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SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 1

Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
8:30am to 5:40pm

Date:Tuesday, September 17th, 2019
Time:08:30 - 17:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI  Applications
Outline: (TBD)

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

NTD 5,040 NTD 6,300

*Tax Included

 
 

Sponsored by:

       

 

 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

Do you want to attend this session? REGISTER NOW!

Mr. Chris Jones
Director, PVD Product Management
SPTS Technologies Ltd
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