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SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE

SiP Global Summit will explore the shifted landscape and potential opportunities of semiconductor advanced packaging technology under the wave of AI and 5G applications. TSMC, ASE, SPIL, Micron, PTI, Amkor、ASMPT、Camtek、imec、Lam Research、SPTS、UCLA will take you to view the Next Generation of Advanced packaging.

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