+886.3.560.1777

Chinese

Ms. Cindy Lee

Ms. Cindy Lee

 

Technology Development & IP Manager Taiwan

億合科技股份有限公司

EVG - Jointech Corp.

演講日期時間

Date & Time

 2017年 9月 15日 13:40 - 14:10

 13:40 - 14:10 September 15, 2017 

演講地點

Venue

 台北南港展覽館4樓#1000

 #1000, 4F, TWTC Nangang Exhibition Hall

演講題目

Topics

 

 Recent Advances in Hybrid Bonding Technology for High Volume 3D IC Manufacturing

 

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