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Dr. Hamid R. Azimi

 

 

Dr. Hamid R. Azimi

Vice President

Technology and Manufacturing Group Director

Substrate Packaging Technology Development

Intel

 Education:

  • Ph.D. in materials science and engineering from Lehigh University in Bethlehem, Penn.

 Experiences:

  • Dr. Azimi  joined Intel in 1995 as a senior packaging engineer, Azimi has focused on substrate packaging and assembly material technology development.

  • His contributions include leading Intel’s FCxGA substrate eand assembly materials development effort through significant changes over the course of a decade to meet aggressive design rules and stringent material requirements. 

  • Dr. Azimi and his team successfully developed a world—class internal substrate development capability, essentially from the ground up, in 3 years in support of Intel’s substrate strategy.

 Biography:

 

  • Hamid R. Azimi is vice president in the Technology and Manufacturing Group and director of Substrate Packaging Technology Development at Intel Corporation. He is responsible for substrate path-finding, technology development and initial ramp-up for Intel logic products across all substrate suppliers’ factories, as well as the company’s CH1 and CH8 substrate R&D factories in Arizona.

  • Since joining Intel in 1995 as a senior packaging engineer, Azimi has focused on substrate packaging and assembly material technology development by working with suppliers around the globe. His contributions include leading Intel’s FCxGA substrate and assembly materials development efforts through significant changes over the course of a decade to meet aggressive design rules and stringent material requirements. More recently, Azimi and his team successfully developed a world-class internal substrate development capability, essentially from the ground up, in 3 years in support of Intel's substrate strategy.

  • A recognized expert in the substrate industry, Azimi holds more than a dozen patents related to substrate packaging materials, design and architecture, with additional patents pending. He has also published several papers and has given invited talks at international conferences. He and his team have won multiple Intel Achievement Awards, including one for leading the C4 package transition from costly OLGA to FCxGA packaging and one for enabling first-generation halogen-free and lead-free flip chip substrate.

  • Azimi received his bachelor’s degree in metallurgical engineering from Sharif University of Technology in Tehran, Iran, and his master's degree and Ph.D. in materials science and engineering from Lehigh University in Bethlehem, Penn.

 

 Abstract:

 

  • The world around us is becoming more and more dependent on data. As Clive Humby, UK Mathematician, put it “data is the new oil; if unrefined it cannot really be used”.  Processing big data efficiently is heavily dependent on advances in system compute and comms.   This presentation will talk about the requirements for advancing system performance including high bandwidth and low power data pipes; and the methods by which ultra-high performance for next generation devices can be achieved through heterogeneous integration on advanced packages.  A multitude of multi-chip packaging including 2D, 2.5D, and 3D will be reviewed; and finally the direction for heterogeneous packaging in the future and its challenges will be discussed.

 

 

 

 

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