TWTC Nangang Exhibition Hall Wednesday, September 18 11:00am


Advanced Materials Technology High-Tech Facility Innovative Technology & Product 


 Sept 18, 2019

TechXPOT 1F #K3276

Time Company Topic Download
12:40 - 13:00 Purification Equipment Research Institute Of CSIC Development Status And The Future Of Special Gases In Mainland China
13:00 - 13:20 Chongqing Qunwin Electronic Materials Co., Ltd. Large size, high density packaging material description - Cu core ball and solder column Download
13:20 - 13:40 ANGUS CHEMICAL COMPANY ANGUS VOLTEN Offerings for Electronic Process Download
13:40 - 14:00 Namics Corporation Copper foil surface treatment technology and low dielectric materials for high-speed transmission
14:00 - 14:20 Shanghang Zijin Jiabo Electronic New Material Technology Co., Ltd. Study on alloy wire and copper wire
14:20 - 14:40 Heraeus Secure Your Key To Future Power Electronics Download
14:40 - 15:00 Evertech Enterprise Co., Ltd. Introduction of "Evertech" and the products Download
15:00 - 15:20 Arkema (China) Investment Co., Ltd. ARKEMA KYNAR® PVDF For High Purity Industry Download
15:20 - 15:40 Henan Guoxi Ultrapure New Materials Co.,ltd Analysis OF the application FOR ultra-high purity metal materials in the field of semiconductor Download
15:40 - 16:00 5N Plus Inc., Micro Powders Ultra-Fine Metal Powders for a Wide Range of Microelectronic Assemblies Download


TechXPOT 4F #L1316

Time Company Topic Download
10:40 - 11:00 Schneider Electric Taiwan Co., Ltd. Innovate semiconductor power management with digitization
11:00 - 11:20 Jusun Instruments Co., Ltd. The Innovation Technology for AMC/Ambient & Stack Gases compositions and PM2.5 Download
11:20 - 11:40 New Fast Technology Co., Ltd. Intelligent On-line AMC Monitoring Technical Conclude in Fab
11:40 - 12:00 Techgo Industrial Co., Ltd. The Research and Design of Modular Structure for Cooling Tower Download
12:00 - 12:20 SEMI Taiwan High-Tech Facility Committee NTUT-A total solution of contamination control for wafers in a FOUP when FOUP door is in open condition.
13:20 - 13:40 Vertiv (Taiwan) Co., Ltd HIGH EFFICIENCY MODES OF OPERATION--Path toward highest energy efficiency without load availability trade-off Download
13:40 - 14:00 GreenFILTEC TAIWAN LTD. Evolution and the future of chemical filter in MAU
14:00 - 14:20 Wholetech System Hitech Limited Dust control technology for Process exhaust gas Download
15:00 - 15:20 Trusval Technology Co., Ltd. Moving Towards Sustainable Manufacturing: Trusval Solutions and the Upcoming Trend in Semiconductor Field
15:20 - 15:40 ECI Technology Inc. Next generation Chemical process control in Semiconductor Industry
15:40 - 16:00 Ye Siang Enterprise Co., Ltd. The Best AMC Solution in PostMoore Law Era
16:00 - 16:20 JACOBI CARBONS AG Semiconductor Gas Filtration Challenge Download




 Sept 19, 2019

TechXPOT 1F #K3276

Time Company Topic Download
10:30 - 12:00 Taiwan Instrument Research Institute, National Applied Research Laboratories NARLabs 2019 ASEPT Seminar
13:00 - 13:30 SiPlus Co. Advance Integrated Substrate Solutions for Heterogenous Integration Platform Download
13:30 - 14:00 CONNECTEC JAPAN Corporation Low Temp. / Low Load Flip Chip Bonding Technology Download
14:00 - 14:30 SPARKLE TW DEVELOPMENT LIMITED Discussion on Vacuum Reflow Soldering to Improve Solder Yield of Semiconductor Chips Download
14:30 - 15:00 Heraeus 5G: The Future of EMI Shielding in Mobile Phones Download
15:00 - 15:30 Manz Taiwan Ltd. Manz's Solution in FOPLP RDL Formation
15:30 - 16:00 Indium Corporation The Challenge and Solution on Flip-chip and BGA Ball Mount Process Download


TechXPOT 4F #L1316

Time Company Topic Download
10:30 - 11:00 SGS Taiwan Ltd. New Development on Qualification and Reliability Assessment of Microelectronic Products for Chemicals of the Semiconductor Process and Automotive Applications Download
11:00 - 11:30 3S Silicon Tech., Inc. Residue Free & Low Void — Formic Acid Vacuum Reflow Oven Download
11:30 - 12:00 SilcoTek Corporation CVD Coatings to Control Metal-Ion and Particulate Contamination Download
14:00 - 14:30 EVG-JOINTECH CORP. SmartNIL™ Nanoimprint Lithography enabling advanced functionality of optical devices for AR



 Sept 20, 2019

TechXPOT 1F #K3276

Time Company Topic Download
10:20 - 10:50 Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST) Packaging in Minimal Fab Download
10:50 - 11:10 NIHON SUPERIOR (Taiwan) Co., LTD. Low temperature sintering Nano Silver and SN100C Solder total solution Download
11:10 - 11:30 PBI Advanced Materials Co., Ltd. Ultra high heat resistance materials Download
11:30 - 11:50 Shenzhen Fitech Co., Ltd. Ultrafine solder for semiconductor packaging Download
13:30 - 13:50 Daxin Materials Corp. Multi-functional TBDB Material Solutions for Advanced Packaging Technologies
13:50 - 14:10 Yuhon Enterprise Corporation The application of Conductive Paste


TechXPOT 4F #L1316

Time Company Topic Download
10:20 - 10:40 SEMI Taiwan High-Tech Facility Committee MOST Sponsored R&D on Mitigating Magnetic Interference for High-Tech Fab Facilities. Download
11:20 - 11:40 Rayzher Industrial Co., Ltd. High-tech Fab & facility Planning and Design Download
11:40 - 12:00 Joy Allied Technology Inc. The Pre-stage equipment for analysis of heavy metals on wafer surfaces and chemicals bath. T0 ( Transfer zero ) VPD is a new patent VPD invention with safer and faster equipment has zero background. The HPT (High Purity Transporter )system easily can transfer all kinds of acids or base to meters or few hundred meters within a minute.The samples will directly go to ICP MS. Download
14:00 - 15:40 Taiwan Alliance for Sustainable Supply, tass Taiwan Trusted Alliance for Sustainable Supply and Circular Economy


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