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系統級封測國際高峰論壇 2017 - 3D 技術趨勢論壇

 日期:

2017 年 9 月 14 日(星期四)

 時間: 

08:20 - 17:00 (08:20 - 09:00 為報到時間)

 地點:

中信企業總部三樓雅悅會館馥儷廳

 主題:

3DIC, 3D Interconnection 為AI與高階運算架構基礎

 

 論壇主席: 

Dr.  C.P, Hung / 洪志斌, VP Corp R&D, ASE Group / Chairman, SEMI Taiwan PKG&TEST Committee

 論壇主持人: 

Dr.  C.P, Hung / 洪志斌, VP Corp R&D, ASE Group / Chairman, SEMI Taiwan PKG&TEST Committee

  論壇大綱:

 

  2017年系統級封測國際高峰論壇將舉辦嶄新的3D技術趨勢論壇,廣邀前瞻3D技術領域的先驅業者共同探討重要議題,嘗試如何運用可能的解決方案來克服3D範疇目前所面臨的挑戰,並持續推動更高附加價值的3D技術應用,迎向更光明前景。

  先前在2012年成功推出的同質性 2.5D IC FPGA 整合,及後來在2015年的異質性 GPU 與 3D IC HBM 高效運算整合,都是奠基於先進的 3D 技術之基礎元素 :

  1. 矽穿導孔(TSV) 應用於 3D IC, 與 矽中介層(Si-interposer) 應用於 2.5D IC;

  2. 晶圓接合(Bond) 與晶圓分離 (De-bond) 等解決方案

  上述之 3D 架構已成功地實現了高速資料傳輸與高效能運算實績,並將在新世代物聯網之虛擬實境、擴增實境甚至人工智慧等應用中,被賦於扮演日益重要的角色。  因此,產業界已迫不及待地尋求更具成本效益的解決方案以及新技術的多樣精緻化,以繼續擴大3D技術更廣泛之新興應用領域。

 

 

主辦單位:

 

 

 

 

 

 

 

 

贊助單位:

 
   

 

議程表

時間

講題/講者

08:20 - 09:00

 Registration

09:00 - 09:10

 Welcome Remarks by SEMI Executives

 Mr. Tom Salmon, Vice President Collaborative Technology Platforms, SEMI

 Opening Remark: 

 Dr. C.P. Hung / 洪志斌, Vice President, ASE Group/ Chairman, SEMI Taiwan PKG&TEST Committee

09:10 - 09:40

 Keynote1: Leading Foundry Perspective

 Speaker : TSMC

09:40 - 10:10

 Keynote 2: Advanced Packaging, Heterogeneous Integration, and Big Data

 Speaker: Dr. Hamid Azimi, Vice President. Technology and Manufacturing Group Director, Substrate Packaging Technology Development, Intel

10:10 - 10:25

 Break

10:25 - 10:55

 Topic 3: From technology to 3D-IC FPGA, what are needed?

 Speaker: Dr. Xin Wu, Vice President of Silicon Technology, Xilinx

10:55 - 11:25

 Topic 4: Accelerating Digital Transformation with Si Photonics Optical Engine

 Speaker: Mr. Nan Wang, Senior Director, Technology & Quality, Cisco

11:25 - 11:50

 Topic 5: Opportunities and Issues to the Semiconductor Industry in AI Arena

 Speaker: Mr. Ray Yang/ 楊瑞臨, Deputy Program Director, IEK/ITRI

11:50 - 12:15

 Panel Discussion

12:15 - 13:30

 Lunch Break

13:30 - 13:35

 Opening Remark

 Dr.  C.P, Hung / 洪志斌, VP Corp R&D, ASE Group / Chairman, SEMI Taiwan PKG&TEST Committee

13:35 - 14:05

 Topic 6: Challenges and Supply Chain Solutions for Advanced Packaging Technologies

 Speaker: Mr. David R. McCann, Vice President, Worldwide Post Fab Operations & Development, GLOBALFOUNDRIES

14:05 - 14:35

 Topic 7: Advancements in High Density Fan-out and Heterogeneous Integration

 Speaker: Mr. Curtis Zwenger, Vice President, Advanced Package & Technology Integration, Amkor

14:35 - 15:05

 Topic 8: Cost of 3D Packaging : How does FOWLP Stack up?

 Speaker: Mr. Chet Palesko, President, SavanSys Solutions, LLC

15:05 - 15:20

  Break

15:20 - 17:00

 Panel Session & Discussion

 Moderator: Ms. Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science

15:20 - 15:45

 (P-1) New Materials for Fan-out Wafer-Level Packaging 

          Dr. Tony Flaim, CTO, Brewer Science

15:45 - 16:10

 (P-2) Process and equipment technology for advanced wafer level packaging
          Mr. Albert Lan/ 藍章益, Packaging TD, Applied Materials

16:10 - 16:35

 (P-3) 3D Heterogeneous Integration for Advanced SoC and Photonic Devices through Advanced  Wafer Bonding
          Mr. Markus Wimplinger, Corporate Technology Development & IP Director, EVG

16:35 - 17:00

 Panel Discussion

 • Afternoon session speakers

 • Moderator by Ms. Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science

 

 Brewer Science Lucky Draw

 

 SPIL Lucky Draw

17:00

 Adjourment

■ 主辦單位保留議程更改之權利。

■ 論壇演講內容皆以英文為主。

■ 論壇全程禁止錄音/攝錄影。

 

論壇費用 (個人)

早鳥 / 會員價

原價 (8/16 - 現場)

       4000

5000       

(幣別:台幣)

 

團體報名 (7/15-8/15)

3-5 人

6 人以上

3500

3000

(幣別:台幣)

 

       
               
         

 


聯絡人

SEMI Taiwan

羅家宇 小姐

電話: 886.3.560.1777 分機 511

Email: semiprogramtw@gmail.com

 

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