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Schedule at a Glance

Wednesday, September 13, 2017

Technology

08:30 – 17:30

Advanced Packaging Technology Symposium

09:00 – 17:00

MEMS & Sensors Forum

13:00 – 17:00

Semiconductor Materials Forum

13:00 - 17:00

Smart Manufacturing Forum

13:00 - 17:00

Sustainable Manufacturing Forum

08:30 - 17:00

ITC-Asia Day 1

Business

08:30 – 12:00

Market Trends Forum

13:00 – 17:00

Executive Summit -Grand Opening Keynote Session

Partner

13:00 – 17:00

Sustainable Supply Management Forum

09:00 - 12:00

Advanced Packaging Tutorials - Bumping Technology

Thursday, September  14, 2017

Technology

08:30 – 17:00

SiP Global Summit 2017- 3D Technology Forum

08:30 – 17:00

High-Tech Facility International Forum

08:30 – 17:00

Power and Compound Semiconductors Technology Forum

13:00 – 17:00

Laser Technologies in Advanced Packaging Process 

08:30 – 17:00

ITC-Asia Day 2

Business

09:00 – 12:00

CFO Forum

Partner

08:30 – 12:00

Cross-Straits Integrated Circuit Cooperation Seminar

09:00 – 12:00

Advanced Packaging Tutorials - Dicing & Attach Technology

Friday, September  15, 2017

Technology

08:30 – 17:30

SiP Global Summit 2017- Embedded and Fan Out Package Technology Forum

08:30 – 17:30

IC Forum

08:30 – 12:00

Smart Automotive Forum

08:30 – 17:00

Circular Economy Forum

08:30 – 17:00

Smart MedTech Forum

08:30 – 17:00

ITC-Asia Day 3

Partner

08:30 – 17:00

Joint Symposium of eMDC-2017 & ISSM-2017

09:00 – 12:00

Advanced Packaging Tutorials - Encapsulation Technology

 


Contact

SEMI Taiwan

Ms. Lily Lee

Tel: 886.3.560.1777 ext.  509

Email:  llee@semi.org

 

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