Ms. E. Jan Vardaman



Ms. E. Jan Vardaman

President and Founder

TechSearch International, Inc.




  • Founded TechSearch International in 1987 providing analysis on technology and market trends in semiconductor packaging and materials

  • Served on the corporate staff of Microelectronics and Computer Technology Corp. (1984-87)

  • Co-author of How to Make IC Packages, published by Nikkan Kogyo Shinbunsha

  • Columnist with Printed Circuit Design & FAB/Circuits Assembly Magazine




E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided licensing and consulting services in semiconductor packaging since 1987.  She is the co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly.  She is a member of IEEE CPMT, SMTA, MEPTEC, IMAPS and SEMI.  She was elected to two terms on the IEEE CPMT Board of Governors and is a CPMT Distinguished Lecturer.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.  She has made numerous presentations on developments in advanced packaging.




A variety of applications have created demand for fan-out wafer level packages (FO-WLPs).  These applications include mobile phones, networking systems, and automotive applications. What is the future for FO-WLP?  What are the continue drivers for the adoption and which formats are expected to be most common?  With any package, there is always a push to lower the cost.  This presentation the potential options for lowering the cost of the package with panel processing from both technical and economic perspectives.





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