PAVILIONS

Advanced Packaging/Testing Pavilion 

3D IC is expected to be a critical technology of high integration, size decreasing and low power consumption. The shipment of 3D IC wafer will approach 10 million units in by 2012 and the strong market demand will drive innovations in packaging & testing filed. (Source: Yole Développment)

Features

● Theme Pavilion  

 Global major companies from around the world will feature product display and programs on the latest 3D IC & SiP developments. 

● SiP Global Summit

This 3-day SiP Global Summit will representatives from 25 of the world’s top-notch IT firms slated to share insights into the 3D IC, TSV, silicon interposer and embedded substrate technologies.

Polish your industry knowledge through the systematic session arrangement and the most inspiring speeches from the CTOs from above global leading companies!

● Supplier Search Program

The Supplier Search programs can gain you face-to-face access with leading device manufacturers looking for new solutions and suppliers. 

You will learn the latest MEMS technology developments of major companies through their live shows and interactive displays. SEMICON Taiwan is the best platform to identify business partners with low cost and high performance solutions.

Exhibit Sales and Marketing Promotional Package Representative :
Ms. Ana Li
SEMI Taiwan office
Tel: +886.3.560.1777 ext. 101               
E-mail: ali@semi.org

For more Show Information :
Forum
Ms. Kylie Yeh         
SEMI Taiwan office
Tel: +886.3.560.1777 ext. 503     
E-mail: kyeh@semi.org

Customer Service
Ms. Emily Huang
SEMI Taiwan office
Tel: +886.3.560.1777 ext. 307 
E-mail: ehuang@semi.org