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Mr. Tim Olson

 

 

Mr. Tim Olson

Founder & CTO

Deca Technologies

 Education:

  • BSME & BSEM

 Experiences:

  • Created Deca Technologies in 2009 as an advanced interconnect foundry inspired by SunPower solar methods

  • Raised $200M+ venture funding to establish Deca as a technology leader in wafer level & fan-out packaging

  • Led global R&D at Amkor as SVP introducing fine pitch Cu pillar, PoP TMV™ & FusionQuad™ 2003 to 2009

  • Established strip testing methodology as VP of Fico Systems Integration and EVP of MCT 1997 to 2003

  • Created PRISM in Motorola introducing 2D code tracking & traceability within semiconductors  1988 to 1997

  • Over 30 issued & pending patents

 Abstract:

 

  • Three distinct industries now converging (wafer foundries, OSATs & EMS)

  • Fan-out technology is the key enabler

  • Removing the barriers (capital cost, yield & reliability) are key to fan-out growth

  • Major inflection point in the industry – precedents include SMT in the 80’s and flip chip in the 90’s

  • It’s different this time; fan-out technology is not just for packaging.  It reaches back into the wafer fab to enable future SoC and stretches forward to create advanced SiPs

 

 

 

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