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TechXPOT - Materials

Thursday, September 14, 2017

Time

Company

Topic

Language

13:00 - 13:30

Heraeus Holding GmbH

 Advanced Packaging Materials

 Ms. Li-san Chan Global Product Manager

Eng. / Chi.

13:30 - 13:50

CohPros International Co., Ltd

 Hi - TC solder ball

 Mr. Brain Chou Vice President

Chi.

13:50 - 14:10

SANYU REC CO.,LTD

 Advanced Packaging Materials

 Mr. Nakao Akira Duty Sales Manager

Eng.

14:10 - 14:30

Indium Corporation of America

 Challenges in Materials Application for SiP 

 Ms. Sze Pei Lim Asia Semiconductor Product Manager

Eng.

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