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TechXPOT - New Product Launch

Thursday, September 14, 2017

Time

Company

Topic

Language

11:30 - 12:00

CONNECTEC JAPAN CORP

 Lowest temperature Flip Chip Bonding for MEMS,Sensor,and FHE by MonsterPAC

 前田勝德 經理

Chi.

13:00 - 13:30

MSSCORPS Co. Ltd

 Evolution of Intel 14nm vs.14nm plus from Material Analysis Point of View

 Dr. Shih-hsin Chang, Director

Chi.

13:30 - 14:00

U.K. TECHNOLOGY CORP.

 Introduction of Plasma Indicator "PLAZMARK" 

 Mr. SEISAKU OSHIRO, Manager

Chi.

15:30 - 16:00

Advanced Dicing Technologies Ltd.

 The Balancing Point

 Mr. Moshe Plopsky, Managing Director ADT Taiwan

Eng.

Friday, September 15, 2017

13:10 - 13:40

Aerotech Taiwan

 Cutting edge piezo Nano positioning technology in Semiconductor application

 Mr. Willam Yeh, Branch Manager

Chi.

13:40 - 14:10

EVG - Jointech Corp.

 Recent Advances in Hybrid Bonding Technology for High Volume 3D IC Manufacturing

 Ms. Cindy Lee, Technology Development & IP Manager Taiwan

Chi.

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