Semiconductor Materials Forum


 Wednesday, September 13th, 2017


 10:00 - 17:10 (10:00 - 10:25 for registration)


 Grande Luxe Banquet Splendor Ballroom, Taipei, Taiwan


 Race to Advanced Semiconductor Solutions through Integrated Materials Ecosystem


 Forum Chairman: 

Mr. Ming-Te Chen, Deputy Director, TSMC / Chairman, SEMI Taiwan Materials Committee

 Forum Moderator: 

Mr. Andy Tuan, Managing Director, Linx Consulting (USA) / Consultant of SEMI Materials Committee

Dr. S. H. Chou, Engineer, TSMC

Mr. Mark Thirsk, Managing Partner, Linx Consultin

 Forum Outline: 


       Materials are playing an increasingly important role in driving semiconductor manufacturing technology advancement. To cope with this trend, both semiconductor material users and suppliers need to work closely together to overcome a variety of new challenges including new material innovation, cost effectiveness, performance control, quality management as well as EHS regulation compliance. In this forum, speakers from around the world involved in the semiconductor materials value chain will share insights of the latest technologies, products, markets and business management approaches. These experts will address a wide variety of topics that are critical to develop an integrated materials ecosystem through close collaboration to fulfill innovation, quality, cost, and sustainability requirements. Meanwhile this forum is an excellent event for networking with your industry peer groups. We warmly welcome your participation.
















10:00 - 10:25


10:25 - 10:35

 Welcome Remarks by SEMI Executive

 Mr. Tom Salmon, Vice President of Collaborative Technology Platforms, SEMI

 Opening Remarks & Moderator

 Mr. Ming-Te Chen, Deputy Director, TSMC / Chairman, SEMI Taiwan Materials Committee

 Mr. Andy Tuan, Managing Director, Linx Consulting (USA) / Consultant of SEMI Materials Committee

10:35 - 11:00

 Topic 1: Advanced Materials Innovation Enabling 7nm and Beyond

 Speaker: Dr. Montray C. Leavy, Deputy CTO, Entegris

11:00 - 11:25

 Topic 2: Multidimensional Collaborations within the Semiconductor Eco System for Materials Innovations: Rewards and Challenges

 Speaker: Dr. Ravi Kanjolia, CTO, Head of RD, Merck

11:25 - 11:50

 Topic 3: Glass-Based Solutions Addressing Key Trends in IoT, Consumer Electronics and Semiconductors

 Speaker: Mr.David R. Velasquez, Vice President and Director of Precision Glass Solutions, Corning

11:50 - 13:15

 Lunch Break

13:15 - 13:20

 Opening Remarks & Moderator

 Dr. S. H. Chou, Engineer, TSMC

13:20 - 13:45

 Topic 4: Material Challenges & Opportunities in Semiconductor Value Chain

 Speaker: Dr. Ashutosh Misra, CTO, Air Liquide

13:45 - 14:10

 Topic 5 : With Jumping Evolution of Materials to Accelerate the Generation Change of Semiconductor Industry

 Speaker: Dr. Chien-Yung Ma, Chairman, Solar Applied Materials 

14:10 - 14:35

 Topic 6: Advanced CMP For Next Generation BEOL Integration

 Speaker: Dr. Ming-Shih Tsai, Senior Scientist, Versum Materials

14:35 - 15:00

 Topic 7: Leading Edge Packaging Solution Powered by Open Innovation,  Material clustering and JOINT Project

 Speaker: Dr. Toshhisa Nonaka, Technical Director, Hitachi Chemical

15:00 - 15:25

 Topic 8: The New 28Si-lk Road:  Challenges and Opportunities in China for Electronic Material Suppliers

 Speaker: Ms. Candice Fan, Global Strategic Sourcing Manager, Linde Electronics

15:25 - 15:50

 Topic 9: Novel glass for semiconductor packaging in the field of Fan-out WLP/PLP Process and 3D packaging

 Speaker: Mr. Toshihisa Okada, manager, AGC

15:50 - 16:10


16:10 - 17:10

 Panel Sessions:

 Moderator: Mr. Mark Thirsk, Managing Partner, Linx Consulting

 Session 1 - Company Introduction (5 minutes for each panelist)

 Panelist 1: Dr. Joe Wu, Deputy Director, TSMC

 Panelist 2: Dr. Austin Chen, Managing Director of Asia Pacific, Avantor

 Panelist 3: Dr. Hsing-Chia Wang, Director, LCY Chemical

 Session 2 - Panel Discussion -  All Panelists and Invited Forum Speakers



■ Programs are subject to change without prior notice. 

■ All presentations will be conducted in English. 

■ No recording/photography during the seminar.


Early Bird / SEMI Member

Original Price (Aug 16 - Onsite)



(Currency: NTD)


Group Registration (Jul 15 - Aug 15)

3-5 people

6 people above



(Currency: NTD)




SEMI Taiwan

Ms PonPon Lo

TEL: 886.3.560.1777 EXT. 511

Email: semiprogramtw@gmail.com


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