Dr. Habib Hichri



Dr. Habib Hichri

Applications Engineering Director

SUSS MicroTec Photonic Systems, Inc.


  • Ph.D. Chemical Engineering, Univ. of Claude Bernard, Lyon, France


  • Applications Engineering Director, SUSS MicroTec

  • Senior Manager Foundry Operation Engineering, JDSU

  • Front End Of Line Patterning Development Manager, IBM



  • Habib Hichri joined SUSS MicroTec on October 2013 as Engineering Applications Director in Corona CA, USA. Before joining SUSS MicroTec, Habib spent about 12 years with IBM Semiconductors Research and Development Center in East Fishkil, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to a management position within IBM on process development in lithography and Dry Reactive Ion Etch in the front end of line area for microprocessor fabrication. Habib holds over 40 U.S. patents and authored over 25 publications and presentations. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France and an MBA degree from the State University of New York at Buffalo.




  • Fan out wafer level packaging (FOWLP) continues to be the main driver for advanced packaging. Multi-chip integrated Fan-Out packages and high I/O CSPs demands for higher routing density on wafer level. However, there is a continuing need for low cost packaging. While traditional organic flip-chip substrates using semi-additive processes (SAP) have not been able to scale to ultra-fine RDL pitches and via opening below 10um, photo-sensitive spin-on dielectrics and RDL processes used for wafer level packaging do not sufficiently address the cost reduction need. This paper presents the latest results from innovative package and cost effective RDL and micro via processes using excimer laser ablation, to meet the market’s most stringent requirements. 

  • This paper presents a new excimer laser dual damascene process for ultra-fine routing for BEOL. FujiFilm polyimide material FCPi 2100 was structured using an excimer laser stepper with a reticle mask to pattern feature size below 4 um with a high throughput. Micro-vias with a diameter below 5 um are realized with high aspect ratio which overcomes the photolithographic limitations of the common used photosensitive thin-film polymers. The laser structuring provides access to innovative dielectric materials for WLP and PLP with optimized mechanical and electrical parameters.

  • In this paper, we propose new pattering process that uses excimer laser ablation to integrate via and RDL traces in one patterning process step, followed by seed layer deposition and plating steps. We will present reliability data of via and RDL traces patterned by Excimer laser in non photo materials. The commercial benefits of the new laser based patterning process as compared to the current process of record (POR) will be highlighted.





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