Dr. Eric Kuah



Dr. Eric Kuah

Vice President of Technology


ASM Technology Singapore Pte Ltd


  • DBA University of New Castle


  • 23 years of working experience the semiconductor industries namely encapsulation and advance packaging development

  • Published more than 20 papers

  • Holder more than 20 US patent



  • The presentation will be focused on the challenges and solutions that a packaging/equipment engineer will face during the encapsulation process for large format packaging (LFP). Technical solutions will be discussed are material selections, placement strategies, encapsulation tool design, encapsulant selection, warpage control, voiding, and moldability solutions. The package formats of our work are carried either on  8” and/or 12” wafer (glass and/or silicon) and a quad panel of 340 mm by 340mm.





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