Advanced Packaging Technology Symposium

Date：Tuesday, September. 04, 2018
Time：8:30 - 18:30 (08:30 - 09:00 for registration)
Venue：Grand Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei 
Theme：Innovative Leadership for 3D-SiP Advanced Packaging Technology
Forum Chairman： Mr. Albert Lan/ 藍章益, Global Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee
Forum Moderator：
• Mr. Albert Lan/ 藍章益, Global Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee
• Ms. Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science

Outline:

    New application markets, such as Networking, AI, Autonomous Car, 5G, and IOT/Wearable are enabling a new vision era of advanced packaging technologies, including SiP, Fan Out, 3DIC, and 2.5DIC, and also initializing some  innovative Equipment  & Material, and CtW/WtW Hybrid Bonding solution developments.

    To address equipment & material solutions for advanced packaging technology, the forum have invited lots of experts from Fabless design house, IDM, Foundry, Packaging, Equipment and Materials suppliers to share their treasure experiences on future technology development roadmap, challenges, and packaging solutions.

■ Forum focal points:

● Addressing on advanced packaging technologies, including SiP, Fan Out, 3DIC and 2.5DIC
● Addressing innovative Equipment, Materials, and CtW/WtW Hybrid Bonding technology solutions.
 

■ Forum will deep dive:

I.   Research and market trends of latest new applications

II. System and product applications

III. Innovative packaging technology challenges and solutions

IV. Novel material & equipment solution readiness

* Tax Included

* Forum agenda is subject to change

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