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系統級封測國際高峰論壇 2017- 內嵌與扇出封裝技術論壇

 日期:

2017 年 9 月 15 日(星期五)

 時間:

08:30 – 17:20 (08:30 – 08:50 為報到時間)

 地點:

中信企業總部三樓雅悅會館馥儷廳

 主題:

實現3D-SiP 元件的創新「內埋式基板(Embedded Substracte)」與「扇出型(Fan Out)」技術

論壇主席:

Forum Chairman

Mr. Albert Lan / 藍章益, Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee

 論壇主持人:

Mr. Albert Lan / 藍章益, Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee

Dr. Walter Jau / 趙興華, Senior Technical Director, ASE Corp R&D

 論壇大綱:

 

在 IoT/穿戴式/行動裝置等競爭激烈的市場中,如何把多功能晶片整合到更輕薄短小的外型尺寸中,一直是封裝業者以及設備/材料合作夥伴等整個封裝供應鏈的重大技術挑戰。

•有機層壓基板中的內埋式晶粒

模塑封裝材料(模塑WLCSPFan Out, 尤其是 Panel 面板FO)中的內埋式晶粒

 

在2017年,有機內埋式基板(Embedded Substrate) 與扇出型 (Fan Out) 技術論壇將進一步探討:

I.   最新的IoT/穿戴式/行動應用的研究與市場報告

II.  ICT基礎架構與裝置系統的可能性

III. 創新的封裝解決方案與挑戰

IV. 新材料與設備的就緒度

 

  此論壇將完整呈現內埋式與扇出型技術的整體概況,以及如何在IoT世代中為智慧行動裝置實現更輕薄短小的封裝設計。

 

 

Organizer:

           
               
               
               
               

Sponsor:

   
               
     

 

議程表

時間

講題 & 講師

08:30 - 08:50

  Registration

08:50 - 09:00

 Welcome Remarks by SEMI Executives 

 Mr. Tom Salmon, Vice President, Collaborative Technology Platforms, SEMI

 Opening Remarks & Moderator:

 Mr. Albert Lan / 藍章益, Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee

09:00 - 09:30

 Topic 1: Market Trend I: Markets and Drivers for FO-WLP:  How Far Will it Go?

 Speaker: Ms. E. Jan Vardaman, CEO & Founder, TechSearch

09:30 - 09:55

 Topic 2: Transforming Electronic Interconnect – Breaking through historical boundaries

 Speaker: Mr. Tim Olson, Founder&CTO, Deca Technologies

09:55 - 10:20

 Topic 3: Fine Line Panel Level Fan-Out

 Speaker: Dr. David Fang / 方立志, CTO, Vice President, PTI

10:20 - 10:35

 Break

10:35 - 11:00

 Topic 4: Simulation Studies of Fanout Packages
 Speaker: Dr. Shin-Puu Jeng / 鄭心圃, Director, TSMC

11:00 - 11:25

 Topic 5:  Challenges with next gen packages
 Speaker: Dr. Isaac Ow, Key Product Unit Head, Applied Materials

11:25 - 11:50

 Topic 6: Fan Out – Simple to Complex
 Speaker: Dr. John Hunt, Senior Director, ASE

11:50 - 12:15

 Topic 7: Advanced Packaging Inflection – Technology Trends and Growth Opportunities

 Speaker: Mr. Manish Ranjan, Managing Director for Advanced Packaging Business Unit, Lam Research

12:15 - 13:15

 Lunch Break

13:15 - 13:20

  Opening Remarks & Moderator

  Dr. Walter Jau / 趙興華, Senior Technical Director, Corp R&D, ASE

13:20 -  13:45

 Topic 8: Market Trend – II: Fan-out Packaging Technologies and Markets

 Speaker: Mr. Jérôme AZEMAR, Senior Market and Technology Analyst, Yole Développement

13:45 - 14:10

 Topic 9: Panel System ECD Technology --- Wafer to Panel

 Speaker: Dr. Zhen Liu, Director of Process Engineering, TEL NEXX

14:10 - 14:35

 Topic 10: Proposal for Adopting Thermoset Resin to Enable 『Joint Protection Flux & Paste』 Overcome Fine Pitch, Low Temperature Assembly Issues Plus Reliability Reinforcement

 Speaker: Mr. Lewis Huang / 黃智堯, Vice President , Senju Eletronic

14:35 - 15:00

 Topic 11 Reliability of Ultra-fine Line Multi-Redistribution Layers Enabled by Excimer Laser Dual Damascene Process for Wafer and Panel Level Packaging

 Speaker: Dr. Habib Hichri, Applications Engineering Director, SUSS

 

 SUSS Lucky Draw

15:00 - 15:15

 Break

15:15 - 15:40

 Topic 12: Adopting Component Embedding In High Power Density Power Modules
 Speaker: Mr. Risto Tuominen, Consultant, GE

15:40 - 16:05

 Topic 13: UBM/RDL PVD for FOWLP Applications beyond Mobile Communications

 Speaker: Mr. Nick Knight, PVD Product Manager, SPTS Technologies Ltd

16:05 - 16:30

 Topic 14: Encapsulation Challenges and Solution Large Format Packaging 

 Speaker: Dr. Eric Kuah, Vice President, ASM

16:30 - 16:55

 Topic 15: Additive impact on Cu properties for Fan-out Wafer Level Packaging applications

 Speaker: Dr. Dirk Rohde, R&D Manager, Atotech

16:55 - 17:20

 Topic 16:  Towards Industrialization of Fan-out Panel Level Packaging

 Speaker: Dr. Tanja Braun, Group Manager, Fraunhofer IZM

 

 SPIL Lucky Draw

 

 會議結束

 

■ Programs are subject to change without prior notice. 

■ All presentations will be conducted in English. 

■ No recording/photography during the seminar.

 

論壇費用

早鳥 / 會員價

原價 (8/16 - 現場)

       4000

5000       

(幣別:台幣)

 

團體報名 (7/15 - 8/15)

3-5 人

6 人以上

3500

3000

(幣別:台幣)

 

   
           
   

       

聯絡人

SEMI Taiwan

羅家宇 小姐

電話: 886.3.560.1777 分機 511

Email: semiprogramtw@gmail.com

 

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