Min Yoo is currently as Vice President of Product & Technology Development Team at Amkor Technology Taiwan. He has been Sr. Researcher of Amkor Technology Korea since 1996. At Amkor Technology Korea, he has showed technology leadership to success in implementing cu pillar bumping as well advanced Assembly technology into fine pitch flip chip package. These experiences have fanned out to development of TSV core technology for fine pitch interconnection and advanced fan out technology in Amkor R&D Center.
Mr. Yoo has owned several US patents on electronic packaging and activities in World Wide TSV forum, including
–Co-Arthur, Next Generation Cu Pillar Technology, ECTC 2011
–Co-Arthur, Key Elements of 3D Packaging using TSV Technology, International 3D SIC 2008 Tokyo
–Co-Arthur, Review of Interconnection Process for TSV 3D Integrated Packages, UKC 2008