Daniel Bock




Daniel Bock

Senior Application Engineer








  • New applications using Radio Frequency (RF) chips are driving the total number of RF lines to numbers not seen in previous generations. Historically, RF devices typically had one or two lines for transmit and a similar number for receiving. Because of the higher data rate requirements and higher operating frequencies, new applications with phased antenna arrays, such as 5G applications or SW defined radios, have pushed the number of lines up into the 20’s or 30’s for a single device. Add the ongoing push for more parallelism in testing and engineers will soon be grappling to support probe cards with well over 100 RF lines. This session will consider the market drivers that are behind this trend, including the new requirements that it places on testing and the potential solutions available to enable this next generation of RF devices discussing channel count, isolation and RF calibration considerations.





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