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王偉/ Dr. Daivd W. Wang

 

 

王偉 / Dr. David W. Wang

副總經理 / Vice President

南茂科技 / ChipMOS TECHNOLOGIES

 Education:

  • Ph.D., M.S. The University of Michigan

  • B.S., Fu Jen University

 Experiences:

  • Manager/Senior Engineer, IBM Microelectronics

  • Senior Director, Lam Research

  • Vice President, Fibera, Inc. 

 Biography:

 

  • Dr. David W. Wang joined ChipMOS in 2007 as Vice President, Research and Strategy Development Center, ChipMOS TECHNOLOGIES, INC. one of the leading back-end assembly and test service providers for advanced memories, display driver semiconductors, and mixed-signal products.

  • He is a member of SEMI Taiwan Packaging & Test Committee

  • Prior to ChipMOS, he was Vice President of Fibera, Inc. a Silicon Valley startup.  He served as Senior Director at Lam Research where his responsibilities included 300mm new product introduction, field escalation and management of regional teams.  David also worked for IBM’s Microelectronics Division for 13 years. He as Senior Engineer / Manager led advanced packaging materials/process development and marketing organizations facilities located in Endicott and East Fishkill, New York .

  • He was Chairman of the Board and President of Chinese American Semiconductor Professional Association (CASPA) from 2003 to 2004 and presently is a member of International Advisors.  David received his Ph.D. / M.S. from the University of Michigan and B.S. from Fu Jen University.  He holds 53 U.S. patents.

 

 

 

 

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