Mr. Markus Wimplinger



Mr. Markus Wimplinger

Corporate Technology Dev. & IP Director

EV Group


  • Electrical Engineering from HTL Braunau, Austria



  • Corporate Tech. Dev. & IP Director (06 – present), EV Group

  • Director Technology North America (03 – 06), EV Group

  • Project Manager (01-03), EV Group

  • Project Manager (01-03), EV Group

  • Author of several papers




  • Markus Wimplinger is the Corporate Technology Development and IP Director at EVG. In this role, Markus oversees EV Group’s global Process Engineering team. His further responsibilities include the management of R&D partnerships and contracts with 3rd party organizations such as companies or government related entities, as well as Intellectual Property affairs associated with EVG’s process technology development efforts.

  • Markus received his educational background in Electrical Engineering from HTL Braunau, Austria. He started with EV Group as a project manager at the company’s headquarters in Austria in 2001 with focus on customer projects.

  • In 2002, Mr. Wimplinger transitioned to EV Group North America in Tempe, Arizona, USA, where he served as the Director Technology North America till August 2006. Mr. Wimplinger’s past work includes involvement in design, development, process technology and many other aspects of capital equipment production at both EV Group and at his former job with a capital equipment supplier for non-semiconductor related industries.




  • High volume aligned wafer bonding processes typically separates the wafer to wafer alignment process from the wafer bonding process and this wafer to wafer alignment is normally done in an ambient atmosphere.  While this process flow has worked well and enabled the proliferation of MEMS devices in the last decade, it does have limitations.  The primary issue is the exposure to water vapor and ambient atmosphere which limits the preprocessing that can be done and maintained on the wafers to be bonded. Performing the wafer to wafer alignment, handling, and wafer bonding in a high vacuum environment allow specialized preprocessing of the wafers prior to alignment and bonding.

  • The most basic preprocessing enabled by this high vacuum environment is the open face dehydration bake of wafers prior to alignment to alignment and bonding.  When done in a cluster tool, a chamber can be dedicated to baking out the wafers to minimizing the effect of outgassing on the final vacuum level in the MEMS device.  If one wafer needs a high temperature bakeout and getter activation and one wafer is limited to a low temperature bakeout this is possible  by using two chamber in the cluster tool – one for the high temperature backout and one for the low temperature bakeout.  Several companies are working on Microbolometers for automotive applications for night vision and safety.  Microbolometers that use vanadium oxide as the sensor layer are an example of a device needing high and low temperature bakeout.

  • Another preprocessing enabled by the high vacuum cluster tool is a surface treatment which removes oxides from the surface, increases the surface energy, and enables the formation of covalent bonds at room temperature in the case of Si-Si bonding.

  • This low temperature covalent bond has been shown to have an oxide free  interface with a minimized amorphous layer as well as very low metal contamination.  Also, because the bonding is done at or near room temperature it is possible to heterogeneously integrate materials  by wafer  bonding event though they may have substantially different CTES such a GaN to SiC.  This enables the manufacture of engineered compound semiconductor substrates.

  • This new technology will enable improved vacuum encapsulation as well as the manufacture of new, high performance engineered substrates.

  • The latest process results as well as process flows and required equipment capabilities will be presented.





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