Sponsored by

 

 

* Forum agenda is subject to change

View Full Agenda
SMART MedTech Grande Luxe Banquet Luxury Ballroom Friday, September 07
8:30am to 12:00pm

Date: Friday, September 07, 2018
Time: 08:30 – 12:00 (08:30-08:55 for registration)
Venue: Luxury Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei 

*The forum will be conducted in Chinese.

Speakers:

Long-Sheng Fan

Iridium Medical Technology Company
 
 

Chung-Yu Wu

Professor of Department of Electronics Engineering
NCTU

Ted Chang

CTO and Vice President
Quanta
 
   

 

 

Panelists:

Alex Wang 

President
Powerchip 
 

Chii-Wann Lin 

General Director of Biomedical Technology and Device Research Labs
ITRI

Pan-Chyr Yang

Chairman
Taiwan Bio-Development Foundation
 
   

 

 

Organzied by:                 
Co-organzied by:      
Concurrent Events:

 

 

Early-Bird Regular
Free Free
 
 
 
* Forum agenda is subject to change
View Full Agenda
ESD Alliance VIP Reception with Executive Panel Grand Hyatt Ballroom II Tuesday, September 04
5:50pm to 8:30pm

Date: Tuesday, September 4, 2018

Time: 17:50-20:30 (17:00-17:50 for registration)

Venue: Grand Ballroom II, 3F, Grand Hyatt Taipei

Moderator:

Liu Jingxiu-AI Market Director Xilinx

Tzi-Dar Chiueh

Professor, Electrical Engineering Dept.

National Taiwan University
     

Panelists:

Jacky-CEO SitechElectric Automobile

Michael Shih

Corporate Vice President
Cadence
  Ram Shallom-VP of Marketing & Business Development  Autotalks

Danny Perng

PacRim Vice President
Mentor, A Siemens Business

Jun Pei-CEO Cepton Technologies

David-RJ Lin

Corporate Senior President, AsiaPac Region
Synopsys
 
  Anthony Le-Senior Director of Marketing Macronix

Chi-Feng Wu

Senior Director
Realtek Semiconductor Corp.

 

Contact​: Mr. Chris Su / Tel: 886.3.560.1777 ext.289 / Fex: 886.3.560.1555 / Email: staiwan1@semi.org

Organizer​                                                                                                                                                                         

*The organizer reserves the right to change, terminate the activity and review the qualifications.

 

(as of August 16)

View Full Agenda
High-Tech Facility Room 402ab Thursday, September 06
8:30am to 5:00pm

Date:Thursday, Sept. 06, 2018
Time:8:30 - 17:30 (08:30 - 09:00 for registration)
Venue:Room 402ab, 4F, TWTC Nangang Exhibition Center Hall 1
Theme:Effective Ways to Make Facility Smart- II
Forum Chairman: Arthur Chuang, Senior Director, TSMC
Forum Moderator:Luh-Maan Chang, Professor Emeritus, NTU and Purdue University
Organizer:SEMI Taiwan High-Tech Facility Committee
Co-organizer:NTU Yen Tjing Ling Industrial Research Institute
                         NTU High-Tech Facility Research Center at Zhubei
Forum Website:http://htftaiwan-eg.weebly.com/2018-high-tech-facility-international-forum

View Full Agenda
AI Room 401 Friday, September 07
8:30am to 5:00pm

Date:Friday, September. 07, 2018
Time:8:30 - 16:25 (08:30 - 09:00 for registration)
Venue:Room 401, 4F, TWTC Nangang Exhibition Center Hall 1
Theme:The AI Era – A Big Thing in Semiconductor Industry
Forum Chairman:Dr. John Lin/林進祥, Director, TSMC/ Chairman, SEMI Taiwan IC Committee
Forum Vice Chairman:
• Mr. Rutgers Chow/周雷琪, President of SPTS Asia, SPTS Technologies/ Vice Chairman, SEMI Taiwan IC Committee
• Mr. G.C. Hung/ 洪圭鈞, Vice President, UMC/ Vice Chairman, SEMI Taiwan IC Committee

Forum Moderator:
• Ms. Mavis Ho/ 何玫玲, Head of Strategic Partnership, Taiwan and Singapore, imec/ SEMI Taiwan IC Committe

Theme - The AI Era – A Big Thing in Semiconductor Industry

Outline –

    As a dream of human being, the Artificial Intelligence (AI) has been realized and currently booming in light speed during our life time.  Innovative algorithms and mighty computing capabilities enable the great revolutions and has now led us  to the era of AI which we all have been waiting for in the silicon industry.

    If the algorithm is the soul of AI, the chip would be the heart to equip AI for the wide spectrum of applications in terms of self-driving vehicles, automation, robotics, precision healthcare, retail, etc. From chips for AI to AI-dedicated chips, Semiconductor Technologies served an integral enabler to facilitate innovations and revolutions in the AI areas of computing and consumer electronics.

    To embrace challenges and seize opportunities, IC designers and producers explore applications and use scenarios in computing, consumer, and communications, to drive and bring them to the AI era. Leading components such as application processors (APUs), memory, image sensors, wireless communication chips, GPU and TPU (Tensor Processing Units), all come together to enable the functionalities of the AI applications. Riding on the tailwind of the AI era, we have been witnessing the rise of high-performance computing (HPC), internet of things (IoT), machine learning (ML), virtual reality (VR) and augmented reality (AR). Artificial Intelligence heralds dramatic potential for both economy and humans. It will be likely to soar into one of the largest in the world, a trillion-dollar industry in the near future.

    At the upcoming SEMICON Taiwan, the IC Forum will feature exciting topics around the market outlook as well as the chip design and making for the AI applications. Renowned experts in the industry are invited to share their perspectives and discuss the vast commercial opportunities for the electronics industries and semiconductor supply chain in this new and exciting era.

 
Early-Bird Regular
NTD 3,200 NTD 4,000

* Tax Included

 
 
 
                   
 
 
* Forum agenda is subject to change
 
 
 

Sponsored by:

                             

 

View Full Agenda
Keynotes & Executive Panels Master Forum Stage, 4F, Hall 1, Taipei Nangang Exhibition Center Wednesday, September 05
8:30am to 5:00pm

*Live-broadcasting in Room 402c is fully booked, please go to Area K, 1F for standing live-broadcasting onsite!

Date:Wednesday, September. 05, 2018
Time:08:30 - 17:00 (08:30 - 09:00 for registration)
Venue:Master Forum Stage, 4F, Hall 1, Taipei Nangang Exhibition Center (Booth M1156)
Theme:Future Starts Here

 

Co-Organizer:  

Outline:

This forum is jointly organized by MOST(Ministry of Science and Technology) and SEMI Taiwan and the feature of this year is to celebrate the IC 60 Anniversary with all the industry predecessors, elites and everyone who continues contributing in this field. And this will be held together for the first day event with SEMICON Taiwan 2018.

Through the core of forum planning: Reviewing the Past & Inspiring the Future, we will invite grand masters who have made outstanding contributions of IC development to pass down the legacy of experiences in the morning session, and will discuss related issues of semiconductor emerging development in the afternoon. With that, we hope to light up the enthusiasm of technology for more younger students.

 

 

 
Early-Bird Regular
Free Free

*Tax Included

 
 

                

 
 
* Forum agenda is subject to change
 
 
 

Sponsored by: 

                          

 

View Full Agenda
Laser Room 402c Thursday, September 06
1:00pm to 4:40pm

Date:Thursday, September 6, 2018
Time:13:00 - 16:40 (13:00 - 13:40 for registration)
Venue:Room 402c, 4F, TWTC Nangang Exhibition Center Hall 1
Theme:How Laser Technologies can Better Support in Advanced Wafer Level Packaging?

 

 

Keynote Speakers 
 
       
   

Judge Li

Advanced Product Development Division

               

                     

Mr. W.M. Chen

Deputy Director             

Dr. Y.J. Lai 

Manager                                                                             

                                                     

 

Sponsors        
                                                                                                                 

* Forum agenda is subject to change

View Full Agenda
Market Trend Room 401 Wednesday, September 05
1:00pm to 5:00pm

 

Date:Wednesday, September. 05, 2018
Time:13:00 - 16:30 (13:00 - 13:20 for registration)
Venue:Room 401, 4F, TWTC Nangang Exhibition Center Hall 1/ 台北南港展覽館一館 4樓 401會議室

Outline: 

After a record-breaking in 2017, will the surge continue?
The demand from artificial intelligence, cloud, and IoT for semiconductor products is expected to have greater impact on revenue in 2018 compared to prior years. And we expect to portray the current and future scenario of all the segments of semiconductor industry on a global level.

 
Early-Bird Regular
NTD 2,000 NTD 2,500

*Tax Included

 
 

 
 
* Forum agenda is subject to change

 

View Full Agenda
MEMS & Sensors Room 401 Thursday, September 06
8:30am to 5:00pm

 

Date:Thursday, September. 06, 2018
Time:08:30 - 15:35 (08:30 - 09:00 for registration)
Venue:Room 401, 4F, TWTC Nangang Exhibition Center Hall 1/ 台北南港展覽館一館 4樓 401會議室
Theme:IoT – From Concept to Reality
Forum Chairman: Mr. H.C. Tuan/ 段孝勤, Director, TSMC/ Chairman, SEMI Taiwan MEMS & Sensors Committee
Forum Vice Chairman:
• Mr. Giuseppe Izzo/尹容, Managing Director of STMicroelectronics Taiwan, Vice President of APAC Region, STMicroelectronics/Vice Chairman, SEMI Taiwan  MEMS & Sensors  Committee
• Dr. Weileun Fang / 方維倫, Distinguished Professor, PME Dept./NEMS Institute, NTHU/ Vice Chairman, SEMI Taiwan  MEMS & Sensors  Committee 
• Mr. Shao-Pin Ru/ 呂紹萍, President, Tong Hsing/ Vice Chairman, SEMI Taiwan  MEMS & Sensors  Committee

 

Co-Organizer: 

Outline: 

    The main theme of the 2018 SEMICON Taiwan MEMS & Sensors Forum is “IoT – from concept to reality” where the invited presentations from both industry and academia will demonstrate ongoing application scenarios using well established physical (sense), computation (edge computing), communication (5G), cloud, big data, and AI layers, thus enabling a real IoT era. Human beings have already experienced an IoT world which is even magnified by AI technology, and this is just a beginning! As also emphasized by the TSMC in 2018, the IoT now becomes one of the four driving engines to boost the growth of semiconductor industry while MEMS and Sensors play key roles in the physical layer of the IoT systems. Thanks to the fast deployment of cost-effective MEMS sensors and MicroSystems, the conventional industry, business, market, and even life have been greatly changed. As a result, foreseeing the trends enabled by the IoT era becomes extremely crucial, thus inspiring the main theme of this year, which features the applications such as Mobile, Drone, Microphone, and Medical Devices, etc. with excellent presentations offered by flagship companies worldwide. We highly look forward to your participations.

 
Early-Bird Regular
NTD 1,800 NTD 2,250

*Tax Included

 
 

           

 
 
* Forum agenda is subject to change
 
 
 

Sponsored by: 

                     

 

View Full Agenda
Wednesday, September 05
10:00am to 4:00am

Forum

Time

Venue

 

The Driving Force of AIOT:Future Semiconductor Applications

 

September 5, 2018

Taipei-Nangang Exhibition Hall 4F

 

2018 CMP Forum Taiwan 

 

September 7, 2018 Taipei-Nangang Exhibition Hall 5F

 

View Full Agenda
Power & Optoelectronics Semiconductor Room 402ab Friday, September 07
8:30am to 5:00pm

Date:Tuesday, September 07, 2018
Time:8:20 - 16:50 (08:20 - 08:50 for registration)
Venue:Room 402ab, 4F, TWTC Nangang Exhibition Center Hall 1

Forum Chairman:

  • Mr. Brian Lee/ 李宗鴻, CSO, Win Semiconductors/ Co-Chairman of SEMI Taiwan Power and Compound Committee
  • Dr. Herman Chang/ 張育銘, General Manager, Energy Infrastructure Solution BG, Delta Electronics/ Co-Chairman of SEMI Taiwan Power and Compound Committee

Forum Vice Chairman:

  • Dr. Yi-Cheng Cheng/ 程一誠, General Director, NCSIST/ Vice Chairman of SEMI Taiwan Power and Compound Committee
  • Mr. Andy Chuang/ 莊淵棋, President, Episil/ Vice Chairman of SEMI Taiwan Power and Compound Committee
  • Barry Lin/ 林嘉孚, CTO, Wavetek/ Vice Chairman of SEMI Taiwan Power and Compound Committee

Session 1
Theme:Wide Band Gap Power Electronics
Outline: 
A growing population and changes in life style will increase the demand for energy consumption in various segments including consumer, enterprise, industrial and e-mobility. The needs for more efficient and advanced energy systems are very clear trends. Because semiconductor has the advantage to process energy in micro-electronic way, it can effectively make power electronics systems to be much smaller, lighter, reliable and efficient, while being capable of operating at higher temperatures. While Si-based semiconductors will remain relevant, wide band gap devices based on SiC and GaN will be the main drivers in achieving a significant leap in performance due to their higher breakdown voltages, higher electron mobility and higher thermal conductivity. To bring up the most recent advances into perspective, the forum will address manufacturing and process technologies for wide band gap devices, as well as discuss new design approaches to reap the benefits of using new devices in modern applications such as e-mobility.

Session 2
Theme: 3D Sensing, VCSEL, LiDAR, MicroLED
Outline: 
Recently, the application of VCSEL to 3D sensing of facial recognition in i-phone X spurred a hype in consumer market. It provides a flexible biometric verification and promises a broad spectrum of security application. The use of VCSEL in LiDAR enables autonomous vehicle technology and creates a potential huge market for optoelectronics. Similarly, Samsung’s debut of its most premium TV using MicroLED in 2018 CES show drew a lot of attention. It paves a way for a very promising new display technology.
These are just some vivid examples of today’s optoelectronics applications which will change our daily life in years to come.

Early-Bird Regular
NTD 3,200 NTD 4,000

* Tax Included

 
        
 
 
*Forum agenda is subject to change

 

View Full Agenda
SEMI HTU Program - Day 1 Venue:Booth I3016, Meet the Expert Theater, 1F, Hall 1, Taipei Nangang Exhibition Center Wednesday, September 05
1:30pm to 4:00pm

Date:Wednesday, September. 05, 2018

Time:13:30 - 16:00 

Venue:Booth I3016, Meet the Expert Theater, 1F, Hall 1,Taipei Nangang Exhibition Center

 

Sponsors :

 

Partner :

   
ASML SUSS MicroTec

TEL

 

104獵才顧問                          

 

 

View Full Agenda
SEMI HTU Program - Day 2 Booth I3016, Meet the Expert Theater, 1F, Hall 1, Taipei Nangang Exhibition Center Thursday, September 06
1:30pm to 4:00pm

Date:Thursday, September. 06, 2018

Time:13:30 - 16:00 

Venue:Booth I3016, Meet the Expert Theater, 1F, Hall 1,Taipei Nangang Exhibition Center

 

Sponsors :

 

Partner :

   
ASML SUSS MicroTec

TEL

 

104獵才顧問                          

 

 

View Full Agenda
Materials Master Forum Stage Thursday, September 06
8:30am to 5:00pm

 

Date:Thursday, September. 06, 2018
Time:08:30 - 17:10 (08:30 - 09:00 for registration)
Venue:Master Forum Stage, 4F, TWTC Nangang Exhibition Center Hall 1/ 台北南港展覽館一館 4樓 大師論壇主舞台
Theme:Intelligent Material Clouds
Forum Chairman: Mr. Min-Te Chen/ 陳明德, Deputy Director, TSMC/ Chairman of SEMI Taiwan Materials Committee
Forum Vice Chairman:
• Dr. Joe Wu/ 吳宗禧, Deputy Director, TSMC/ Vice Chairman of SEMI Taiwan Materials Committee
• Dr. Jeffrey Yang/ 楊秉豐, Senior Department Manager, ASE/ Vice Chairman of SEMI Taiwan Materials Committee
• Mr. Brian Chen/ 陳致遠, Vice President, Wah Lee/ Vice Chairman of SEMI Taiwan Materials Committee

 

Outline: 

 
Early-Bird Regular
NTD 2,500 NTD 3,125

*Tax Included

 
 

       

 
* Forum agenda is subject to change

 

View Full Agenda
Tuesday, September 04 8:00am

Forum

Time

Venue

 

Advanced Packaging Technology Symposium

 

September 4, 2018 |  08:00 – 17:55 Grande Luxe Banquet Grand Ballroom 

 

SiP Global Summit 2018 – Day 1

 

September 6, 2018 |  08:30 – 17:00 Grande Luxe Banquet Grand Ballroom 

 

SiP Global Summit 2018 – Day 2

 

September 7, 2018 |  08:30 – 17:00

Grande Luxe Banquet Grand Ballroom 

View Full Agenda
SiP Grand Ballroom, Grande Luxe Banquet Grand Ballroom Thursday, September 06
8:00am to 4:50pm

Date: Thursday, September 6th, 2018
Time: 08:00-16:50
Venue:Grand Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei 
Theme: Wafer Level System Integration for Edge Computing, HPC and AI
Forum Chairman: Dr. Douglas Yu/ 余振華, Vice President, TSMC
Moderator: Dr. K.C. Yee/ 余國寵, Director, TSMC
Outline:
 
     Mobile, high-performance computing (HPC), automotive and internet of things  (IoT) have been identified as four main growth engines for semiconductor  industry. While artificial intelligence (AI) and 5G technologies are the key  drivers boosting aforementioned application growths.

     The pace of innovation is accelerating to meet ever-increasing diversification.  Ubiquitous computing emerges from science fiction into a daily life reality in  recent years, in part by handheld mobile computing, and in part by growing  popularity of personal wearable devices, inescapable sensors, and by  upcoming 5G enablement with affordable cost. On the other end of computing  spectrum, machine learning (ML), artificial intelligence (AI) have become key  drivers in cloud and high performance market. According IDC 2017, the global  data traffic will grow rapidly from 16 ZB in 2016 to 163 ZB in 2026, a 10X  growth in 10 years. System architects are hungry for higher performance  computing and wider data pipelines to meet such explosive demands.

     Foundry wafer level system integration (WLSI) leads the semiconductor  industry into a new era of system scaling beyond Moore's Law with two golden  examples of technology platforms. One is high density integrated fan-out (aka  InFO_PoP) in smartphone and the other is silicon interposer, 3D chip stacking  (aka CoWoS®) in HPC, ML, and AI. Adoptions of high density WLSI  technologies in application-specific systems like intelligent mobiles, smart  networks, 5G AIP (antenna in package), and HPC & AI with a larger Si  interposer size, more HBM cubes, higher TDP advanced SoC, and optical  interconnects become an unstoppable trend.

  In this forum, speakers from leading fabless design, foundry, HBM house, EDA  tools, market analysis, optical interconnect, and process tool supply will share  their insights and vision. Audience would benefit from this forum with the  followings

• Advanced WLSI technologies

• Market opportunity and landscape

• Novel enablement tools, materials, and processes

 

Early-Bird Regular
NTD 4,800 NTD 6,000

* Tax Included

        
 
* Forum agenda is subject to change
 
 
 

Sponsored by:

                 

 

View Full Agenda
SiP Grande Luxe Banquet Friday, September 07
8:40am to 4:20pm

Date: Friday, September. 07, 2018
Time:08:40-16:20
Venue:Grand Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei 
Theme:Future Package and Test for Smart Integration
Forum Chairman: 
• Dr. Yu-Po Wang/ 王愉博, Sr. Director, SPIL
• Dr. Cheng-Wen Wu/ 吳誠文, Distinguished Chair Professor, NTHU

 

Early-Bird Regular
NTD 4,800 NTD 6,000

*Tax Included

 
 
 
            
 
 
 
*Forum agenda is subject to change
 
 
 

Sponsored by:

         

View Full Agenda
SMART Automotive Grande Luxe Banquet Luxury Ballroom Tuesday, September 04
9:30am to 5:00pm

Smart Automotive Summit will take place on September 4, 2018. It is an annual automotive electronics and sensor technical and business conference in Asia which is the platform to bridge components and systems for shaping future mobility. With clearly defined topics, it will bring together leading experts in automotive and electronics to explore the trend and the path to realize the smart automotive future.

Date: Tuesday, September 04, 2018

Time: 08:55 – 17:10 (08:30-08:55 for registration)

Venue: Luxury Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei 

Moderator: Dr. Jwu-Sheng Hu  VP and General Direcotr, MMSL ITRI ; Chieh-Chih Wang Chief Digital Officer, MMSL, ITRI

Speakers:

Jacky Xian 

CEO
SitechElectric Automobile
 

Ram Shallom 

VP of Marketing & Business Development
Autotalks

Jun Pei

CEO
Cepton Technologies
 
 

Anthony Le

Senior Director of Marketing
Macronix
 
Senior Director, Intelligent Automotive Business Unit
MediaTek
 

Louay Eldada

CEO & Co-founder
Quanergy

 
Technical Project Development Director
Yole Développement
 
 
President and Founder
TechSearch International, Inc.
 
AI Market Director
Xilinx
     

 

Organizer      
         
Co-organizer      
         
Premier Level    
         
Gold Level      
         
Exhibitor                                                                                                                     

 

Price: SEMI-Member Early Bird : NT$ 3,150
  Non-Member Early Bird : NT$ 4,200
  SEMI Member On-Site : NT$ 4,200
  Non-member On-Site : NT$ 5,250
  Student : NT$ 2,100

 

(as of August 15)

  

View Full Agenda
SMART Manufacturing Room 504bc Wednesday, September 05
1:00pm to 5:00pm

 

Date:Wednesday, September 5, 2018
Time:13:00 - 17:10 (13:00 - 13:15 for registration)
Venue:Room 504bc, 5F, TWTC Nangang Exhibition Center Hall 1/ 台北南港展覽館一館 5樓 504bc會議室
Theme:Toward Intelligent Manufacturing with AI
Forum Chairman: Mr. Robert Chien/ 簡明正, Deputy Director, TSMC/ Chairman of SEMI Taiwan Smart Manufacturing Committee
Forum Vice Chairman:
• Mr. James Lin/ 林京沛, Deputy Division Director, UMC/ Vice Chairman of SEMI Taiwan Smart Manufacturing Committee
• Dr. Jimmy Chen/ 陳俊銘, Senior Director, ASE/ Vice Chairman of SEMI Taiwan Smart Manufacturing Committee

 

Co-Organizer: 

Outline: 

Most manufacturers in Taiwan now face a challenge, as intelligent manufacturing involves complex processes, multiple stakeholders, and information and communication technologies such as the AI.
It is crucial to have enterprise architecture and technology innovation leaders design the architecture and digital platform to integrate customers, partners' ecosystems and the AI, with IT support to build an intelligent, autonomous business and manufacturing process.

 
Early-Bird Regular
NTD 2,000 NTD 2,500

*Tax Included

 
 

    

 
 
* Forum agenda is subject to change

 

View Full Agenda
Sustainable Manufacturing Room 504b Friday, September 07
12:40pm to 5:00pm

Date:Friday, September. 07, 2018
Time:12:40-17:00 (12:40 - 13:10 for registration)
Venue:Room 504b, 5F, TWTC Nangang Exhibition Center Hall 1

 

 

         

 

Early-Bird Regular
Free Free
 
 
 
* Forum agenda is subject to change
View Full Agenda
Tuesday, September 04 8:00am

Forum

Time

Venue

 

Advanced Packaging Technology Symposium

 

September 4, 2018 Grande Luxe Banquet Grand Ballroom 

 

Smart Manufacturing Forum

 

September 5, 2018

Taipei-Nangang Exhibition Hall  5F

 

SiP Global Summit 2018 – Day 1

 

September 6, 2018 Grande Luxe Banquet Grand Ballroom 

 

Semiconductor Materials Forum

 

September 6, 2018 Taipei-Nangang Exhibition Hall  Master Forum Stage

 

MEMS & Sensors Forum

 

September 6, 2018 Taipei-Nangang Exhibition Hall 4F

 

High-Tech Facility International Forum

 

September 6, 2018 Taipei-Nangang Exhibition Hall 4F

 

Laser Forum

 

September 6, 2018 Taipei-Nangang Exhibition Hall 4F

 

SiP Global Summit 2018 – Day 2

 

September 7, 2018 Grande Luxe Banquet Grand Ballroom 

 

IC Forum

 

September 7, 2018 Taipei-Nangang Exhibition Hall 4F

 

Power Electronics and Optoelectronics Semiconductor Technology Forum

 

September 7, 2018 Taipei-Nangang Exhibition Hall 4F

 

Sustainable Manufacturing Forum

 

September 7, 2018 Taipei-Nangang Exhibition Hall 5F

 

Circular Economy Forum

 

September 7, 2018 Taipei-Nangang Exhibition Hall 5F

 

Advanced Semi Metrology Forum

 

September 7, 2018 Taipei-Nangang Exhibition Hall 5F

 

View Full Agenda
IoT Room 402ab Wednesday, September 05
12:50pm to 4:00pm

Date:Wendesday, September 05, 2018
Time:13:20 - 16:00 (12:50 - 13:20 for registration)
Venue:Room 402ab, 4F, TWTC Nangang Exhibition Center Hall 1
Organizer:Taiwan IOT Technology and Industry Association (TWIOTA)
Co-Organizer:
● SEMI
● Taiwan Semiconductor Industry Association(TSIA), 
● Taipei Computer Association (TCA) 

Organizer      
Co-Organizer  

Outline:

AI has been integrated into many business applications such as mobile phones, medical science, robots and smart city solutions while people are still talking about the news of the battle between Google’s AlphaGo and human brains. The market research of CCID pointed out that AI technology has already entered actual production environments and people’s daily lives from the laboratory. Also, it is estimated that AI market will increase 17% annually, reaching USD 327.2 billion in 2018. Despite numerous AI applications, more importantly, combinations of IoT, blockchain and AI can lead to more imagination besides in smart cities, IIoT, unmanned vehicles and FinTech. And this is the time for Taiwan’s strength, the semiconductor industry, to play the key role and grab the business opportunities of AI. Especially during the trade war between China and USA now, the opportunities and challenges in AI would be no doubt the first priority for Taiwan’s related industries to consider. 
 
Taiwan IOT Technology and Industry Association(TwIoTA) which consists of 6 professional committees including Semi-Conductors, Intelligent Vehicle & Transportation, Medical & Health Care, Security, Future Manufacturer and A.I. & Big Data here hosts a seminar with the topic of “The Driving Force of AIOT:Future Semiconductor Applications”. Through the sharing of actual cases in cross-industry collaboration, we would like to come up with a more specific and clearer direction for people in the semiconductor industry to achieve successful business combinations of AI and IoT. 

 

Early-Bird Regular
Free Free
 
 
 
* Forum agenda is subject to change
View Full Agenda
Women In Tech Panel Discussion Booth I3016, Meet the Expert Theater, 1F, Hall 1, Taipei Nangang Exhibition Center Friday, September 07
10:20am to 11:00am

Date:Friday, September. 07, 2018

Time:10:20 - 11:00 

Venue:Booth I3016, Meet the Expert Theater, 1F, Hall 1,Taipei Nangang Exhibition Center

*This forum will be conducted in Mandarin.

 

Sponsors :

 

Partner :

   
ASML SUSS MicroTec

TEL

 

104獵才顧問                          

 

 

 

Please download the “group registration” excel and fill in. Then kindly email to semi.workforce.@gmail.com to complete the registration. 

 

View Full Agenda

Contact
SEMI Taiwan
Ms. Belle Liu
TEL: 886.3.560.1777 EXT. 512
Email: semicontw2018program.4@gmail.com

Share page with AddThis