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Programs Catalog

Special Features Grand Ballroom, 3F, Grand Hyatt Taipei Wednesday, September 18
6:00pm to 9:00pm
Test Room 505ab, 5F, TaiNEX 1 Thursday, September 19
9:00am to 4:20pm

Date:Thursday, September 19th, 2019
Time:09:00 - 16:20 (09:00-09:30 for registration)
Venue:Room 505ab, 5F, TaiNEX 1
Theme: 5G & AI-assisted Test

Forum Chairs:

  • Dr. Cheng-Wen Wu, Executive Vice President, National Cheng Kung University/ Co-Chair, SEMI Taiwan Testing Committee
  • Mr. CJ Hsieh, General Manager, INTEL Innovation Tech. Ltd./ Co-Chair, SEMI Taiwan Testing Committee

Forum Vice Chair:

  • Ms. Wendy Chen, Associate Vice President, King Yuan Electronics Co., Ltd./ Vice Chair, SEMI Taiwan Testing Committee

Moderators:

  • Morning session: Dr. Cheng-Wen Wu, Executive Vice President, National Cheng Kung University/ Co-Chair, SEMI Taiwan Testing Committee
  • Afternoon session: Mr. CJ Hsieh, General Manager, INTEL Innovation Tech. Ltd./ Co-Chair, SEMI Taiwan Testing Committee

Outline: 

With the dynamic development of IC industry driven by applications like 5G, HPC, IoT, AI and Automotive; semiconductor testing faces major paradigm shift with the eager needs to develop new testing concept and capability to cope with the rising complexity of ICs and systems to ensure their reliability and safety.  5G technology, one of the most heated applications, challenges the entire testing ecosystem to develop new system level test methodology for accuracy and quality while at the same time to balance cost and time to volume.  And with the development of AI, testing data generated through design and manufacturing process has become one of the most valuable resources for industry to enhance their testing capability.    

To lead and to facilitate industry technology development on testing, the theme for the very first Advanced Testing Forum in SEMICON Taiwan will be “5G and AI-assisted Test”.  The forum will cover the perspectives from policy and infrastructure to design and manufacturing to discuss standardization, system level test, mmWave test, OTA, AiP device, AI-assisted test and many other exciting topics!  Join us to find out how MOEA 5G Technology Program Office, Qualcomm, MediaTek, SPIL, KYEC, Advantest, Teradyne, CHPT see the future of 5G testing and how installing AI could enhance it to the next level!

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
Free Free Free

Free
(More than 5 people)

*Tax Included

 
 
Sponsored by:

 

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
     
       

 

 

View Full Agenda
Special Features Room 505ab, 5F, TaiNEX 1 Thursday, September 19
9:00am to 4:20pm
Wednesday, September 18
4:00pm to 4:10pm
Special Features Room 504bc, 5F, TaiNEX 1 Wednesday, September 18
10:10am to 10:30am
Wednesday, September 18 9:00am
Thursday, September 19
4:15pm to 4:45pm
Wednesday, September 18 10:00am

As silicon chips are reaching their limits, compound semiconductor seems to be the answer to the industry future! Compound Semiconductor Innovation Zone invites leading companies including Episil, Epi, WIN Semiconductors, GaN Systems, IQE to present the latest trend on 3D Sensing, LiDAR & Radar and Powertrain. Meanwhile, BMW i3 will be showcased at the scene to demonstrate the autonomous applications of compound semiconductor! (READ MORE)

Venue : Booth #I2700, 1F, TaiNEX 1 

MEET TEH EXPERT

 

Sep. 18 (Wed.)

Company

Topic

Download

10:50 - 11:00

 

Opening Remarks

 

11:00 - 11:20

Episil Technologies Inc

SiC Industry Overview and Technologies

 

11:20 - 11:40

GaN Systems Inc.

GaN & Electric Vehicles: A Small Change that’s Revolutionizing the Industry

Download

11:40 - 12:00

Electronic and Optoelectronic System Research Laboratories, ITRI

Double-sided Cooling Silicon Carbide Power Module

 

13:40 - 14:00

Mosel Vitelic Inc.

Power Semiconductor
IGBT for EV/HEV Car

 

15:00 - 15:20

Hestia Power Inc.

Silicon-Carbide (SiC) Technologies for Automotive Application

 

15:20 - 15:40

Delta Electronics, Inc.

Delta EV Charging Solution Introduction

Download

Sep. 19 (Thu.)

Company

Topic

 

11:00 - 11:20

PlayNitride Display Co., LTD.

MicroLED: Revolution for Display Industry

 

13:40 - 14:00

Mosel Vitelic Inc.

Power Semiconductor
IGBT for EV/HEV Car

 

14:00 - 14:20

Episil-Precision Inc.

GaN&SiC compound semiconductor technologies/status in Episil

 

14:20 - 14:40

Delta Electronics, Inc.

Delta EV Charging Solution Introduction

Download

Sep. 20 (Fri.)

Company

Topic 

 

11:00 - 11:20

GaN Systems Inc.

Adapting GaN into Products we use everyday

 

11:20 - 11:40

Electronic and Optoelectronic System Research Laboratories, ITRI

The development of high conversion efficiency 12V-48V bidirectional DC converter

 

11:40 - 12:00

Hestia Power Inc.

Silicon-Carbide (SiC) Technologies for Automotive Application

 

 

EXHIBITORS                     

BMW

Delta Electronics, Inc.

Electronic and Optoelectronic System Research Laboratories, ITRI

Episil Holding Inc.

GaN Systems Inc.

IQE Taiwan Corporation

Mosel Vitelic Inc.
PlayNitride Display Co., LTD.

Win Semiconductors Corp.

 

SPONSORS 

         
 
         

                                 

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Special Features Booth #2700, Compound Semiconductor Innovation Zone, 1F, TaiNEX 1 Wednesday, September 18
10:50am to 3:40pm
Special Features Booth #2700, Compound Semiconductor Innovation Zone, 1F, TaiNEX 1 Thursday, September 19
11:00am to 2:40pm
Special Features Booth #2700, Compound Semiconductor Innovation Zone, 1F, TaiNEX 1 Friday, September 20
11:00am to 12:00pm
Room 401, 4F, TaiNEX 1 Wednesday, September 18
8:30am to 12:05pm

The registration is fully booked.

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:05 (08:30-09:00 for registration)
Venue:Room 401, 4F, TaiNEX 1
Theme: Enabling Cybersecurity for Resilient Smart Factory 

Forum Chair:

  • Dr. Cheney Chiu, CIM deputy Director, ASE Group/ Co-Chairman, SEMI Taiwan Smart Manufacturing Committee

Moderator:

  • Dr. Cheney Chiu, CIM deputy Director, ASE Group/ Co-Chairman, SEMI Taiwan Smart Manufacturing Committee

Outline: (TBD)

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
Free Free Free Free

*Tax Included

 
 

Sponsored by:

 

 

   

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
 
       
       

 

 

View Full Agenda
Special Features Room 401, 4F, TaiNEX 1 Wednesday, September 18
8:30am to 12:05pm
Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
9:00am to 5:00pm
SiP Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 19
9:00am to 4:25pm
SiP Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20
9:00am to 4:25pm
FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
8:30am to 12:00pm

The registration for this session is fully booked.

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:00 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
Outline: 

Innovation is uncertain and could be risky, and yet it is also the biggest drive of technology invention and development which through the creative destruction led by innovation, we witness and experience remarkable changes and improvement of human life.

Behind every innovation, there are painstaking process with countless trial and error and there are also enlightening moments of epiphany.  What drives innovation to success, what we discover throughout the process and how future innovation looks like, we invite a series of distinguished speakers from worldwide leading research institute & academia who have made exceptional contributions to this industry to share their insights and visions. Facing innovative future, let’s learn, unlearn and relearn.

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

free free

*Tax Included

 
 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

View Full Agenda
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
9:30am to 12:00pm

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:25 (08:30-09:00 for registration)
Venue:Future Stage, 4F, TaiNEX 1
Theme: (TBD)
Outline: 

Innovation is uncertain and could be risky, and yet it is also the biggest drive of technology invention and development which through the creative destruction led by innovation, we witness and experience remarkable changes and improvement of human life.

Behind every innovation, there are painstaking process with countless trial and error and there are also enlightening moments of epiphany.  What drives innovation to success, what we discover throughout the process and how future innovation looks like, we invite a series of distinguished speakers from worldwide leading research institute & academia who have made exceptional contributions to this industry to share their insights and visions. Facing innovative future, let’s learn, unlearn and relearn.

 

 
Early-bird Original
free free

*Tax Included

 
 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

View Full Agenda
Special Features URBAN331, 1F, Madison Taipei Hotel Thursday, September 19
5:30pm to 7:30pm
Special Features 1F & 4F, TaiNEX 1 Wednesday, September 18
10:00am to 5:00pm
Special Features 1F & 4F, TaiNEX 1 Thursday, September 19
10:00am to 5:00pm
Special Features 1F & 4F, TaiNEX 1 Friday, September 20
10:00am to 4:00pm
Special Features Booth #J3258, SMART Manufacturing Journey, 1F, TaiNEX 1 Thursday, September 19
3:30pm to 4:30pm
Special Features Booth #I2013a, 1F, TaiNEX 1 Friday, September 20
11:50am to 1:00pm
#K2988, ITRI, 1F, TWTC Nangang Exhibition Hall Thursday, September 19
2:00pm to 2:50pm
Wednesday, September 18 10:00am

Outgrow to Next Era! Heterogeneous Integration Innovation Zone will present you the key approach and terminal application on HI technology, ASE and other industry players from 5G, IC design, packaging, and silicon photonic fields to showcase the latest trend and the possible future of AI Chips!

Venue : Booth #J3234, 1F, TaiNEX 1 

 

Exhibitors

Company Content
ASE Inc. 2.5D, 3D, Fan-Out Packaging
Chunghwa Telecom Laboratories 5G Enabling Innovative Services
ITRI
(1) High Speed SiPh Opto-electronics Measurement Platform
(2) Micro LED Chip Process and Mass Transfer Platforms
(3) 3DIC Heterogeneous Integration Process Platform
(4) Sub-THz System Laboratory
ITRI
(1) Heterogeneous Integration Platform for AITA
(2) Advance AI Heterogeneous Integration Technology
MediaTek Inc. More than Moore: Heterogeneous Integration Technologies
Powertech Technology Inc. Panel Fan-Out & 3D IC Technology
Realtek Semiconductor Corp. Full Range of Connectivity Solutions
Siliconware Precision Industries Co., Ltd (SPIL)

Heterogeneous Integration for future Advanced Packaging Solution

SiPlus Co., Ltd.
(1) SiPlus Heterogeneous Integration platform - Integrated Substrate solutions
(2) eHDF Substrate
(3) Advance Hybrid Space Transformer
TechSearch Heterogeneous Integration Market Trend

Brought to you by

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Special Features Booth #L0100a, 4F, TaiNEX 1 Thursday, September 19
12:20pm to 1:30pm
High-Tech Facility International Forum Room 402abc, 4F, TWTC Nangang Exhibition Hall Thursday, September 19
8:30am to 5:30pm

Date:Thursday, September 19th, 2019
Time:08:30 - 17:30 (08:30-09:00 for registration)
Venue:Room 402abc, 4F, TaiNEX 1
Theme: A.I. Solutions Shaping Future Facilities
Outline: 

The 4th Industrial Revolution has recently ignited the rising explosion of applying Artificial Intelligence (AI) from the horizon of technological evolution. Many are curious about "What is AI doing for smart fab facilities?" The High-Tech Facility International Forum 2019 is to bring IBM & nVidia frontier visionary with other global experts together to discuss how AI is being implemented in the world's most advanced smart fab.

With every new generation of smart fab comes the development of more advanced AI and delivering a broad base of the continuous improvement for semiconductor manufacturing. As results become feasible and evident, there is an urgent need to learn more about AI knowledge and to pragmatically implement its technologies for intelligenizing high tech fab facilities. This year's Forum aims to deliver the most current practice and trend of AI application to the attendees.

The Forum will provide real-time Chinese-English interpretation. The speakers and panel discussion participants will share recent findings and demands in a format that combines industry leaders with forefront researchers and representative suppliers. Thus, it publicly and sincerely makes direct communication among owners, suppliers and scholars for dealing with emerging issues. All are welcome to attend.

 

 

【NEW!】2019 Forum Highlight: http://www.htftaiwan.org/
 
Forum Agenda:  http://www.htftaiwan.org/2019semicon.html
 
Early-bird
(7/10-8/30)

Original
(8/31-9/20)

NTD 4,200 NTD 4,600

*Tax Included

 
 

 

VIP Banquet 
Time : 18:00 - 21:00 
Venue:Ballroom, 3F, TaiNEX 1
 
 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
NTD 3,200 NTD 4,200
*Tax Included

 

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

View Full Agenda
Special Features Room 402, 4F, TaiNEX 1 Thursday, September 19
8:30am to 5:30pm
Special Features A Room, The Banquet Hall, 3F, TaiNEX 1 Thursday, September 19
5:30pm to 9:00pm
Room 401, 4F, TaiNEX 1 Friday, September 20
8:00am to 4:25pm

Date:Friday, September 20th, 2019
Time:08:00 - 16:25 (08:00-08:30 for registration)
Venue:Room 401, 4F, TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1)
Theme: A Big Thing in Semiconductor Indstry

Chair:

  • Dr. John Lin, Director, Taiwan Semiconductor Manufacturing Company Ltd./ Chairman, SEMI Taiwan IC Committee

Vice Chairs:

  • Mr. G.C. Hung, Vice President, United Microelectronics Corporation/ Vice Chairman, SEMI Taiwan IC Committee 
  • Mr. Rutgers Chow,  President of SPTS Asia, SPTS Technologies, Ltd./  Vice Chairman, SEMI Taiwan IC Committee

Moderator:

  • Morning Session: Mr. Kevin Liu, Vice President, Lam Research Corporation
  • Afternoon Session: Ms. Mavis Ho, Head of Strategic Partnership, Taiwan and Singapore, imec
  • Afternoon Session: Dr. Samuel Chiu, Technical Director, Applied Materials Taiwan

Outline:

IC Forum is the global stage where industry leaders share their visions and perspectives on the roadmap of IC technology and how it enables various applications such as AI, quantum computing, HPC and 5G that keep advancing our industry.    

For this year's IC Forum, we are honored to have Microsoft, TSMC, UMC, imec and world leading equipment, materials and EDA companies to jointly address "A Big Thing in Semiconductor Industry."  "A Big Thing" could be a killer application like AI or autonomous driving, a breakthrough in chip design, and it could refer to the value of IC manufacturing in materializing all the innovation of applications through technology like scaling, specialty IC, new memory and heterogeneous integration.  

Through IC forum, we discuss trends, innovation and next generation manufacturing technology that advance the development of human life!

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 3,200 NTD 4,000 NTD 3,200

Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 
 
 

    * Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

   

 

 

 

 

 
       

 

View Full Agenda
Special Features Room 401, 4F, TaiNEX 1 Friday, September 20
8:00am to 4:20pm
FUTURE Stage, 4F, TWTC Nangang Exhibition Hall Friday, September 20
8:30am to 11:30am

Date:Friday, September 20th, 2019
Time:08:30- 11:30 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
Theme:Leap into the tech future

Outline:

Interested in a full update on the recent developments in the field of nanoelectronics? ITF Taiwan 2019  is your place to be.
Imec and SEMICON Taiwan invite you to the Taipei Nangang Exhibition Center, on September 20th  for a half-a-day program of exclusive insights into research and innovation topics such as advanced 3D scaling, silicon photonics, TDI and pixel imaging, quantum computing, and life sciences by renowned imec experts. Top-notch tech presentations to help you leap into the tech future.

Doors open at 8:30am.
Presentations from 9am till 11:30am

Make your visit to SEMICON Taiwan even more worthwhile!

 
 
 
 
 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
Free Free Free Free

 

 
 

 

 
 
* Forum agenda is subject to change
 
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

Organized by:
     
 

 

View Full Agenda
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Friday, September 20
8:30am to 11:30am
IoT Room 402ab, 4F, TWTC Nangang Exhibition Hall Wednesday, September 18
9:00am to 12:00pm
Thursday, September 19 9:00am
Market Trend Room 402ab, 4F, TaiNEX 1 Wednesday, September 18
9:00am to 12:20pm

Date:Wednesday, September 18th, 2019
Time:09:00 - 12:20 (09:00-09:30 for registration)
Venue:Room 402ab, 4F, TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1)

Moderator:

  • Mr. Steven Liu, Senior Vice President, United Microelectronics Corporation

Outline: 

The rise of new end-market applications like AI, 5G, IoT leads to the revolutions in semiconductor industry with continuous investment in leading-edge foundry and packaging technologies.  Along with the growing investment, the uncertainties triggered by the rising cost of advanced node R&D and global market economy also increased.   We face situation like sluggish global market, weak memory demand and intensifying trade tension.  In this forum, we will cover a wide variety of market analysis from application to manufacturing, including a midyear update of trends and drivers shaping these markets, geopolitical implications on business opportunities and challenges and Taiwan's strategic position in the era of 5G & AI.

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 2,200 NTD 2,750 NTD 2,200

Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Sponsored by:
   
     

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
   
     
     

 

 

View Full Agenda
Special Features Room 402ab, 4F, TaiNEX 1 Wednesday, September 18
9:00am to 12:20pm
Wednesday, September 18 10:50am
MEMS & Sensors Room 504bc, 5F, TaiNEX 1 Tuesday, September 17
8:30am to 4:40pm

Date : Tuesday, September 17th ​, 2019
Time :  08:30 – 16:40 (8:30-8:55 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 
Theme :  Edge Sensing to Edge AI for Life

Outline:

Human beings currently experience a fast-changing world, which is overwhelmed by artificial intelligence (AI) in all kinds of aspects, thus greatly influencing our life, and this is just the beginning. Although AI has been developed for several decades, its progress is not significant until miniaturized, high performance and cost-effective sensors available. However, there are still many challenges hindering the real implementation of AI into our life (i.e., edge or local), including handling of trillion raw data from sensors, limited bandwidth and speed of wireless communication, and insufficient capacity and calculation efficiency of cloud. As such, this brings “Edge Sensing to Edge AI for Life” to be the main theme of the 2019 SEMICON Taiwan MEMS & Sensors Forum. The invited presentations this year will unveil the state-of-the-art Edge technology and local intelligence in sensors, modules, and application scenarios, as well as their eco-systems such as edge computing, 5G communication, cloud, big data, algorithm, and AI layers, thus enabling a real Edge era. Foreseeing the trends enabled by the Edge era, the forum this year features four categories including automotive and AI/Applications/Smart Life, with excellent presentations offered by flagship companies worldwide.

 

 

Early-Bird
(7/-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
NTD1,800 NTD2,250 NTD2,250 NTD2,700

*Tax Included

 

Sponsored by:
              

 

 

     

     
     
     
* Forum agenda is subject to change    
     
     

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
              

 

   

           

 

 

 

 

View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Tuesday, September 17
8:30am to 4:40pm
Special Features Room Happiness, 3F, TaiNEX 1 Tuesday, September 17
11:40am to 1:00pm
Special Features Booth #K3276, TechXPOT, 1F, TaiNEX 1 Thursday, September 19
10:30am to 12:00pm
Thursday, September 19
1:20pm to 1:30pm
Thursday, September 19
4:30pm to 5:00pm
Wednesday, September 18 9:00am

2019 Coming Soon!

View Full Agenda
Special Features B Room, The Banquet Hall, 3F, TaiNEX 1 Thursday, September 19
11:30am to 1:30pm
Power & Optoelectronics Semiconductor Room 401, 4F, TaiNEX 1 Thursday, September 19
8:20am to 4:15pm

 

Date:Thursday, September 19th, 2019
Time:08:20 - 16:15 (08:20-08:50 for registration)
Venue:Room 401, 4F, TaiNEX 1( Taipei Nangang Exhibition Center, Hall 1)

Theme:

  • Wide Band Gap Power Electronics ​
  • 5G Communications and VCSEL

Chair:

  • Mr. Brian Lee, CSO, Win Semiconductors Corp./ Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Vice Chairs:

  • Dr. Yi-Cheng Cheng, General Director, National Chung-Shan Institute of Science & Technology/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Mr. Andy Chuang, President, Episil Technologies Inc./ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Dr. Barry Jia-Fu Lin, CTO, Wavetek Microelectronics Corporation/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Moderator:

  • Morning Session: Mr. Andy Chuang, President, Episil Technologies Inc./ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Afternoon Session: Dr. Barry Jia-Fu Lin, CTO, Wavetek Microelectronics Corporation/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Outline:

  • Energy saving and carbon reduction are two major topics in the area of environment protection of the  earth. WBG (Wide Band Gap) technology is one of best solution to enhance the efficiency of energy conversion, it can effectively make power electronics systems much smaller, lighter, more reliable and more efficient, while being capable of operating at higher temperatures. Compared to silicon devices and materials, wide band gap devices based on SiC and GaN have excellent characteristics to achieve a significant improvement in performance such as higher breakdown voltages, higher electron mobility and higher thermal conductivity.
    To popularize WBG power electronics, the forum will address WBG applications in EV industry, wide band gap materials, as well as manufacturing and process technologies for wide band gap devices.

  • 5G communication is rolling out to the field in the coming years. It changes the role of cell phone in a revolutionary way. Cell phone is no longer just a personal tool, it moves to an interaction media between human and environment through IOT connection. In this session, 5G technology and architecture trends will be reviewed by two prominent vendors in the world.
    VCSEL emerges as the “hot shot” in photonics area. In addition to the technology, component module, epi-wafer growth, and on-wafer testing are the other three key areas. Companies in Taiwan play a vital role in providing these key elements.  We will show case some examples in this session.
    In this session, topics on 5G communication and VCSEL demonstrate the impact of compound semiconductor industry on our daily life in the future.

 
 
 
 
 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 3,200 NTD 4,000 NTD 3,200

Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Co-organizer:
   
     

 

Partner:
   
     

 

 
Sponsored by:

 

 

 

 

 

 

 

 
 
* Forum agenda is subject to change
 
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
     

 

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Special Features Room 401, 4F, TaiNEX 1 Thursday, September 19
8:20am to 4:15pm
Room 504bc, 5F, TaiNEX 1 Thursday, September 19
1:00pm to 5:00pm

The registration is fully booked. Please click here to leave your contact information, we will put you on the waiting list and send you copies of the presentations authorized by speakers after the forum.

 

Date:Thursday, September 19th, 2019
Time:13:00 – 17:00 (13:00-13:30 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 
Theme: Envision the New Era of Computing
Outline:

The first quantum revolution is that scientists and tech engineers use the rules of quantum mechanics to build devices including the transistor, the laser, integrated circuit etc. The second quantum revolution is that we are directly using quantum machine including quantum sensor, quantum information and quantum computer. The quantum computer bases on quantum mechanics and gives the new computing that promise to solve some of the currently intractable problems. 

Quantum computer had a lot of potential applications including predictions of new medicine and new material, optimization, quantum machine learning for Artificial intelligence, financial problems, cryptography and so on. The first commercial quantum computer has been established by IBM in this year and it is can be predict that the quantum computer will be rapid development. Also recent two years more than hundred private and startup companies have been found. It is time to connect the future, the quantum era.

 

Early-Bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
FREE FREE FREE FREE

 

 

Organizer:
                    
     
 
Media Partner :                                                                                                            
           

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
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Special Features Room 504bc, 5F, TaiNEX 1 Thursday, September 19
1:00pm to 5:00pm
Special Features Booth #J3258, SMART Manufacturing Journey, 1F, TaiNEX 1 Thursday, September 19
2:30pm to 3:30pm
Special Features Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 20
1:00pm to 3:00pm
Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 20
1:00pm to 3:00pm

Date:Friday, September 20th, 2019
Time:13:00 - 15:25 (13:00-13:30 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1

-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Outline: 

How do you prepare for a 21st century workforce? How to be competitive in the Era of Digital Transformation? SEMI Talent Forum will focus on developing what we can do to be ready in the career and how to attract and retain the best talent in the industry to lead the future!

 

Panel Discussion
-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Moderator

Mr. Eugene Huang, Partner, Deloitte Consulting

Panelist
1. Ms. Fiona Tan, Intel Taiwan Senior  HR Manager, Intel 
2. Mr. Leon Lu, Chief of Adm. & HR, Wistron Corporation.
3. Ms. Venus Hu, Dept. Manager, Recruiting Dept., HR Operation Center, TSMC 
4. Mr. Ben Wang, Chairman, Global Career Development Association.

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

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Booth #M1156, Master Forum Stage, 4F, TWTC Nangang Exhibition Hall Wednesday, September 18
9:00am to 9:30am
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
8:20am to 9:30am
Special Features Grand Ballroom II, 3F, Grand Hyatt Taipei Monday, September 16
1:00pm to 3:15pm
Room 505a, 5F, TWTC Nangang Exhibition Hall Friday, September 20
8:30am to 4:15pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:15 (08:30-09:00 for registration)
Venue:Room 505a, 5F, TaiNEX 1 / 台北南港展覽館一館 5樓 505a會議室
Theme:  Inspection and Metrology Technologies Improving Semiconductor Manufacturing
Outline:  The Semiconductor Advanced Inspection and Metrology Forum is focusing on technologies of inspection and metrology which affect the semiconductor manufacturing significantly and drive the growth of market. The global market of semiconductor inspection equipment is expected to reach US$ 5300 million by 2024, from US$ 3360 million in 2019. To facilitate the development of semiconductor inspection and metrology, SEMI Inspection and Metrology Committee has been established. The committee and this forum provide a platform for communications and aim to create the advanced solutions of inspection and metrology for semiconductor industry.

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Special Features Room 505a, 5F, TaiNEX 1 Friday, September 20
8:30am to 4:15pm
Tuesday, September 17 9:00am

SiP Global Summit will explore the shifted landscape and potential opportunities of semiconductor advanced packaging technology under the wave of AI and 5G applications. TSMC, ASE, SPIL, Micron, PTI, Amkor、ASMPT、Camtek、imec、Lam Research、SPTS、UCLA will take you to view the Next Generation of Advanced packaging.

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SiP, SiP Global Summit Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
8:30am to 5:50pm

Date:Tuesday, September 17th, 2019
Time:08:30 - 17:50 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI  Applications

Forum Chairs:

  • Mr. Albert Lan, Global Packaging TD, Applied Materials/ Vice Chairman, SEMI Taiwan Packaging &Testing Committee

Moderators:

  • Mr. Albert Lan, Global Packaging TD, Applied Materials/ Vice Chairman, SEMI Taiwan Packaging &Testing Committee
  • Dr. John H. Lau, CTO, Unimicron

Outline: 

  • 5G (with mm-wave transition features) can effectively enable AI life and can be realized by the packaging technologies, such as SiP, Fan Out, 2.5D/3D TSV, and CoW/WoW hybrid bonding.
  • To address product applications, and its equipment & material technology solutions in advanced packaging, the forum have invited lots of experts from Fabless design house, IDM, Foundry, OSAT, Equipment and Materials suppliers to share their treasure experiences on future technology development roadmap, challenges, and effective solutions.
  • Beside investing in packaging techniques advancement for integrated applications, the driving trend is also to integrate into a full system of high performance and functionality devices with smart manufacturing. The connected system in packaging world shall drive for yield performance excellence in high-tech manufacturing.

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 Extra 10% discount
(More than 5 people)

*Tax Included

 
 

Sponsored by:

 

 

 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

 

View Full Agenda
Special Features Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
8:30am to 5:50pm
SiP, SiP Global Summit Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 19
8:15am to 5:00pm

Date:Thursday, September 19th, 2019
Time:08:15 - 17:00 (08:15-08:45 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
Theme: AI/5G-driven High Performance Computing, from Cloud to Edge

Forum Chair:

Moderator:

Outline: 

With the arrival of data-centric era, we are unconsciously immersed in and guided by ubiquitous data generation and processing in our daily life; from remote cloud, data centers, networks, to fleet of personal and sensing devices such as smartphone, wearables, visual monitoring, vocal controls, and smart surveillance. This spurs strong demands on semiconductor logics, memories, and wireless connectivity for data generation, storage, processing, and communication. To meet the escalating demands on data bandwidth and smart computing, the semiconductor industry has re-invented packaging and system integration technologies by providing cost effective solutions in all application domains.

While Moore’s Law transistor scaling continues, semiconductor market has evolved from device centric to data centric. To address market needs, system packages through heterogeneous integration has taken the driver’s seat and  propel system performances toward smart computing, wide data bandwidth, small form factor, with low or zero latency and energy efficiency. And all these are capped by ever better system cost per function as technology and product migrate from generation to generation.

In this forum, speakers from renowned academician, research institute, Design House, EDA tool, foundry, and manufacturing/materials suppliers are sharing their insights and visions. Audience would benefit from this forum to have an in-depth understanding on following subjects

  • Data centric high performance computing industry trends
  • System integration and packaging technologies
  • Chiplets integration: opportunity and challenges
  • Novel enablement ASIC, EDA, and manufacturing tools/materials

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Sponsored by:

 

 

 

 

               

 

 

 
 
* Forum agenda is subject to change

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

View Full Agenda
Special Features Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 19
8:15am to 5:00pm
SiP, SiP Global Summit Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20
8:30am to 4:40pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:40 (08:30-08:55 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park 
Theme: Hybrid SiP Solutions of Heterogeneous & Homogeneous Integration

Forum Chair:

  • Dr. C.P. Hung, Vice President, ASE Group/ Chairman, SEMI Taiwan Packaging &Testing Committee

Moderators:

  • Dr. C.P. Hung, Vice President, ASE Group/ Chairman, SEMI Taiwan Packaging &Testing Committee
  • Dr. Shih-Chieh Chang, Deputy General Director, Industrial Technology Research Institute

Outline: 

With the dynamic development of various applications such as automotive, IoT, 5G and AI high performance computing, the ecosystem and manufacturing technology of semiconductor industry have also encountered major paradigm shift. In addition to scaling, another rising wave led by SiP (System in Package) is expanding the landscape of design, integrating options and advanced manufacturing technologies.  The hybrid SiP solutions of Heterogeneous and Homogeneous integrations combining logic, memory, sensors and other functional chips are groundbreaking and enabling all kinds of new applications.

Through SiP Global Summit Day 3 session, we will reveal the charm of HI double shots (Heterogeneous and Homogeneous Integration) from devices and manufacturing perspectives with speakers from chip, package and system such as NXP, MTK, ASE, Micron, Amkor and Mentor followed by an exciting cross-ecosystem panel discussion to further elaborate and enlighten the way to success with hybrid SiP solutions.

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Sponsored by:

 

 

 

   

 

 

 
 
* Forum agenda is subject to change

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

View Full Agenda
Special Features Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20
8:30am to 4:40pm
SMART Data Room 504bc, 5F, TaiNEX 1 Thursday, September 19
8:30am to 12:15pm

The registration is fully booked. Please click here to leave your contact information, we will put you on the waiting list and send you copies of the presentations authorized by speakers after the forum.

 

Date:Thursday, September 19th, 2019
Time:08:30 – 12:15 (8:30-8:55 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 
Outline:

Artificial intelligence is permeating everybody’s lives through the face recognition, voice recognition, image analysis and natural language processing capabilities built into their smartphones, consumer and industrial appliances.  However, as traditional processors struggle to meet the demands of compute-intensive artificial intelligence applications, dedicated AI chips are playing an increasingly important role in research, development, and on the cloud and edge. 

With its potential market of hundreds of zettabytes and $2 trillion of on top of the existing $1.5-2B information technology industry, AI not only relies on new semiconductor architectures and compute platforms but also brings many growth opportunities for new semiconductor products where new approaches to designs are required because of the complexity of the applications that need to be supported. Join to learn these industry executives’ vision leading the way forward to a fully connected, intelligent world.

 

Early-Bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
FREE FREE FREE FREE

 

 

Co-organizer :
                                                              
     
     
Sponsored by:

 

                   

           

                

 

 

 

   
     
Media Partner :                                                                                                            
           

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.* Forum agenda is subject to change    

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

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Special Features Room 504bc, 5F, TaiNEX 1 Thursday, September 19
8:30am to 12:15pm
Special Features Booth #J3258, SMART Manufacturing Journey, 1F, TaiNEX 1 Wednesday, September 18
10:30am to 4:30pm
Special Features Booth #J3258, SMART Manufacturing Journey, 1F, TaiNEX 1 Thursday, September 19
10:30am to 4:30pm
Special Features Booth #J3258, SMART Manufacturing Journey, 1F, TaiNEX 1 Friday, September 20
10:30am to 2:30pm
SMART Manufacturing Room 401, 4F, TWTC Nangang Exhibition Hall Wednesday, September 18
1:00pm to 4:55pm

Date:Wednesday, September 18th, 2019
Time:13:00 - 16:55 (13:00-13:30 for registration)
Venue:Room 401, 4F, TaiNEX 1
Theme: Leading the New Era of Intelligent Manufacturing with AI, Big Data & Cloud

Forum Chair:

  • Mr. James Lin, Deputy Division Director, UMC/ Co-Chairman, SEMI Taiwan Smart Manufacturing Committee

Moderators:

  • Mr. James Lin, Deputy Division Director, UMC/ Co-Chairman, SEMI Taiwan Smart Manufacturing Committee
  • Dr. Scott Yu, Department Manager, TSMC/ Co-Chairman, SEMI Taiwan Smart Manufacturing Committee

Outline: We are in the way towards Industrial 4.0, which requires Smart Manufacturing technologies and applications to achieve our digital transformation goal.
In this forum, we will provide development strategy, best known practice, and solutions from the perspectives of fab owner, equipment makers, solution providers, and IC design house.

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 2,000 NTD 2,500 NTD 2,000 Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Sponsored by:

 

 

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
   
       

 

 

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Special Features Room 401, 4F, TaiNEX 1 Wednesday, September 18
1:00pm to 4:55pm
Special Features B Room, The Banquet Hall, 3F, TaiNEX 1 Wednesday, September 18
11:30am to 1:30pm
SMART MedTech Room 504bc, 5F, TaiNEX 1  Friday, September 20
8:30am to 12:00pm

Date:Friday, September 20th , 2019
Time:08:30 – 12:00 (8:30-8:55 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 
Theme: Create New Value Chain to Empower Medical Technology
Outline:

According to Global Market Insights, Inc., the global digital health market was valued at USD 86 billion in 2018 and expected to grow at a CAGR of 38.8% over the next seven years, expected to reach USD 504  billion in 2025. Rapidly advancing technologies , including artificial intelligence (AI), machine learning, Robotics,  IoT and wearables, etc. are impacting and accelerating health care industry. Smart MedTech can advance health care quality, improver data controls, decisions making in treatment or pharma and precision medicine, all these require the collaboration between microelectronics and health care industry. 

For microelectronics industry, it’s essential to understand the health care industry’s expectation and provide reliable, efficient and cost-effective solutions to increase the market size. As for health care industry, MedTech comes with immense opportunities to take advantage of latest technologies and  to boost the technology advancement. The close collaboration between these two industries definitely bring the bright future for human life.

The Smart MedTech forum not only initiate the communication between microelectronics industry with MedTech applications, but also accelerate semiconductor industry involvement in MedTech development and invest more resource to realize Smart MedTech.

 

Early-Bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
Free Free NTD2,250 NTD2,700

*Tax Included

* Forum agenda is subject to change    

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Friday, September 20
8:30am to 12:00pm
SMART Transportation Room 504bc, 5F, TaiNEX 1 Wednesday, September 18
8:30am to 4:10pm

Date : Wednseday, September 18th , 2019
Time :  08:30 – 16:10 (8:30-9:00 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 
Theme :  From Silicon to Future Mobility

 

Early-Bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
NTD1,800 NTD2,250 NTD2,250 NTD2,700

*Tax Include

 

Co-organizer:
                    
     
     
Sponsored by:    
                       
     
     
Media Partner :    
   
* Forum agenda is subject to change
 
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Wednesday, September 18
8:30am to 4:10pm
Special Features A Room, The Banquet Hall, 3F, TaiNEX 1 Wednesday, September 18
11:40am to 1:30pm
Materials Thursday, September 19
9:00am to 4:00pm

 

Display Time Location
09:00 – 17:00, September 19, 2019 FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
10:00 – 16:00, September 20, 2019 K Zone

 

 

 

 

Poster Topic Presenter Author(s)
1. Vertically Stacked GeSi GAA n-Channels on a Si Channel by CVD Epitaxy

Chung-En Tsai

C. W. Liu, Chung-En Tsai, Yi-Chun Liu, Yu-Shiang Huang, Fang-Liang Lu, and Hung-Yu Ye
2. Atomic Layer Technologies: Atomic Layer Annealing, Bombardment, Crystallization, Densification, Epitaxy, and Etching Miin-Jang Chen Yu-Tung Yin, Miin-Jang Chen
3. Reliability Improvement of HfO2-based Ferroelectric Memory by Interface Engineering Yung-Hsien Wu Kuen-Yi Chen, Pin-Hsuan Chen, Ruei-Wen Kao, Chuan-Pu Chou, Yan-Xiao Lin, Yan-Hua Huang and Yung-Hsien Wu
4. High Sensitivity Ion Detector by 16nm FinFET CMOS Technology Chien-Ping Wang Chien-Ping Wang
5. The Interface Electrical Properties of Tens-of-Nanometer Thick Graphene on Few-Layer MoS2 Flakes Hao-Wei Tu Hao-Wei Tu, Chin-Lung Lin, Jing-Jia Lin, Wen-Bin Jian, Chenming Hu
6. Large-Scale Growth of Two-Dimensional Materials toward Phase-Engineered Hybrid Films Ling Lee Ling Lee(李寧), and Yu‐Lun Chueh(闕郁倫)
7. Dielectric Properties Measurement Technology of  Material in mmWave Application Chun An Lu Chiung Hsiung Chen, Chun An Lu, Yi Chen Wu, Cheng Ping Lin, Kyoko Nishidono
8. From wafer to solution: Organic impurities analysis strategy in advanced node Po-Cheng Chen Po-Cheng Chen, Hao Chang, Edward Chan, C.R.Liang, Chunghsi Joe Wu
9. Material impurity control: The staples of the quality assurance Shu-Hua Chou Shu-Hua Chou, Yi-Hsiu Hsiao, Chunghsi Joe Wu
10. Importance of electrostatic discharge (ESD) at advanced semiconductor materials manufactory Yu-Lun Hsiao Yu-Lun Hsiao, Chung-Yu Lin, Joe Wu, Y.K. Fan, W.C Yang,
11. A Novel Metal Gate Protective Film and Device Structures Thereof Chandrashekhar Prakash SAVANT Chandrashekhar Prakash SAVANT, Tien-Wei YU, Chia-Ming TSAI
12. Material Quality Roadmap Ming-Yuan Lin Ming-Yuan Lin, Ming-Hsi Sung , Liang-Chen Chi, Chunghsi Joe Wu
13. CMR Screening in semiconductor manufacturing chemicals Zack Su Zack Su, Zoe Chung, C.F. Wang , Shih-Hao Wang
14. History and Development of Trace Metal Impurities Analysis Technology

toward Semiconductor advance process

Heng-Yan Liu Heng-Yan Liu, Takuya Morimoto, Sylvia Huang, Henry Tseng, Jerry Lu
15. Real-time measurement of precursor vapor concentration using the non-dispersive Infrared spectroscopy Masakazu Minami M. Minami and Dr. YL Tsai
16. AlN Removal Formulation with modified anisotropic silicon etching property Chung Yi Chang Chung Yi Chang, Wen Dar Liu, Yi Chia Lee, John G Langan, Tianniu Rick Chen, Aiping Wu , Hung-Yu Chen

 

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Materials Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Thursday, September 19
8:30am to 4:55pm

Date:Thursday, September 19th, 2019
Time:08:30 - 16:55 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
Theme: Materials Leading the Smart Future of Semiconductor - Device Performance

Chair:

  • Mr. Min-Te Chen, Deputy Director, Taiwan Semiconductor Manufacturing Company Limited/ Chairman, SEMI Taiwan Materials Committee

Vice Chairs:

  • Dr. Joe Wu, Deputy Director, Taiwan Semiconductor Manufacturing Company Limited/ Vice Chairman, SEMI Taiwan Materials Committee 
  • Dr.  Jeffrey Yang, Senior Department Manager, Advanced Semiconductor Engineering Inc. (ASE Group)/ Vice Chairman, SEMI Taiwan Materials Committee
  • Mr. Brian Chen, Vice President, Wah Lee Industrial Corp. / Vice Chairman, SEMI Taiwan Materials Committee 

Moderator: 

  • Morning Session: Mr. Brian Chen, Vice President, Wah Lee Industrial Corp.
  • Afternoon Session: Dr. Rick Chen, General Manager, Versum Materials Taiwan Co., Ltd

Outline: (TBD)

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 2,500 NTD 3,125 NTD 2,500

Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 

 

 

View Full Agenda
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Thursday, September 19
8:30am to 4:55pm
Sustainable Manufacturing and Circular Economy Forum Room 505ab, 5F, TaiNEX 1 Wednesday, September 18
12:40pm to 5:00pm

The registration is fully booked.

Date:Wednesday, September 18th, 2019 
Time : 12:40 – 17:00 (12:40-13:10 for registration)
Venue:Room 505ab, 5F, TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1)
Theme :  Energy Conservation and Risk Management for Sustainable Manufacturing

Outline :

In conjunction with SEMICON Taiwan 2019, the Sustainable Manufacturing Committee of SEMI Taiwan is organizing an event to provide insights on the latest products and technologies, regulations, technical standards, business continuity plan (BCP), business continuity management (BCM), energy conservation, circular economy and cyber security.

The Sustainable and Circular economy Forum will showcase the expertise and capabilities of companies and speakers from around the word by addressing a wide variety of energy conservation and risk management issues for high tech sustainable manufacturing. The topics includes environmental protection, BCP/BCM, energy conservation, circular economy, occupational health and safety, information and operation security which affect sustainable manufacturing.

 

Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI  Member​
(7/10-9/20)
Non-SEMI Member​
(7/10-9/20)
Free Free Free Free

*Tax Included

 

 

Sponsored by:

   

 

   

 

    * Forum agenda is subject to change    

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

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Special Features Room 505ab, 5F, TaiNEX 1 Wednesday, September 18
12:40pm to 5:00pm
Special Features Booth #L1316, TechXPOT, 4F, TaiNEX 1 Friday, September 20
2:00pm to 3:40pm
Special Features Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Thursday, September 19
1:00pm to 3:00pm
Booth #I3216, Smart Workforce Pavilion, 1F TaiNEX 1 Thursday, September 19
1:00pm to 3:00pm

 

Date:Thursday, September 19th, 2019
Time:13:00 - 15:00 (13:00-13:30 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 
Theme: How to Land on the Dream Job and Change the Future ? 

Outline: 

The SMART Workforce Pavilion is where you’ll find the information you need to see where you fit in, and access the resources to get in the game and jumpstart your career. Come and network with industry professionals, discover career options and learn how you can contribute to the growth of an exciting industry.

Meet the Expert Stage you will see Talent Development Program with experts from Micron, TEL, Airoha, Spirox to discuss about “ How to Land on the Dream Job and Change the Future”. Join us to register and network with these experts!


Panel Discussion
Theme: How to Land on the Dream Job and Change the Future ? 

Moderator

Mr. Jason Chin, Senior Vice President of Executive Recruiting Consultancy Division, 104 Corporation

Panelists

1. Mr. Yi Te Chu, HR Div. Director,  Airoha Technology Corporation    
2. Ms. Jessie Liu, Director, North Asia HR Business Partner, Micron Technology Taiwan
3. Mr. Richard Lin, Vice President, Spirox Corporation 
  
4. 
Mr. Roger Chang, Executive Vice President, Tokyo Electron Taiwan
              
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance


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Tuesday, September 17 9:00am
Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
1:20pm to 5:00pm

 

The registration for this session is fully booked.

Date:Wednesday, September 18th, 2019
Time:13:20 - 17:00 (13:20-13:40 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
Theme:Envision the Next 60 Years of Prosperity
Outline:
SEMICON Taiwan is an annual grand event connecting the ecosystem of microelectronics and semiconductor industry. The most up-to-date design, manufacture and applications are showcased in this exhibition.  As one of the highlights in SEMICON Taiwan, Technology Think Tank Summit gathers global industry leaders to share their opinions and visions on the industry future. Taiwan has laid a solid foundation within the 60 years of IC inventions. We invite industry leaders in SiP, IC design, memory, wafer fabrication, packaging and testing, and Minister Shen to discuss and provide guidance on how Taiwan can create another 60 brilliant years while facing global competition and changes.

 
 
 
 
 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
FREE FREE FREE

FREE

*Tax Included

 
 
 
Sponsored by:
     

 

 
 
* Forum agenda is subject to change
 
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
 
     

 

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Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
1:20pm to 5:00pm
TWTC Nangang Exhibition Hall Wednesday, September 18 11:00am

 

Advanced Materials Technology High-Tech Facility Innovative Technology & Product 

 

 Sept 18, 2019

TechXPOT 1F #K3276

Time Company Topic Download
12:40 - 13:00 Purification Equipment Research Institute Of CSIC Development Status And The Future Of Special Gases In Mainland China
13:00 - 13:20 Chongqing Qunwin Electronic Materials Co., Ltd. Large size, high density packaging material description - Cu core ball and solder column Download
13:20 - 13:40 ANGUS CHEMICAL COMPANY ANGUS VOLTEN Offerings for Electronic Process Download
13:40 - 14:00 Namics Corporation Copper foil surface treatment technology and low dielectric materials for high-speed transmission
14:00 - 14:20 Shanghang Zijin Jiabo Electronic New Material Technology Co., Ltd. Study on alloy wire and copper wire
14:20 - 14:40 Heraeus Secure Your Key To Future Power Electronics Download
14:40 - 15:00 Evertech Enterprise Co., Ltd. Introduction of "Evertech" and the products Download
15:00 - 15:20 Arkema (China) Investment Co., Ltd. ARKEMA KYNAR® PVDF For High Purity Industry Download
15:20 - 15:40 Henan Guoxi Ultrapure New Materials Co.,ltd Analysis OF the application FOR ultra-high purity metal materials in the field of semiconductor Download
15:40 - 16:00 5N Plus Inc., Micro Powders Ultra-Fine Metal Powders for a Wide Range of Microelectronic Assemblies Download

 

TechXPOT 4F #L1316

Time Company Topic Download
10:40 - 11:00 Schneider Electric Taiwan Co., Ltd. Innovate semiconductor power management with digitization
11:00 - 11:20 Jusun Instruments Co., Ltd. The Innovation Technology for AMC/Ambient & Stack Gases compositions and PM2.5 Download
11:20 - 11:40 New Fast Technology Co., Ltd. Intelligent On-line AMC Monitoring Technical Conclude in Fab
11:40 - 12:00 Techgo Industrial Co., Ltd. The Research and Design of Modular Structure for Cooling Tower Download
12:00 - 12:20 SEMI Taiwan High-Tech Facility Committee NTUT-A total solution of contamination control for wafers in a FOUP when FOUP door is in open condition.
13:20 - 13:40 Vertiv (Taiwan) Co., Ltd HIGH EFFICIENCY MODES OF OPERATION--Path toward highest energy efficiency without load availability trade-off Download
13:40 - 14:00 GreenFILTEC TAIWAN LTD. Evolution and the future of chemical filter in MAU
14:00 - 14:20 Wholetech System Hitech Limited Dust control technology for Process exhaust gas Download
14:40 - 15:00 GEMÜ Taiwan Ltd. WHAT DO SKYSCRAPERS AND MICROCHIPS HAVE IN COMMON? FOCUS ON THE SEMICONDUCTOR INDUSTRY. Download
15:00 - 15:20 Trusval Technology Co., Ltd. Moving Towards Sustainable Manufacturing: Trusval Solutions and the Upcoming Trend in Semiconductor Field
15:20 - 15:40 ECI Technology Inc. Next generation Chemical process control in Semiconductor Industry
15:40 - 16:00 Ye Siang Enterprise Co., Ltd. The Best AMC Solution in PostMoore Law Era
16:00 - 16:20 JACOBI CARBONS AG Semiconductor Gas Filtration Challenge Download

 

 

 

 Sept 19, 2019

TechXPOT 1F #K3276

Time Company Topic Download
10:30 - 12:00 Taiwan Instrument Research Institute, National Applied Research Laboratories NARLabs 2019 ASEPT Seminar
13:00 - 13:30 SiPlus Co. Advance Integrated Substrate Solutions for Heterogenous Integration Platform Download
13:30 - 14:00 CONNECTEC JAPAN Corporation Low Temp. / Low Load Flip Chip Bonding Technology Download
14:00 - 14:30 SPARKLE TW DEVELOPMENT LIMITED Discussion on Vacuum Reflow Soldering to Improve Solder Yield of Semiconductor Chips Download
14:30 - 15:00 Heraeus 5G: The Future of EMI Shielding in Mobile Phones Download
15:00 - 15:30 Manz Taiwan Ltd. Manz's Solution in FOPLP RDL Formation
15:30 - 16:00 Indium Corporation The Challenge and Solution on Flip-chip and BGA Ball Mount Process Download

 

TechXPOT 4F #L1316

Time Company Topic Download
10:30 - 11:00 SGS Taiwan Ltd. New Development on Qualification and Reliability Assessment of Microelectronic Products for Chemicals of the Semiconductor Process and Automotive Applications Download
11:00 - 11:30 3S Silicon Tech., Inc. Residue Free & Low Void — Formic Acid Vacuum Reflow Oven Download
11:30 - 12:00 SilcoTek Corporation CVD Coatings to Control Metal-Ion and Particulate Contamination Download
13:30 - 14:00 INTEKPLUS Co., Ltd. QUALITY ASSURANCE SOLUTION ON HETEROGENEOUS INTEGRATION
14:00 - 14:30 EVG-JOINTECH CORP. SmartNIL™ Nanoimprint Lithography enabling advanced functionality of optical devices for AR

 

 

 Sept 20, 2019

TechXPOT 1F #K3276

Time Company Topic Download
10:20 - 10:50 Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST) Packaging in Minimal Fab Download
10:50 - 11:10 NIHON SUPERIOR (Taiwan) Co., LTD. Low temperature sintering Nano Silver and SN100C Solder total solution Download
11:10 - 11:30 PBI Advanced Materials Co., Ltd. Ultra high heat resistance materials Download
11:30 - 11:50 Shenzhen Fitech Co., Ltd. Ultrafine solder for semiconductor packaging Download
13:30 - 13:50 Daxin Materials Corp. Multi-functional TBDB Material Solutions for Advanced Packaging Technologies
13:50 - 14:10 Yuhon Enterprise Corporation The application of Conductive Paste

 

TechXPOT 4F #L1316

Time Company Topic Download
10:20 - 10:40 SEMI Taiwan High-Tech Facility Committee MOST Sponsored R&D on Mitigating Magnetic Interference for High-Tech Fab Facilities. Download
11:20 - 11:40 Rayzher Industrial Co., Ltd. High-tech Fab & facility Planning and Design Download
11:40 - 12:00 Joy Allied Technology Inc. The Pre-stage equipment for analysis of heavy metals on wafer surfaces and chemicals bath. T0 ( Transfer zero ) VPD is a new patent VPD invention with safer and faster equipment has zero background. The HPT (High Purity Transporter )system easily can transfer all kinds of acids or base to meters or few hundred meters within a minute.The samples will directly go to ICP MS. Download
14:00 - 15:40 Taiwan Alliance for Sustainable Supply, tass Taiwan Trusted Alliance for Sustainable Supply and Circular Economy

 

*Authorized by instructors ,please respect the intellectual property.

 

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Special Features Booth #K3276, TechXPOT, 1F, TaiNEX 1 Wednesday, September 18
12:40pm to 4:00pm
Special Features Booth #K3276, TechXPOT, 1F, TaiNEX 1 Friday, September 20
10:20am to 2:10pm
Special Features Booth #K3276, TechXPOT, 1F, TaiNEX 1 Thursday, September 19
1:00pm to 4:00pm
Special Features Booth #L1316, TechXPOT, 4F, TaiNEX 1 Wednesday, September 18
10:40am to 4:20pm
Special Features Booth #L1316, TechXPOT, 4F, TaiNEX 1 Thursday, September 19
10:30am to 4:30pm
Special Features Booth #L1316, TechXPOT, 4F, TaiNEX 1 Friday, September 20
10:20am to 12:00pm
Special Features Booth #K2041a, 1F, TaiNEX 1 Thursday, September 19
11:50am to 1:00pm
Thursday, September 19
3:40pm to 4:10pm
Thursday, September 19
4:35pm to 4:50pm
Friday, September 20
2:25pm to 2:50pm
Special Features Room Happiness, 3F, TaiNEX 1 Wednesday, September 18
12:00pm to 1:20pm
Welcome Remarks by SEMI Executive:
Wednesday, September 18
8:55am to 9:00am
Special Features Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 20
10:00am to 11:30am
Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 20
10:00am to 11:30am

 

Date:Friday, September 20th, 2019
Time:10:00 - 13:30 (10:00-10:10 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 
Theme: Empowering Women for the Future 
Outline: 

Our industry’s future success is dependent on innovation, diversity and inclusion of the best ideas in the world. Panelists from various categories comprising suppliers and customers will discuss key challenges they encountered, success stories, and ideas for how each company can increase ownership diversity across the semiconductor industry. Join us to understand more about “Empowering Women in the Future” at Women-in-Tech Forum!

 

Theme

Empowering Women for the Future 

Moderator

 Dr. Tri-Rung Yew, Professor, Department of Materials Science and Engineering , National Tsing Hua University

Panelists
1. Ms. Nina Lin, General Manager, Taiwan & ASEAN, Mentor, a Siemens Business
2.
Dr. Hedy Ho, Chief of Marketing and Operations , Microsoft Taiwan 
3. Ms. Julia Lu, Chief of Staff ,Semiconductor Products Group Taiwan, Japan, and China, Sales & Marketing,Applied Materials Taiwan

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

View Full Agenda

Contact
SEMI Taiwan
Ms. Lily Lee
TEL: 886.3.560.1777 EXT. 509
Email: llee@semi.org

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