Dr. Tolga Tekin



Dr. Tolga Tekin


Group Manager Photonic & Plasmonic Systems


System Integration and Interconnection Technologies, Fraunhofer Institute for Reliability and Microintegration (IZM)


  • Ph.D. Electrical Engineering Technical University of Berlin, Germany



  • Group Manager Fraunhofer IZM

  • Chief Engineer TU Berlin

  • Scientist Teles AG

  • Postdoc UC Davis

  • Scientist Fraunhofer HHI




Tolga Tekin received the Ph.D. degree in electrical engineering and computer science from the Technical University of Berlin, Berlin, Germany, in 2004. He was a Research Scientist with the Optical Signal Processing Department, Fraunhofer HHI, where he was engaged in advanced research on optical signal processing, 3R-regeneration, all-optical switching, clock recovery, and integrated optics. He was a Postdoctoral Researcher on components for O-CDMA and terabit routers with the University of California. He worked at Teles AG on phased-array antennas and their components for skyDSL. At the Fraunhofer Institute for Reliability and Microintegration (IZM), he then led projects on optical interconnects and silicon photonics packaging. He is currently with the Technical University of Berlin, where he is engaged in microsystems, photonic integrated system-in-package, photonic interconnects, and 3-D heterogeneous integration research activities. He is group manager of Photonics and Plasmonics Systems at Fraunhofer IZM. He is coordinator of European flagship project 'PhoxTroT' on optical interconnects for data centers. He is Senior Member of IEEE and co-chair of 'Photonics - Communication, Sensing, Lighting' Technical Committee in the IEEE Components, Packaging and Manufacturing Technology Society.


 Speech Abstract:

 2.5D/3DIC with Si Photonics

In order to obtain future high-performance microelectronic systems, including SiP, the lack of off-chip interconnects with following aspects will define the bottleneck due to the CMOS scalability limitations and rapidly increasing demands of future applications 1) low latency; 2) high bandwidth; 3) high density. In terms of 3-D silicon photonics heterogeneous integration current objectives are dictated by converging technologies and 3-D integration. Under such a consideration the system and application requirements should be redefined. New materials and process models required for on-chip/off-chip optoelectronic elements, coupling between electrical and optical systems, optical interconnect models, and even semiconductor laser modeling.

New methodologies are necessary to enable next steps of packaging and system integration covering 3-D heterogeneous integration and SiP aspects. Advanced packaging technologies will impact future systems.

The achievements will be discussed in the case of optical interconnects for data centers, one of the challenging applications.


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