Date: Thursday, September 6th, 2018
Venue：Grand Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei
Theme: Wafer Level System Integration for Edge Computing, HPC and AI
Forum Chairman: Dr. Douglas Yu/ 余振華, Vice President, TSMC
Moderator: Dr. K.C. Yee/ 余國寵, Director, TSMC
Mobile, high-performance computing (HPC), automotive and internet of things (IoT) have been identified as four main growth engines for semiconductor industry. While artificial intelligence (AI) and 5G technologies are the key drivers boosting aforementioned application growths.
The pace of innovation is accelerating to meet ever-increasing diversification. Ubiquitous computing emerges from science fiction into a daily life reality in recent years, in part by handheld mobile computing, and in part by growing popularity of personal wearable devices, inescapable sensors, and by upcoming 5G enablement with affordable cost. On the other end of computing spectrum, machine learning (ML), artificial intelligence (AI) have become key drivers in cloud and high performance market. According IDC 2017, the global data traffic will grow rapidly from 16 ZB in 2016 to 163 ZB in 2026, a 10X growth in 10 years. System architects are hungry for higher performance computing and wider data pipelines to meet such explosive demands.
Foundry wafer level system integration (WLSI) leads the semiconductor industry into a new era of system scaling beyond Moore's Law with two golden examples of technology platforms. One is high density integrated fan-out (aka InFO_PoP) in smartphone and the other is silicon interposer, 3D chip stacking (aka CoWoS®) in HPC, ML, and AI. Adoptions of high density WLSI technologies in application-specific systems like intelligent mobiles, smart networks, 5G AIP (antenna in package), and HPC & AI with a larger Si interposer size, more HBM cubes, higher TDP advanced SoC, and optical interconnects become an unstoppable trend.
In this forum, speakers from leading fabless design, foundry, HBM house, EDA tools, market analysis, optical interconnect, and process tool supply will share their insights and vision. Audience would benefit from this forum with the followings
• Advanced WLSI technologies
• Market opportunity and landscape
• Novel enablement tools, materials, and processes