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SiP Global Summit 2017 - Embedded and Fan Out Package Technology Forum

 Date:

 Friday, September 15th, 2017

 Time:

 08:30 – 17:20 (08:30 – 08:50 for registration)

 Venue:

 Grande Luxe Banquet Grand Ballroom, Taipei, Taiwan

 Theme:

 Innovative "Embedded Substrate" and "Fan-Out" Technology to Enable 3D-SiP Devices

 

 Forum Chairman: 

Forum Chairman

Mr. Albert Lan, Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee

Forum Moderator:

Mr. Albert Lan, Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee

Dr. Walter Jau, Senior Technical Director, ASE Corp R&D

 Forum Outline: 

 

In the strong competitive markets in IOT/Wearable/Mobile devices, how to integrate multi-functional chips into thinner and more compact form factor always brings big technical challenges to whole package supply chain, including assembly houses, and equipment/ material partners.

•Embedded Die in Organic Laminate Substrate

•Embedded Die in Mold Compound (molded WLCSP; Fan-Out; focus on Panel FO)

In 2017, Organic Embedded Substrate and Fan-Out Tech Forum will further deep dive into:

I.   Research and marketing of latest IOT/Wearable/Mobile applications

II.  ICT Infrastructure and appliance system possibilities

III. Innovative package solutions and challenges

IV. Novel material & equipment readiness

 

Trying to provide a whole Embedded and Fan-Out technology picture, and how to enable the thinner and smaller package for smart mobility in IoT Era. 

 

 

Organizer:        

 

 

 

 

 

                                                   

Sponsor:

           
 
           

 

 

Agenda

Time

Topic / Speaker

08:30 - 08:50

 Registration

08:50 - 09:00

 Welcome Remarks by SEMI Executives

 Mr. Tom Salmon, Vice President, Collaborative Technology Platforms, SEMI

 Opening Remarks & Moderator:

 Mr. Albert Lan, Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee

09:00 - 09:30

 Topic 1: Market Trend I: Markets and Drivers for FO-WLP:  How Far Will it Go?

 Speaker: Ms. E. Jan Vardaman, CEO & Founder, TechSearch

09:30 - 09:55

 Topic 2: Transforming Electronic Interconnect – Breaking through historical boundaries

 Speaker: Mr. Tim Olson, Founder & CTO, Deca Technologies

09:55 - 10:20

 Topic 3: : Fine Line Panel Level Fan-Out

 Speaker: Dr. David Fang, CTO, Vice President, PTI

10:20 - 10:35

 Break

10:35 - 11:00

  Topic 4: Simulation Studies of Fanout Packages
 Speaker: Dr. Shin-Puu Jeng, Director, TSMC, NTM/BTSD, TSMC

11:00 - 11:25

 Topic 5: Challenges with next gen packages
 Speaker: Dr. Isaac Ow, Key Product Unit Head, Applied Materials

11:25 - 11:50

 Topic 6: Fan Out – Simple to Complex
 Speaker: Dr. John Hunt, Senior Director, ASE

11:50 - 12:15

 Topic 7: Advanced Packaging Inflection – Technology Trends and Growth Opportunities

 Speaker: Mr. Manish Ranjan, Managing Director for Advanced Packaging Business Unit, Lam Research

12:15 - 13:15

 Lunch Break

13:15 - 13:20

 Opening Remarks & Moderator

 Dr. Walter Jau, Senior Technical Director, Corp R&D, ASE

13:20 - 13:45

 Topic 8: Market Trend – II: Fan-out Packaging Technologies and Markets

 Speaker: Mr. Jérôme AZEMAR, Senior Market and Technology Analyst, Yole Développement

13:45 - 14:10

 Topic 9: Panel System ECD Technology --- Wafer to Panel

 Speaker: Dr. Zhen Liu, Director of Process Engineering ,TEL NEXX

14:10 - 14:35

 Topic 10: Proposal for Adopting Thermoset Resin to Enable 『Joint Protection Flux & Paste』 Overcome Fine Pitch, Low Temperature Assembly Issues Plus Reliability Reinforcement

 Speaker: Mr. Lewis Huang, Vice President, Senju Eletronic

14:35 - 15:00

 Topic 11: Reliability of Ultra-fine Line Multi-Redistribution Layers Enabled by Excimer Laser Dual Damascene Process for Wafer and Panel Level Packaging

 Speaker: Dr. Habib Hichri, Applications Engineering Director, SUSS

 

 SUSS Lucky Draw

15:00 - 15:15

 Break

15:15 - 15:40

 Topic 12: Adopting Component Embedding In High Power Density Power Modules
 Speaker: Mr. Risto Tuominen, Consultant, GE

15:40 - 16:05

 Topic 13: UBM/RDL PVD for FOWLP Applications beyond Mobile Communications

 Speaker: Mr. Nick Knight, PVD Product Manager, SPTS Technologies Ltd

16:05 - 16:30

 Topic 14: Encapsulation Challenges and Solution Large Format Packaging 

 Speaker: Dr. Eric Kuah, Vice President,  ASM

16:30 - 16:55

 Topic 15: Additive impact on Cu properties for Fan-out Wafer Level Packaging applications 

 Speaker: Dr. Dirk Rohde, R&D Manager, Atotech

16:55 - 17:20

 Topic 16:  Towards Industrialization of Fan-out Panel Level Packaging

 Speaker: Dr. Tanja Braun, Group Manager, Fraunhofer IZM

 

 SPIL Lucky Draw

 

  Adjournment

 

■ Programs are subject to change without prior notice. 

■ All presentations will be conducted in English. 

■ No recording/photography during the seminar.

 

Price

Early Bird / SEMI Member

Original Price (Aug 16 - Onsite)

4000

5000

(Currency: NTD)

 

Group Registration (July 15 - Aug 15)

3-5 people

6 people above

3500

3000

(Currency: NTD)

     

       

 


Contact

SEMI Taiwan

Ms PonPon Lo

TEL: 886.3.560.1777 EXT. 511

Email: semiprogramtw@gmail.com

 

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