TWTC Nangang Exhibition Hall Wednesday, September 18 11:00am

Advanced Materials Technology High-Tech Facility Innovative Technology & Product 


 Sept 18, 2019

TechXPOT 1F #K3276

Time Company Topic Language
12:40 - 13:00 Purification Equipment Research Institute Of CSIC Development Status And The Future Of Special Gases In Mainland China ZH
13:00 - 13:20 Chongqing Qunwin Electronic Materials Co., Ltd. Large size, high density packaging material description - Cu core ball and solder column ZH
13:20 - 13:40 ANGUS CHEMICAL COMPANY ANGUS VOLTEN Offerings for Electronic Process ZH
13:40 - 14:00 Namics Corporation Copper foil surface treatment technology and low dielectric materials for high-speed transmission EN
14:00 - 14:20 Shanghang Zijin Jiabo Electronic New Material Technology Co., Ltd. Study on alloy wire and copper wire ZH
14:20 - 14:40 Heraeus Secure Your Key To Future Power Electronics ZH
14:40 - 15:00 Evertech Enterprise Co., Ltd. Introduction of "Evertech" and the products ZH
15:00 - 15:20 Arkema (China) Investment Co., Ltd. ARKEMA KYNAR® PVDF For High Purity Industry ZH
15:20 - 15:40 Henan Guoxi Ultrapure New Materials Co.,ltd Analysis OF the application FOR ultra-high purity metal materials in the field of semiconductor ZH
15:40 - 16:00 5N Plus Inc., Micro Powders Ultra-Fine Metal Powders for a Wide Range of Microelectronic Assemblies EN


TechXPOT 4F #L1316

Time Company Topic Language
10:40 - 11:00 Schneider Electric Taiwan Co., Ltd. Innovate semiconductor power management with digitization EN
11:00 - 11:20 Jusun Instruments Co., Ltd. The Innovation Technology for AMC/Ambient & Stack Gases compositions and PM2.5 ZH
11:20 - 11:40 New Fast Technology Co., Ltd. Intelligent On-line AMC Monitoring Technical Conclude in Fab ZH
11:40 - 12:00 Techgo Industrial Co., Ltd. The Research and Design of Modular Structure for Cooling Tower ZH
12:00 - 12:20 SEMI Taiwan High-Tech Facility Committee NTUT-A total solution of contamination control for wafers in a FOUP when FOUP door is in open condition. ZH、EN
13:20 - 13:40 Vertiv (Taiwan) Co., Ltd HIGH EFFICIENCY MODES OF OPERATION--Path toward highest energy efficiency without load availability trade-off ZH
13:40 - 14:00 GreenFILTEC TAIWAN LTD. Evolution and the future of chemical filter in MAU ZH
14:00 - 14:20 Wholetech System Hitech Limited Dust control technology for Process exhaust gas ZH
15:00 - 15:20 Trusval Technology Co., Ltd. Moving Towards Sustainable Manufacturing: Trusval Solutions and the Upcoming Trend in Semiconductor Field ZH
15:20 - 15:40 ECI Technology Inc. Next generation Chemical process control in Semiconductor Industry EN
15:40 - 16:00 Ye Siang Enterprise Co., Ltd. The Best AMC Solution in PostMoore Law Era ZH
16:00 - 16:20 JACOBI CARBONS AG Semiconductor Gas Filtration Challenge EN




 Sept 19, 2019

TechXPOT 1F #K3276

Time Company Topic Language
10:30 - 12:00 Taiwan Instrument Research Institute, National Applied Research Laboratories NARLabs 2019 ASEPT Seminar ZH
13:00 - 13:30 SiPlus Co. Advance Integrated Substrate Solutions for Heterogenous Integration Platform EN
13:30 - 14:00 CONNECTEC JAPAN Corporation Low Temp. / Low Load Flip Chip Bonding Technology EN
14:00 - 14:30 SPARKLE TW DEVELOPMENT LIMITED Discussion on Vacuum Reflow Soldering to Improve Solder Yield of Semiconductor Chips ZH
14:30 - 15:00 Heraeus 5G: The Future of EMI Shielding in Mobile Phones EN
15:00 - 15:30 Manz Taiwan Ltd. Manz's Solution in FOPLP RDL Formation ZH
15:30 - 16:00 Indium Corporation The Challenge and Solution on Flip-chip and BGA Ball Mount Process ZH


TechXPOT 4F #L1316

Time Company Topic Language
10:30 - 11:00 SGS Taiwan Ltd. New Development on Qualification and Reliability Assessment of Microelectronic Products for Chemicals of the Semiconductor Process and Automotive Applications EN
11:00 - 11:30 3S Silicon Tech., Inc. Residue Free & Low Void — Formic Acid Vacuum Reflow Oven EN
11:30 - 12:00 SilcoTek Corporation CVD Coatings to Control Metal-Ion and Particulate Contamination EN
14:00 - 14:30 EVG-JOINTECH CORP. SmartNIL™ Nanoimprint Lithography enabling advanced functionality of optical devices for AR EN



 Sept 20, 2019

TechXPOT 1F #K3276

Time Company Topic Language
10:20 - 10:50 Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST) Packaging in Minimal Fab EN
10:50 - 11:10 NIHON SUPERIOR (Taiwan) Co., LTD. Low temperature sintering Nano Silver and SN100C Solder total solution ZH
11:10 - 11:30 PBI Advanced Materials Co., Ltd. Ultra high heat resistance materials ZH
11:30 - 11:50 Shenzhen Fitech Co., Ltd. Ultrafine solder for semiconductor packaging ZH
13:30 - 13:50 Daxin Materials Corp. Multi-functional TBDB Material Solutions for Advanced Packaging Technologies ZH
13:50 - 14:10 Yuhon Enterprise Corporation The application of Conductive Paste EN


TechXPOT 4F #L1316

Time Company Topic Language
10:20 - 10:40 SEMI Taiwan High-Tech Facility Committee MOST Sponsored R&D on Mitigating Magnetic Interference for High-Tech Fab Facilities. ZH
11:20 - 11:40 Rayzher Industrial Co., Ltd. High-tech Fab & facility Planning and Design ZH
11:40 - 12:00 Joy Allied Technology Inc. The Pre-stage equipment for analysis of heavy metals on wafer surfaces and chemicals bath. T0 ( Transfer zero ) VPD is a new patent VPD invention with safer and faster equipment has zero background. The HPT (High Purity Transporter )system easily can transfer all kinds of acids or base to meters or few hundred meters within a minute.The samples will directly go to ICP MS. ZH
14:00 - 15:40 Taiwan Alliance for Sustainable Supply, tass Taiwan Trusted Alliance for Sustainable Supply and Circular Economy ZH



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