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SEMICON Taiwan 2010
3D IC & Advanced Packaging/Testing Pavilion
Booth+30mins Talk+ Promotion β Only need NT$100,000
According to Yole Development, the shipment of 3D IC wafer will approach 10 million units in by 2012. The strong market demand drives the innovation of 3D technology in packing and testing field. Key assembly and test houses and suppliers, such as ASE, KYEC, SPIL, ChipMos, Aviza and Chroma all participated in the 3D IC Pavilion in 2009. More to come this year!
Features for 3D IC & Advanced Packaging/Testing Pavilion
- Advanced Packaging & Testing Gallery Museum
Featuring texts, graphic, teaching ideas and etc., the showcase provides an in-depth introduction to 3D IC & Advanced Packaging/Testing processes and development.
- 3D IC & Advanced Packaging/Testing Forum
Major industry players will address the latest outlook for the global 3D IC & Advanced Packaging/Testing manufacturing market, technology development, and new applications.
- Innovative Technology Center
The latest 3D IC & Advanced Packaging/Testing applications and technology solutions will be presented. Exhibitors can have a 30 minutes speaking slot for FREE!!
- 3D IC & Advanced Packaging/Testing Exclusive Marketing and Promotion Programs
Dedicated exhibitor visibility and marketing programs to help you stand out from the crowd and attract high-quality buyers, investors, technologists, academics and media attendees.
- Connect with Global and Local Business
3D IC & Advanced Packaging/Testing Pavilion is the ideal platform for overseas solution providers and local suppliers and service companies to connect with business partners.
Benefits of 3D IC & Advanced Packaging/Testing Pavilion
- Value-pricing: total cost less than if items purchased separately β a savings of over NT$85,000
- SEMI Member
>> Raw Space: NT$ 85,000
>> Decorated Space: NT$ 100,000
- Non-Member
>> Raw Space: NT$ 115,000
>> Decorated Space: NT$ 135,000
- Turnkey Exhibition solution for all your needs
- Pre-built hard-wall booth
- Basic furniture: reception counter, bar stool, wastebasket
- Lighting with power and an additional 500w of power
- Special pre-show, onsite and post-show news coverage for 3D IC & Advanced Packaging/Testing Pavilion participants
- Special 3D IC & Advanced Packaging/Testing Pavilion pre-show and onsite promotion
- A complimentary speaking opportunity (30 mins) at Innovative Technology Center to present your latest developments to the industrial audience
Reserve Your Exhibition Space Today!
3D IC & Advanced Packaging/Testing Pavilion Application Form download
Contact:
Ms. Ana Li, SEMI Taiwan
Tel: 886.3.573.3399 ext. 224
Fax: 886.3.573.3355
Email: ali@semi.org
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