+886.3.560.1777

English

Technology Programs

Wednesday, September 13, 2017

09:00 – 16:50

Advanced Packaging Technology Symposium

08:30 – 16:25

MEMS & Sensors Forum

10:00 – 17:10

Semiconductor Materials Forum

13:30 – 17:15

Smart Manufacturing Forum

12:50 – 17:00

Sustainable Manufacturing Forum

13:30 – 17:00

ITC-Asia Day 1

Thursday, September  14, 2017

08:20 – 17:00

SiP Global Summit 2017- 3D Technology Forum

08:30 – 17:20

High-Tech Facility International Forum

08:30 – 17:05

Power and Compound Semiconductors Technology Forum

13:00 – 16:15

Laser Technologies in Advanced Packaging Process

08:30 – 17:00

ITC-Asia Day 2

Friday, September  15, 2017

08:30 – 17:20

SiP Global Summit 2017- Embedded and Fan Out Package Technology Forum

09:00 – 16:25

IC Forum

08:30 – 11:35

Smart Automotive Forum

13:00 – 16:05

Smart MedTech Forum

09:30 – 17:00

Circular Economy Forum

08:30 – 17:00

ITC-Asia Day 3

 


Contact

SEMI Taiwan

Ms. PonPon Lo

Tel: 886.3.560.1777 ext.  511

Email: semiprogramtw@gmail.com

 

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