HOW TO EXHIBIT

SEMICON Taiwan 2011
3D IC & Advanced Packaging/Testing Pavilion

3D IC is expected to be a critical technology of high integration, size decreasing and low power consumption. The shipment of 3D IC wafer will approach 10 million units in by 2012 and the strong market demand will drive innovations in packaging & testing filed. (Source: Yole Développment)

 

Features for 3D IC & Advanced Packaging/Testing Pavilion

  • Innovative Technology Center
    This event is designed for exhibitors and visitors who would like to get to know more about 3D IC & Advanced Packaging/Testing technology and technical solutions.
  • 3D IC & Advanced Packaging/Testing Exclusive Marketing and Promotion Programs
    Dedicated exhibitor visibility and marketing programs to help you stand out from the crowd and attract high-quality buyers, investors, technologists, academics and media attendees.
  • 3D IC & Advanced Packaging/Testing Forum
    Besides the pavilion, 3D IC Forum will bring attendees the latest industry development and solution.
  • Connect with Global and Local Business
    3D IC & Advanced Packaging/Testing Pavilion is the ideal platform for overseas solution providers and local suppliers and service companies to connect with business partners.

 

Benefits of 3D IC & Advanced Packaging/Testing Pavilion

  • Value-pricing: total cost less than if items purchased separately
    - SEMI Member NT$ 103,950
    - Non-Member NT$ 139,860
    (    * Above price is tax inclusive)
  • Turnkey Exhibition solution for all your needs
    - Pre-built hard-wall booth
    - Basic furniture: reception counter, bar stool, wastebasket
    - Lighting with power and an additional 500w of power
  • Special pre-show, onsite and post-show news coverage for 3D IC & Advanced Packaging/Testing Pavilion participants
  • Special 3D IC & Advanced Packaging/Testing Pavilion pre-show and onsite promotion
  • A complimentary speaking opportunity (30 mins) at Innovative Technology Center to present your latest developments to the industrial audience

 

Reserve Your Exhibition Space Today!

3D IC & Advanced Packaging/Testing Pavilion Application Form download

 

Contact SEMI :
Ms. Ana Li, SEMI Taiwan
Tel: +886.3.573.3399 ext. 224
Fax: +886.3.573.3355
Email: ali@semi.org