Ms. E. Jan Vardaman



Ms. E. Jan Vardaman

President and Founder

TechSearch International, Inc.




  • Founded TechSearch International in 1987 providing analysis on technology and market trends in semiconductor packaging and materials

  • Served on the corporate staff of Microelectronics and Computer Technology Corp. (1984-87)

  • Co-author of How to Make IC Packages, published by Nikkan Kogyo Shinbunsha

  • Columnist with Printed Circuit Design & FAB/Circuits Assembly Magazine




E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided licensing and consulting services in semiconductor packaging since 1987.  She is the co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly.  She is a member of IEEE CPMT, SMTA, MEPTEC, IMAPS and SEMI.  She was elected to two terms on the IEEE CPMT Board of Governors and is a CPMT Distinguished Lecturer.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.  She has made numerous presentations on developments in advanced packaging.




The semiconductor industry packaging and assembly industry is maturing and companies face many challenges.  This presentation looks at packaging and assembly trends, new business models, and challenges as the market matures.  Drivers for growth in future markets and how they impact packaging and assembly choices are addressed. 





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