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Dr. Tanja Braun

 

 

Dr. Tanja Braun

Group Manager

System Integration and Interconnection Technologies (SIIT)

Fraunhofer IZM

 Education:

  • Dr.-Ing., Technical University Berlin

 Experiences:

  • Leading Fan-out Panel Level Packing Consortium at Fraunhofer IZM in Berlin

  • Group Manager “Assembly and Encapsulation Technologies”

 Biography:

 

  • Tanja Braun studied mechanical engineering at Technical University of Berlin and joined Fraunhofer IZM in 1999. Since 2000 she is working with the group Assembly & Encapsulation Technologies and since 2016 she is heading this group. In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins. Tanja Braun is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin. 

 

 Abstract:

 

  • Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. The technology has a high potential in significant package miniaturization concerning package volume but also in thickness and heterogeneous integration. Manufacturing is currently done on wafer level up to 12”/300 mm and 330 mm respectively. For higher productivity and therewith lower costs larger form factors are forecasted for the near future. Instead of following the wafer level approach to 450 mm, panel level packaging will be the next big step. Sizes for the panel could range up to 18”x24” or even larger influenced by different technologies coming from e.g. printed circuit board, solar or LCD manufacturing. However, an easy upscaling of technology when moving from wafer to panel level is not possible. Materials, equipment and processes have to be further developed or at least adapted. An overview of state of technology for panel level packaging will be presented and discussed in detailed and an outlook towards industrialization given.

 

 

 

 

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