Dr. Ravi Kanjolia



Dr. Ravi Kanjolia

Chief Technology Officer, Head of R&D



  • Ph.D. In Chemistry


  • Chief Technology Officer, Deposition Material EMD-PMI (Merck KGAA), Haverhill, MA, 2015-Present

  • Chief Technology Officer, SAFC Hitech, Sigma Aldrich, Haverhill, MA, 2007-2015

  • Over 70 Journal Articles, Reviews, Book Chapters, and Patents



  • Dr. Ravi Kanjolia, Chief Technology Officer and Head of R&D Deposition Materials, Merck Performance Materials, is responsible for linking the company’s expertise in electronics materials, chemistry and delivery systems to applications across the microelectronics industries, as well as maintaining a steady product pipeline for the future. He is also directly responsible for the worldwide R&D of Deposition Materials Business and its external academic collaborations.
  • Dr. Kanjolia’s primary research interest is in the field of ALD/CVD precursors for silicon semiconductors for the fabrication of advanced semiconductor devices. Prior to Merck Performance Materials, Dr. Kanjolia rose through a series of research and managerial positions at SAFC Hitech (formerly Epichem) and Morton Metalorganics (more recently Dow) from 1987-2015. From 1984-87, he served as an Assistant Professor at the University of Alabama at Birmingham (UAB).

  • Dr. Kanjolia is a member of American Chemical Society since 1982 and holds a Ph.D. in Chemistry. Dr. Kanjolia has over 70 refereed scientific journal articles, review and patents. Currently, he serves on the Technical committee of ALD Conference (AVS) and Strategic Materials Committee of SEMI.




  • Over the last decade material innovation has taken central stage for advanced semiconductor fabrication processes to drive device performance. This trend is expected to continue to advance the adoption of novel materials and processes. The material development process for the advanced devices and architectures is a complex time consuming process. The Concept and Feasibility (C&F) process begins 3+ years in advance of the Fab process development/integration processes and cycles of learning have to be rapid. Collaborations amongst the value chain offers mutual benefits to all partners. At each stage of development, i.e. from C&F to development/ramp up to commercialization, specific partnerships have to be established. While the academic collaborations strengthen the in house R&D, the OEM/IDM collaborations help in the film properties/application/integration/CoO requirements. The semiconductor ecosystem has a good history of such collaborations and believes that the material development is more expedient and robust via these partnerships. Collaborations between the materials and equipment suppliers with IDM’s are expected to result in to improved and environmentally sustainable fab processes through the Materials/Equipment co-optimization.   In this talk, we would discuss the benefits and challenges of such collaborations. Specific examples would be presented to highlight the risks and rewards and challenges pertaining to the intellectual property and commercialization would be discussed.





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