Advanced Packaging Technology Symposium

Date：Tuesday, September. 04, 2018
Time：8:30 - 17:30 (08:30 - 09:00 for registration)
Venue：Grand Ballroom, 3F,  Grand Luxe Banquet, CTBC Financial Park
Theme：Innovative Leadership for 3D-SiP Advanced Packaging Technology
Forum Chairman： Mr. Albert Lan/ 藍章益, Global Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee
Forum Moderator：
• Mr. Albert Lan/ 藍章益, Global Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee
• Ms. Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science

* Tax Included

* Forum agenda is subject to change